JPH0483473U - - Google Patents
Info
- Publication number
- JPH0483473U JPH0483473U JP12995890U JP12995890U JPH0483473U JP H0483473 U JPH0483473 U JP H0483473U JP 12995890 U JP12995890 U JP 12995890U JP 12995890 U JP12995890 U JP 12995890U JP H0483473 U JPH0483473 U JP H0483473U
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- application means
- circuit board
- printed circuit
- conveyor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002904 solvent Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本考案の一実施例に係る自動半田付け
装置の概略構成図、第２図は同自動半田付け装置
の外観図、第３図は本考案の作用を説明するプリ
ント基板を溶剤塗布手段に搬入する前の状態の説
明図、第４図は本考案の作用を説明するプリント
基板を溶剤塗布手段に搬入した後の状態の説明図
である。
１……自動半田付け装置、３……コンベヤー、
６……フラツクス塗布手段（溶剤塗布手段）、８
……半田塗布手段、１２……送風手段、１６……
プリント基板、１７……フラツクス（溶剤）。
Fig. 1 is a schematic configuration diagram of an automatic soldering device according to an embodiment of the present invention, Fig. 2 is an external view of the automatic soldering device, and Fig. 3 is a printed circuit board coated with a solvent to explain the operation of the present invention. FIG. 4 is an explanatory diagram of the state before the printed circuit board is carried into the solvent coating means, and FIG. 4 is an explanatory diagram of the state after the printed circuit board is carried into the solvent coating means, illustrating the operation of the present invention. 1... Automatic soldering device, 3... Conveyor,
6...Flux application means (solvent application means), 8
... Solder application means, 12 ... Air blowing means, 16 ...
Printed circuit board, 17...Flux (solvent).
Claims (1)
れたプリント基板を、半田付けするパターン面を
下側にして搬送するコンベヤーと、 該コンベヤーにより半田付けするための半田塗
布手段にプリント基板を搬送する前段階で、パタ
ーン面に溶剤を噴流することにより塗布する溶剤
塗布手段と、 該溶剤塗布手段に対向して上方に配置され、溶
剤の噴流を風圧で平坦化する送風手段と、を具備
し、 上記コンベヤーに供給されたプリント基板を搬
送しながら、パターン面に半田付けを行うことを
特徴とする自動半田付け装置。[Scope of claim for utility model registration] A conveyor that conveys a printed circuit board with lead wires of electronic components inserted into lead wire insertion holes with the pattern side to be soldered facing downward, and a solder for soldering by the conveyor. A solvent application means that sprays a solvent onto the pattern surface before the printed circuit board is conveyed to the application means, and a solvent application means that is disposed above the solvent application means and flattens the solvent jet using wind pressure. An automatic soldering device, comprising: an air blower, and soldering onto a patterned surface while conveying the printed circuit board supplied to the conveyor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12995890U JPH0483473U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12995890U JPH0483473U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0483473U true JPH0483473U (en) | 1992-07-21 |
Family
ID=31877332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12995890U Pending JPH0483473U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0483473U (en) |
-
1990
- 1990-11-30 JP JP12995890U patent/JPH0483473U/ja active Pending
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