JPH048442U - - Google Patents
Info
- Publication number
- JPH048442U JPH048442U JP4910590U JP4910590U JPH048442U JP H048442 U JPH048442 U JP H048442U JP 4910590 U JP4910590 U JP 4910590U JP 4910590 U JP4910590 U JP 4910590U JP H048442 U JPH048442 U JP H048442U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- electronic component
- cast
- molded electronic
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す側断面図、
第２図は第１図の平面図、第３図は第２図のケー
スの正面図、第４図は第３図の側面図、第５図は
この考案の他の実施例を示すケースの正面図、第
６図は第５図の側面図である。
図において、１はユニツトケース、２はハイブ
リツドＩＣ、３は基板、５は樹脂、６はフイラー
、７，１０はケースである。なお、各図中、同一
符号は同一または相当部分を示すものである。
FIG. 1 is a side sectional view showing an embodiment of this invention.
Figure 2 is a plan view of Figure 1, Figure 3 is a front view of the case of Figure 2, Figure 4 is a side view of Figure 3, and Figure 5 is a case showing another embodiment of this invention. The front view, FIG. 6, is a side view of FIG. In the figure, 1 is a unit case, 2 is a hybrid IC, 3 is a substrate, 5 is a resin, 6 is a filler, and 7 and 10 are cases. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ツトケース内に収められ、このユニツトケース内
にはフイラーが散在して樹脂が注入されてなる注
型モールド電子部品ユニツトにおいて、前記ハイ
ブリツドＩＣにはカバーが覆つて設けられたこと
を特徴とする注型モールド電子部品ユニツト。 In a cast-molded electronic component unit in which a board to which a hybrid IC is attached is housed in a unit case, filler is scattered within the unit case, and resin is injected, the hybrid IC is covered with a cover. A cast molded electronic component unit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4910590U JPH048442U (en) | 1990-05-14 | 1990-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4910590U JPH048442U (en) | 1990-05-14 | 1990-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048442U true JPH048442U (en) | 1992-01-27 |
Family
ID=31566516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4910590U Pending JPH048442U (en) | 1990-05-14 | 1990-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048442U (en) |
-
1990
- 1990-05-14 JP JP4910590U patent/JPH048442U/ja active Pending