JPH0483400A - Board observing device - Google Patents
Board observing deviceInfo
- Publication number
- JPH0483400A JPH0483400A JP2197309A JP19730990A JPH0483400A JP H0483400 A JPH0483400 A JP H0483400A JP 2197309 A JP2197309 A JP 2197309A JP 19730990 A JP19730990 A JP 19730990A JP H0483400 A JPH0483400 A JP H0483400A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light source
- mark
- camera
- reflected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は基板の観察装置に関し、詳しくは、基板認識マ
ーク、半田ランド、回路パターンのような基板上の被測
定物を明瞭に観察するための装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a board observation device, and more specifically, for clearly observing objects to be measured on a board such as board recognition marks, solder lands, and circuit patterns. Regarding the device.
（従来の技術）
電子部品が実装される基板には、基板の位置ずれ観察の
基準点となる基板認識マークや、電子部品を実装する為
の半田ランド、回路パターンなどが形成されており、基
板に電子部品を実装する際には、これらのマークや半田
ランド等をカメラにより観察することが行われる。(Prior art) A board on which electronic components are mounted has a board recognition mark that serves as a reference point for observing the positional deviation of the board, solder lands for mounting electronic components, circuit patterns, etc. When mounting electronic components on a device, these marks, solder lands, etc. are observed using a camera.
第３図は従来の観察装置を示すものであって、１００は
カメラであり、その下部には、リング状の光源部１０１
が装着されている。１０２は基板であり、その上面には
、基板認識マーク１０３が形成されている。光源部１０
１から照射された光は、マーク１０３の上面に反射され
、その反射光をカメラ１００により観察し、その画像か
ら、基板の位置ずれを算出する。FIG. 3 shows a conventional observation device, in which 100 is a camera, and a ring-shaped light source section 101 is located at the bottom of the camera.
is installed. 102 is a substrate, and a substrate recognition mark 103 is formed on the upper surface thereof. Light source section 10
The light emitted from the mark 103 is reflected by the upper surface of the mark 103, the reflected light is observed by the camera 100, and the positional deviation of the substrate is calculated from the image.
（発明が解決しようとする課題）
マーク１０３が、半田メツキなどにより形成されている
場合、その表面は粗面であることから、このマーク１０
３に照射された光のうちのかなりの部分ａは、カメラ１
００へ向って反射され、明瞭に観察できる。ところが、
マーク１０３が金メツキなどの光沢のある材料から成る
場合、マーク１０３に入射した光すは、斜上方に反射さ
れてカメラ１００には殆ど入射しないことから、マーク
１０３を明瞭に観察できない問題があった。(Problem to be Solved by the Invention) When the mark 103 is formed by solder plating or the like, the surface thereof is rough.
A considerable portion a of the light irradiated onto camera 1
It is reflected towards 00 and can be clearly observed. However,
When the mark 103 is made of a shiny material such as gold plating, the light incident on the mark 103 is reflected diagonally upward and almost never enters the camera 100, so there is a problem that the mark 103 cannot be observed clearly. Ta.
したがって本発明は、様々な材料から成る基板上の被測
定物を、明瞭に観察することができる基板の観察装置を
提供することを目的とする。Therefore, an object of the present invention is to provide a substrate observation device that can clearly observe objects to be measured on substrates made of various materials.
（課題を解決するための手段）
本発明は、基板上の被測定物を上方から観察するカメラ
と、この被測定物へ向って上方から垂直に照明光を照射
する第１の光源と、第２の光源と基板の間にあって、こ
の第２の光源から照射された照明光を内方へ反射させて
、上記被測定物に斜上方から照射する筒状の光反射体と
から基板の観察装置を構成している。(Means for Solving the Problems) The present invention includes a camera that observes an object to be measured on a substrate from above, a first light source that vertically irradiates illumination light toward the object from above, and A cylindrical light reflector that is located between the second light source and the substrate, and reflects the illumination light emitted from the second light source inward and irradiates the object to be measured from obliquely above. It consists of
（作用）
上記構成において、被測定物が例えば半田メツキにより
形成された基板認識マークのような粗面を有するもので
ある場合、第２の光源から照射された照明光は、光反射
体により内方に反射されて、斜上方からこの被測定物に
入射し、その反射光がカメラに入射することにより、カ
メラに明瞭に観察される。(Function) In the above configuration, if the object to be measured has a rough surface such as a board recognition mark formed by soldering, the illumination light emitted from the second light source is internally reflected by the light reflector. The reflected light enters the object to be measured from diagonally above, and the reflected light enters the camera and is clearly observed by the camera.
