JPS6234474U - - Google Patents
Info
- Publication number
- JPS6234474U JPS6234474U JP12465785U JP12465785U JPS6234474U JP S6234474 U JPS6234474 U JP S6234474U JP 12465785 U JP12465785 U JP 12465785U JP 12465785 U JP12465785 U JP 12465785U JP S6234474 U JPS6234474 U JP S6234474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- storage case
- mold filling
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Reinforced Plastic Materials (AREA)
- Moulding By Coating Moulds (AREA)
Description
第１図は本考案に係る電子部品のモールド充填
構造を示す断面図、第２図は繊維筒の斜視図、第
３図は従来の電子部品のモールド充填構造を示す
断面図である。
１１……印刷配線板、１２……チツプ部品、１
３……ＩＣフラツトパツケージ、１４……収納ケ
ース、１５……繊維筒、１６……弾性率の低い常
温硬化型ウレタン樹脂。
FIG. 1 is a sectional view showing a mold filling structure for an electronic component according to the present invention, FIG. 2 is a perspective view of a fiber cylinder, and FIG. 3 is a sectional view showing a conventional mold filling structure for an electronic component. 11...Printed wiring board, 12...Chip parts, 1
3...IC flat package cage, 14...Storage case, 15...Fiber cylinder, 16...Room temperature curing urethane resin with low elastic modulus.
Claims (1)
間に樹脂をモールドするようにした電子部品のモ
ールド充填構造において、予め前記印刷配線板と
前記収納ケース間に繊維筒を装着すると共に弾性
率の低い常温硬化型ウレタン樹脂をモールドする
ようにしたことを特徴とする電子部品のモールド
充填装置。 In a mold filling structure for electronic components in which a resin is molded between a printed wiring board on which electronic components are mounted and a storage case, a fiber tube is installed in advance between the printed wiring board and the storage case, and a fiber tube with a low elastic modulus is installed. A mold filling device for electronic parts, characterized in that it molds room temperature curing urethane resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465785U JPS6234474U (en) | 1985-08-15 | 1985-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465785U JPS6234474U (en) | 1985-08-15 | 1985-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234474U true JPS6234474U (en) | 1987-02-28 |
Family
ID=31016874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12465785U Pending JPS6234474U (en) | 1985-08-15 | 1985-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234474U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63288096A (en) * | 1987-05-20 | 1988-11-25 | Matsushita Electric Ind Co Ltd | Printed board device |
| JP2004363164A (en) * | 2003-06-02 | 2004-12-24 | Alps Electric Co Ltd | Sealed electric part |
| JP2009009939A (en) * | 2007-05-31 | 2009-01-15 | Swcc Showa Cable Systems Co Ltd | Insulation transformer for aerial lighting and aerial lighting circuit using the same |
| JP2018181961A (en) * | 2017-04-06 | 2018-11-15 | 株式会社デンソー | Electronic device |
-
1985
- 1985-08-15 JP JP12465785U patent/JPS6234474U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63288096A (en) * | 1987-05-20 | 1988-11-25 | Matsushita Electric Ind Co Ltd | Printed board device |
| JP2004363164A (en) * | 2003-06-02 | 2004-12-24 | Alps Electric Co Ltd | Sealed electric part |
| JP2009009939A (en) * | 2007-05-31 | 2009-01-15 | Swcc Showa Cable Systems Co Ltd | Insulation transformer for aerial lighting and aerial lighting circuit using the same |
| JP2018181961A (en) * | 2017-04-06 | 2018-11-15 | 株式会社デンソー | Electronic device |
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