JPH0483397A - Electronic component mounting equipment and electronic component mounting method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, and in particular to a device for observing electronic components sucked by a nozzle of a transfer head using a camera and detecting their positional deviation. Regarding the means of

(Prior Art) An electronic component mounting device that mounts electronic components such as IC chips, LSI chips, resistor chips, and capacitor chips on a board is used to mount electronic components from an electronic component supply section such as a tray or tape feeder to a transfer head. The electronic component is attracted to the nozzle, and then the positional shift of the electronic component in the XYθ directions is observed and corrected, and then mounted on the board positioned in the positioning section.

Conventionally, as a means for observing electronic components, as shown in FIG. 3 (plan view), an electronic component supply section 10 such as a tray is used.
1 and the positioning part 103 of the board 102, the electronic component P
A device equipped with a positional deviation observation stage 104 is known.

To explain the operation, first, the sub transfer head 105 transfers the electronic component P of the electronic component supply section 101 to the observation stage 104.
The CCD installed on this observation stage 104
The camera 106 detects a positional shift of the electronic component P in the xyθ directions.

Next, the nozzle 108 of the transfer head 107 picks up the electronic component P. The positional deviation of the electronic component P in the XY direction is caused by the XY direction stroke of the transfer head 107.
This is corrected by adding a correction value based on the positional deviation in the Y direction, and the positional deviation in the θ direction is corrected by moving the nozzle 108 in the θ direction (centered on the axis of the nozzle 10B) by a motor 109 installed in the transfer head 107. Correct by rotating in the rotation direction).

(Problem to be Solved by the Invention) However, in the above conventional means, the electronic component P is once placed on the observation stage 104 by the sub-transfer head 105, and then observed by the camera 106.
07 and must be transferred to the board 102, the operation and mechanism are complicated, and the time required for observation becomes loss time, which hinders the improvement of mounting efficiency.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting apparatus that eliminates the loss time required for observing electronic components with a camera and can transfer and mount electronic components onto a board at high speed.

(Means for Solving the Problems) The present invention includes an electronic component supply section, a board positioning section, and an electronic component supply section that moves between the electronic component supply section and the board to place the electronic components on the board. In an electronic component mounting apparatus equipped with a transfer head for transferring and mounting, the transfer head includes a nozzle for sucking electronic components, and a camera located above the nozzle for observing the electronic components sucked by the nozzle. and a light source that irradiates illumination light toward the electronic components sucked by the nozzle, and between the electronic component supply section and the substrate positioning section, the illumination light irradiated from the light source is directed to the nozzle. A light diffuser is provided to diffusely reflect light toward the electronic components that are attracted.

(Function) According to the above configuration, while the transfer head picks up the electronic component in the electronic component supply section and transfers it to the substrate in the positioning section, the light emitted from the light source is diffusely reflected by the light diffuser. Therefore, the silhouette of the electronic component attracted to the nozzle can be clearly observed with a camera, and its positional shift can be detected.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus.

1 is a positioning part for the board 2, 3.4 is a table provided on both sides of this positioning part 1, and a tray 5 and a parts feeder 6 as an electronic component supply part are arranged on the top surface of the table. .

Reference numeral 7.8 is an XY child table on which the transfer head 1 is held. By driving this XY table 7°8, the transfer head 11 is moved to the tray 5 and the parts feeder 6.
and the board 2, and the tray 5 and the parts feeder 6.
electronic components P are transferred and mounted on the board 2.

In FIG. 2, the transfer head 11 includes a main body 12, a camera 13 mounted on the upper part of the main body 12, a nozzle 14 protruding from the main body 12, and a ring-shaped light source 1.
It is equipped with 5.

The main body 12 is made of a light transmitting material such as glass or transparent resin, and allows the electronic component P attracted to the tip of the nozzle 14 to be observed. Also, the positioning part 1
Between the tray 5 and the parts feeder 60, plate-shaped light diffusers 16 and 17 are arranged. This light diffuser 16
．． 17 diffuses and reflects the light emitted from the light source 15 toward the electronic component P adsorbed by the nozzle I4.

This device has the above-mentioned configuration, and its operation will be explained next.

By driving the XY table 7.8, the transfer head 11 arrives on the tray 5, picks up the electronic component P to the nozzle 14, and ticks it up.

Next, the transfer head 11 transfers and mounts the electronic component P on the substrate 2, but during this process, the light source 15 is turned on when passing over the light diffuser 16. Then, the irradiated light is diffusely reflected upward by the light diffuser 16, so that the silhouette of the electronic component P attracted to the nozzle 14 is
X of the electronic component P observed by the camera 13 as a still image
A positional shift in the Yθ direction is detected.

Next, the positional deviation in the X and Y directions is determined using the XY table 7.8
It is corrected by adjusting the movement stroke of θ
The electronic component P is mounted on the board 2 after correcting the directional positional deviation by rotating the nozzle 14 by θ around its axis.

When transferring and mounting the electronic components P of the parts feeder 6 onto the board 2, the light is reflected by the light diffuser 17 and the electronic components P adsorbed by the nozzle 14 are observed by the camera 13, as in the above case. . In this way, according to the present means, it is possible to detect the positional deviation of the electronic component P while it is being transferred to the board 2, thereby eliminating loss time for observation.
Electronic components P can be mounted on the board 2 at high speed.

The present invention is not limited to the above-mentioned embodiments. For example, the light source may be one that is lit all the time, or a pulsed light source such as a strobe, and the electronic component P passes over the light diffuser 16.17. At this time, the light source may be turned on momentarily and the electronic component P may be observed using the camera 13.

(Effects of the Invention) As explained above, the present invention includes an electronic component supply section, a substrate positioning section, and a movement between the electronic component supply section and the substrate to transfer the electronic components of the electronic component supply section to the substrate. In an electronic component mounting apparatus equipped with a transfer head for transferring and mounting an electronic component, the transfer head includes a nozzle for adsorbing an electronic component and a nozzle located above the nozzle for observing the electronic component adsorbed by the nozzle. a camera and a light source that irradiates illumination light toward the electronic components sucked by the nozzle; Since a light diffuser is provided that diffuses and reflects light toward the electronic components that are attracted to the nozzle, the electronic components are attracted to the nozzle and transferred to the board by the transfer head, while the electronic components are mounted on the transfer head. Since it can be observed as a still image using a camera, there is no loss time required for observing electronic components, and electronic components can be transferred and mounted on a board at high speed.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a side view, and FIG. 3 is a plan view of a conventional means. 1... Positioning unit 2... Board 6... Electronic component supply unit 1... Transfer head 3... Camera 4... Nozzle 5... Light source 6. 17... Light diffuser

Claims (1)

[Claims] An electronic component supply section, a substrate positioning section, and a transfer head that moves between the electronic component supply section and the substrate and transfers and mounts the electronic components of the electronic component supply section onto the substrate. In the electronic component mounting apparatus, the transfer head includes a nozzle for sucking electronic components, a camera located above the nozzle for observing the electronic components sucked by the nozzle, and a camera for observing the electronic components sucked by the nozzle. A light source for emitting illumination light toward electronic components is provided, and the illumination light emitted from the light source is directed to the electronic components adsorbed by the nozzle between the electronic component supply section and the substrate positioning section. An electronic component mounting apparatus characterized by being provided with a light diffuser that diffuses and reflects light.