また被測定物が、例えば金メツキにより形成された基板
認識マークのような光沢面を有するものである場合、上
方の第１の光源から垂直に照射された光が、この被被測
定物に入射して垂直に反射されることから、この被測定
物も明瞭に観察できる。Furthermore, if the object to be measured has a glossy surface, such as a board recognition mark formed by gold plating, the light irradiated perpendicularly from the first light source above is incident on the object to be measured. Since the object to be measured is reflected vertically, the object to be measured can also be clearly observed.
（実施例１） 次に、図面を参照しながら本発明の詳細な説明する。(Example 1) Next, the present invention will be described in detail with reference to the drawings.
第１図において、１はカメラ、２は鏡筒であり、鏡筒２
の下には、円筒状の光反射体３が装着されている。この
光反射体３は、その上部の内径よりも、下部の内径が小
さい尻すぼみ状の形状である。In Fig. 1, 1 is a camera, 2 is a lens barrel, and 2 is a lens barrel.
A cylindrical light reflector 3 is mounted below. The light reflector 3 has a concave shape in which the inner diameter of the lower part is smaller than the inner diameter of the upper part.
上記鏡筒２の内部には、ハーフミラ−４が設けられてお
り、またこの鏡筒２の側部には、このハーフミラ−４へ
向って照明光を照射する第１の光源５が設けられている
。この第１の光源５には、豆球などのランプ５ａが内蔵
されている。また上記光反射体３の上総部には、光ファ
イバから成る第２の光源６がリング状に設けられている
。１０は基板、１１はこの基板１０の上面に形成された
基板認識マークであり、上記光反射体３は、第２の光源
６と基板１０の間に位置している。A half mirror 4 is provided inside the lens barrel 2, and a first light source 5 that irradiates illumination light toward the half mirror 4 is provided on the side of the lens barrel 2. There is. This first light source 5 has a built-in lamp 5a such as a miniature bulb. Further, a second light source 6 made of an optical fiber is provided in the upper part of the light reflector 3 in a ring shape. 10 is a substrate, 11 is a substrate recognition mark formed on the upper surface of this substrate 10, and the light reflector 3 is located between the second light source 6 and the substrate 10.
上記構成において、第１の光源５から照射された照明光
は、ハーフミラ−４に反射されて、マーク１１に垂直に
入射する。また第２の光源６から照射された照明光は、
光反射体３により内方に反射されて、マーク１１に斜上
方から入射する。In the above configuration, the illumination light emitted from the first light source 5 is reflected by the half mirror 4 and enters the mark 11 perpendicularly. Further, the illumination light emitted from the second light source 6 is
The light is reflected inward by the light reflector 3 and enters the mark 11 from obliquely above.
したがってマーク１１が例えば金メツキなどの光沢のあ
る材料により形成されている場合、第１の光源５から照
射されて垂直に入射した光ａが、垂直に上方へ反射され
てカメラ１に入射し、カメラ１に明瞭に観察される。Therefore, when the mark 11 is formed of a shiny material such as gold plating, the light a emitted from the first light source 5 and incident vertically is reflected vertically upward and enters the camera 1, It is clearly observed by camera 1.
またマーク１１が例えば半田メツキなどにより形成され
て、その表面が粗面である場合、第２の光源６から照射
された光すは、光反射体３に内方に反射されて、斜上方
からマーク１１に入射し、上方へ反射されてカメラ１に
入射することから、明瞭に観察される。Further, if the mark 11 is formed by soldering, for example, and has a rough surface, the light emitted from the second light source 6 is reflected inward by the light reflector 3 and is reflected from diagonally above. The light enters the mark 11, is reflected upward, and enters the camera 1, so it can be clearly observed.
このように、この観察装置によれば、被測定物に対して
、垂直及び斜上方から照明光を照射できるので、様々な
材質の被測定物を明瞭に観察することができる。In this way, according to this observation device, the object to be measured can be irradiated with illumination light from vertically and obliquely upward, so objects to be measured made of various materials can be clearly observed.
（実施例２）
第２図において、ハーフミラ−４は、光反射体３の近傍
の光路上に設けられている。また光ファイバ６は分岐し
て、その一部はハーフミラ−４側へ延出する第１の光源
６ａとなっており、またその一部は下方へ屈折して、リ
ング状の第２の光源６ｂとなっている。(Example 2) In FIG. 2, a half mirror 4 is provided on the optical path near the light reflector 3. Further, the optical fiber 6 is branched, and a part of it is a first light source 6a that extends toward the half mirror 4, and a part of it is bent downward and becomes a ring-shaped second light source 6b. It becomes.
したがってこのものも、上記第１実施例と同様の作用効
果が得られる。また本実施例のように、第１の光源６ａ
も光ファイバにより構成すれば、ランプのような光源体
をハーフミラ−４などの光学系から遠（離し、光学系が
光源体の熱により光学的悪影響を受けるのを回避できる
。Therefore, this embodiment also provides the same effects as the first embodiment. Further, as in this embodiment, the first light source 6a
If the optical fiber is also used, the light source body such as a lamp can be placed far away from the optical system such as the half mirror 4, and the optical system can be prevented from being adversely affected optically by the heat of the light source body.
なお上記実施例は、基板認識マーク１１を観察する場合
を例にとって説明したが、本発明は、基板に形成される
半田ランドや、回路パターンなどの観察にも使用できる
。Although the above embodiment has been described with reference to the case where the board recognition mark 11 is observed, the present invention can also be used to observe solder lands, circuit patterns, etc. formed on a board.
（発明の効果）
以上説明したように本発明は、基板上の被測定物を上方
から観察するカメラと、この被測定物へ向って上方から
垂直に照明光を照射する第１の光源と、第２の光源と基
板の間にあって、この第２の光源から照射された照明光
を内方へ反射させて、上記被測定物に斜上方から照射す
る筒状の光反射体とから基板の観察装置を構成している
ので、様々な材料から成る基板上の被測定物を、明瞭に
観察することができる。(Effects of the Invention) As explained above, the present invention includes: a camera that observes an object to be measured on a substrate from above; a first light source that vertically irradiates illumination light toward the object from above; Observing the substrate from a cylindrical light reflector that is located between the second light source and the substrate and reflects the illumination light emitted from the second light source inward and irradiates the object to be measured from obliquely above. Since the device is configured as such, objects to be measured on substrates made of various materials can be clearly observed.
図は本発明の実施例を示すものであって、第１図は基板
の観察装置の正面図、第２図は他の実施例の部分正面図
、第３図は従来装置の側面図である。
１・・・カメラ
３・・・光反射体
５．６ａ・・・第１の光源
６．６ｂ・・・第２の光源
１０・・・基板
１１・・・被測定物The figures show an embodiment of the present invention, in which Fig. 1 is a front view of a substrate observation device, Fig. 2 is a partial front view of another embodiment, and Fig. 3 is a side view of a conventional device. . 1...Camera 3...Light reflector 5.6a...First light source 6.6b...Second light source 10...Substrate 11...Object to be measured
Claims (1)
被測定物へ向って上方から垂直に照明光を照射する第１
の光源と、第２の光源と基板の間にあって、この第２の
光源から照射された照明光を内方へ反射させて、上記被
測定物に斜上方から照射する筒状の光反射体とを備えて
いることを特徴とする基板の観察装置。A camera that observes the object to be measured on the substrate from above, and a first camera that irradiates illumination light vertically toward the object to be measured from above.
a cylindrical light reflector that is located between the second light source and the substrate and reflects the illumination light emitted from the second light source inward and irradiates the object to be measured from obliquely above; A substrate observation device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197309A JP2808850B2 (en) | 1990-07-25 | 1990-07-25 | Substrate observation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2197309A JP2808850B2 (en) | 1990-07-25 | 1990-07-25 | Substrate observation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0483400A true JPH0483400A (en) | 1992-03-17 |
| JP2808850B2 JP2808850B2 (en) | 1998-10-08 |
Family
ID=16372317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2197309A Expired - Fee Related JP2808850B2 (en) | 1990-07-25 | 1990-07-25 | Substrate observation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2808850B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6535291B1 (en) | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
| US6538244B1 (en) | 1999-11-03 | 2003-03-25 | Cyberoptics Corporation | Pick and place machine with improved vision system including a linescan sensor |
-
1990
- 1990-07-25 JP JP2197309A patent/JP2808850B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6538244B1 (en) | 1999-11-03 | 2003-03-25 | Cyberoptics Corporation | Pick and place machine with improved vision system including a linescan sensor |
| US6535291B1 (en) | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
| US6744499B2 (en) | 2000-06-07 | 2004-06-01 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2808850B2 (en) | 1998-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |