JPH048470A - Polishing method and rotary elastic body therefor - Google Patents

Polishing method and rotary elastic body therefor

Info

Publication number
JPH048470A
JPH048470A JP11246590A JP11246590A JPH048470A JP H048470 A JPH048470 A JP H048470A JP 11246590 A JP11246590 A JP 11246590A JP 11246590 A JP11246590 A JP 11246590A JP H048470 A JPH048470 A JP H048470A
Authority
JP
Japan
Prior art keywords
elastic body
workpiece
rotating
polished
polishing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11246590A
Other languages
Japanese (ja)
Inventor
Taiji Hiraoka
大治 平岡
Masayoshi Onishi
政良 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koyo Seiko Co Ltd
Original Assignee
Koyo Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Seiko Co Ltd filed Critical Koyo Seiko Co Ltd
Priority to JP11246590A priority Critical patent/JPH048470A/en
Publication of JPH048470A publication Critical patent/JPH048470A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To prevent streaks from occurring in the traces even if nonfeeding polishing is performed, by having a relative position between a rotary elastic body and a workpiece reciprocatively displaced in the same direction with a turning axis of the rotary elastic body in succession, during rotation of the rotary elastic body. CONSTITUTION:A Y table 12 is being stopped as rotating a rotary elastic body 5, and an X table 10 is reciprocatively displaced at a fine stroke as if it is vibrated. With this constitution, a polished part 8a of a workpiece 8 is polished at a minute vertical strip area G1 conformed to a displacement stroke of the X table 10. In consequence, occurrence of streak flaw is prevented in the polishing traces despite nonfeeding polishing.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、被加工物を微細粉末砥粒が一様に分散した懸
45液中に浸漬させた状態で回転させるとともに、この
波力U工物の被研磨面に回転弾性体を非接触で対向させ
た状態で、前記回転弾性体を回転させて被研磨面との間
で前記懸濁液を流動させることにより前記被加工物の被
研磨面を加工する研磨方法と、この研磨方法に用いる回
転弾性体とに関する。
Detailed Description of the Invention <Industrial Application Field> The present invention involves rotating a workpiece while immersed in a suspension liquid in which fine powder abrasive grains are uniformly dispersed, and With the rotating elastic body opposed to the polished surface of the workpiece without contact, the rotating elastic body is rotated to flow the suspension between the polished surface and the polished surface of the workpiece. The present invention relates to a polishing method for processing a polished surface and a rotary elastic body used in this polishing method.

〈従来の技術〉 近年、高精度の研磨表面を得る目的で、EEM(Ela
stic E■1ssion Machining)と
称する極微小量弾性破壊現象を利用した加工技術が提案
されている。この加工技術では、極微小量弾性破壊現象
を利用して原子の単位で加工することができ、格子欠陥
を増殖させずに被加工物の被研磨面を高精度に研磨する
ことができる。
<Conventional technology> In recent years, EEM (Ela
A machining technology that utilizes a microscopic elastic fracture phenomenon called stic E1ssion Machining has been proposed. With this processing technology, it is possible to perform processing in units of atoms by utilizing ultra-fine elastic fracture phenomena, and the surface of the workpiece to be polished can be polished with high precision without multiplying lattice defects.

従来のEEM研磨装置を第5図に示して簡単に説明する
A conventional EEM polishing apparatus is shown in FIG. 5 and briefly described.

図中、1は鉛直方向に上下動自在なNG主軸ヘッド、2
はNC主軸ヘッドlに十字ばね3を介して懸垂されたモ
ータ、5はモータ2の出力軸4に取り付けられたエラス
トマー球体と称する回転弾性体、6は微細粉末砥粒を一
様に分散した懸濁液7を収納した容器、8は容器7の底
部に固定された被加工物、9はXテーブル10を駆動す
るX方向エアスライド、11はYテーブル12を駆動す
るY方向エアスライド、13は被加工物8の被研磨面8
aと回転弾性体5との近接の度合を調節する荷重支持棒
である。
In the figure, 1 is an NG spindle head that can move up and down in the vertical direction, 2
5 is a rotating elastic body called an elastomer sphere attached to the output shaft 4 of the motor 2, and 6 is a suspension in which fine powder abrasive grains are uniformly dispersed. 8 is a workpiece fixed to the bottom of the container 7; 9 is an X-direction air slide that drives the X-table 10; 11 is a Y-direction air slide that drives the Y-table 12; Polished surface 8 of workpiece 8
This is a load support rod that adjusts the degree of proximity between a and the rotating elastic body 5.

この装置での加工動作は、モータ2により回転弾性体5
を回転させながら、被加工物8をXテーブル10.Yテ
ーブル12でX−Y方向に任意に送り、回転弾性体5に
被加工物8を非接触状態で近接させることにより行う、
これにより、第6図に示すように、回転弾性体5と被加
工物8の被研磨面8aとの間の微小間隙を懸濁液7が流
体軸受的に流れることになり、この懸濁液7中の微細粉
末砥粒が被研磨面8aに衝突・滑走して被研磨面8aが
研磨されるのである。なお、−回の送りによる加工痕は
、直線の微小幅の帯となる。
The machining operation in this device is carried out by the motor 2, which rotates the elastic body 5.
While rotating the workpiece 8, place it on the X table 10. This is carried out by arbitrarily feeding the workpiece 8 in the X-Y direction using the Y table 12 and bringing the workpiece 8 close to the rotating elastic body 5 in a non-contact state.
As a result, as shown in FIG. 6, the suspension 7 flows in a fluid bearing manner through the minute gap between the rotating elastic body 5 and the polished surface 8a of the workpiece 8, and this suspension The fine powder abrasive grains in 7 collide with and slide on the surface to be polished 8a, and the surface to be polished 8a is polished. Note that the machining marks caused by the - times of feeding become a straight band with a very small width.

ここで、被加工物8の送り方向として、例えば第7図に
示すように、回転弾性体5の回転軸線Oと同一方向への
送りをX方向送りと定め、回転軸線01と直交する方向
への送りをY方向送りと定める。
Here, as the feeding direction of the workpiece 8, for example, as shown in FIG. The feed is defined as the Y direction feed.

〈発明が解決しようとする課題〉 ところで、上述したX方向送りでは、特に問題ないので
あるが、Y方向送りにより得られた帯状加工痕を微視的
に観察すると、送り方向と平行な複数本のすし状の傷が
発生していることが確認された。上記X方向送りの場合
は、微細粉末砥粒の流動方向と送り方向が直交して打消
し合うためにすし状の傷は発生しないと考えられ、Y方
向送りの場合は、微細粉末砥粒の流動方向と送り方向が
一致して砥粒の流れが不均一なためにすし状の傷を形成
するものと考えられる。また、被加工物8を停止したま
まで加工を行う場合にも、前述のようなすし状の傷が発
生することも確認された。なお、X方向に対して斜めの
送りでも、前述のすし状の傷は発生しないことを本件出
願人は確認している。
<Problems to be Solved by the Invention> By the way, there is no particular problem with the above-mentioned X-direction feeding, but microscopic observation of the band-shaped machining marks obtained by Y-direction feeding reveals that there are multiple lines parallel to the feeding direction. It was confirmed that a sushi-shaped wound had occurred. In the case of the above-mentioned X direction feeding, the flow direction of the fine powder abrasive grains and the feeding direction are perpendicular to each other and cancel each other out, so it is thought that no sliver-shaped scratches occur.In the case of the Y direction feeding, the fine powder abrasive grains It is thought that the flow direction and the feeding direction are the same and the flow of the abrasive grains is non-uniform, resulting in the formation of sushi-shaped scratches. It has also been confirmed that the above-mentioned sushi-shaped scratches occur even when processing is performed while the workpiece 8 is stopped. The applicant has confirmed that the above-mentioned sushi-like scratches do not occur even when the paper is fed diagonally to the X direction.

このような理由から、従来では、加工時の送り方向をX
方向に限定せざるをえず、使い勝手が悪い点が指摘され
る。また、従来の回転弾性体が、球形状であるため、単
位時間当たりの加工面積が小さく加工に手間がかかる点
も指摘される。
For this reason, in the past, the feed direction during machining was
It has been pointed out that it is difficult to use because it has to be limited to one direction. Furthermore, it has been pointed out that since the conventional rotary elastic body has a spherical shape, the processing area per unit time is small and processing is time-consuming.

本発明は、このような事情に鑑みて創案されたもので、
被加工物または回転弾性体をどの方向に送ってもすし状
の傷が発生しないようにすることと、加工面積を可及的
に大きくして加工能率を高めることを目的としている。
The present invention was created in view of these circumstances, and
The purpose is to prevent the occurrence of slit-like scratches no matter which direction the workpiece or rotary elastic body is fed, and to increase the machining efficiency by increasing the machining area as much as possible.

く課題を解決するための手段〉 本発明は、上記目的を達成するために、被加工物を微細
粉末砥粒が分散した懸濁液中に浸漬させ、この被加工物
の被研磨面に回転弾性体を非接触で対向させた状態で、
前記回転弾性体を回転させて被研磨面との間で前記懸8
5液を流動させることにより前記被加工物の被研磨面を
加工する研磨方法において、次のような構成をとる。
Means for Solving the Problems> In order to achieve the above object, the present invention immerses a workpiece in a suspension in which fine powder abrasive grains are dispersed, and rotates the surface of the workpiece to be polished. With the elastic bodies facing each other without contact,
The rotating elastic body is rotated to hold the suspension 8 between the rotating elastic body and the surface to be polished.
A polishing method for processing the surface to be polished of the workpiece by flowing a liquid has the following configuration.

第1の発明の研磨方法は、前記回転弾性体の回転中に、
回転弾性体と被加工物との相対位置を回転弾性体の回転
軸線と同一方向へ連続的に往復変位させることに特像を
有する。
In the polishing method of the first invention, during the rotation of the rotating elastic body,
The feature is that the relative position of the rotary elastic body and the workpiece is continuously reciprocated in the same direction as the rotational axis of the rotary elastic body.

第2の発明の研磨方法は、前記回転弾性体の回転中に、
回転弾性体と被加工物との相対位置を回転弾性体の回転
軸線と同一方向へ連続的に往復変位させながら、回転弾
性体または被加工物のどちらか一方を前記回転軸線に対
して直交する方向へ送ることに特徴を有する。
In the polishing method of the second invention, during the rotation of the rotating elastic body,
While continuously reciprocating the relative position of the rotating elastic body and the workpiece in the same direction as the rotational axis of the rotating elastic body, either the rotating elastic body or the workpiece is moved perpendicular to the rotational axis. It is characterized by sending in the direction.

第3の発明の回転弾性体は、前記第1.第2の発明に用
いるものであって、円筒形に形成されていることに特徴
を有する。
The rotational elastic body of the third aspect of the invention includes the above-mentioned first aspect. It is used in the second invention and is characterized by being formed in a cylindrical shape.

く作用〉 第1の発明では、回転弾性体または被加工物のどちらも
送らずに、回転弾性体と被加工物とのどちらか一方を振
動させるかの如く回転弾性体の回転軸線と同一方向へ微
小往復させることにより、研磨を進行させる。すなわち
、両者の相対位置を時々刻々と変化させるから、送りの
ない研磨加工でありながらも加工痕にすし状の傷が発生
しなくなる。なお、この処理が従来の停止状態での研磨
に相当する。
In the first invention, the rotating elastic body or the workpiece is vibrated in the same direction as the axis of rotation of the rotating elastic body or the workpiece, without sending either the rotating elastic body or the workpiece. Polishing progresses by making small reciprocations. That is, since the relative positions of the two are changed from time to time, no sushi-like scratches are generated in the machining marks even though the polishing process is performed without feed. Note that this process corresponds to conventional polishing in a stopped state.

第2の発明では、従来ではすし状の傷が発生していた方
向に回転弾性体または被加工物のどちらか一方を送りな
がら、上記第1の発明と同様に回転弾性体と被加工物と
の相対位置を時々刻々と変位させるから、この送り軌跡
は直線ではなく鋸刃状となり、立ち上がり部分および立
ち下がり部分についても回転弾性体の回転軸線に対して
斜め、あるいは回転軸線とほぼ同一方向になる。すなわ
ち、この送りは従来においてすし状の傷が発生していた
方向であるが、送り軌跡が送り方向とほぼ直交する方向
または斜め方向になるので、加工痕にすし状の傷が発生
しなくなる。
In the second invention, while sending either the rotating elastic body or the workpiece in the direction in which slit-shaped scratches have conventionally occurred, the rotating elastic body and the workpiece are moved in the same manner as in the first invention. Because the relative position of Become. That is, this feeding is in the direction in which slit-shaped scratches have conventionally occurred, but since the feed locus is in a direction substantially perpendicular to the feeding direction or in a diagonal direction, no slit-shaped scratches are generated in the machining marks.

第3の発明では、円筒形の回転弾性体を用いるため、こ
の円筒形外周面を被加工物の被研磨面と平行に対問させ
れば、その加工面積が球形の回転弾性体の場合に比べて
大きくなる。
In the third invention, since a cylindrical rotary elastic body is used, if the cylindrical outer circumferential surface is parallel to the surface to be polished of the workpiece, the machining area is spherical. becomes larger in comparison.

〈実施例〉 以下、本発明の一実施例を図面に基づいて詳細に説明す
る。
<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

従来からの研磨装置を用いて第1.第2の発明にかかる
研磨方法を実現する例を説明する。
First, using a conventional polishing device. An example of implementing the polishing method according to the second invention will be described.

まず、第1の発明方法の実施例を説明する。第1図にお
いて、回転弾性体5を回転させながら、Xテーブル12
は停止しておき、Xテーブル10をあたかも振動させる
かのように微小ストロークで往復変位させる。この場合
、第2閏に示すように、被加工物8の被研磨面8aは、
前記Xテーブル10の変位ストロークに対応した微小な
縦帯状領域G1が研磨されることになる。
First, an example of the first invention method will be described. In FIG. 1, while rotating the rotary elastic body 5,
is stopped, and the X-table 10 is reciprocated with minute strokes as if vibrating. In this case, as shown in the second leap, the polished surface 8a of the workpiece 8 is
A minute vertical band-shaped region G1 corresponding to the displacement stroke of the X-table 10 is polished.

次に、第2の発明方法の実施例を説明する。第3図にお
いて、回転弾性体5を回転させながら、Xテーブル12
を適当な速度でY方向(図中、左方向)へ移動させると
ともに、Xテーブル10を上記第1の発明方法と同様に
微小ストロークで往復変位させる。このような送りでも
って加工を進行させると、送り軌跡は、Y方向への直線
送りにはならずに鋸刃状となる。この場合、第2図に示
すように、被加工物8の被研磨面8aは、Xテーブル1
0の変位ストロークと、Xテーブル12の送り量とで決
まる横帯状領域G、が研磨されることになる。
Next, an example of the second invention method will be described. In FIG. 3, while rotating the rotary elastic body 5,
is moved in the Y direction (to the left in the figure) at an appropriate speed, and the X table 10 is reciprocated with a minute stroke in the same manner as in the first method of the invention. When machining proceeds with such feed, the feed locus does not become a straight line feed in the Y direction, but becomes a sawtooth shape. In this case, as shown in FIG. 2, the polished surface 8a of the workpiece 8 is
A horizontal band-shaped region G determined by the displacement stroke of 0 and the feed amount of the X table 12 will be polished.

さらに、第3の発明装置の実施例を説明する。Furthermore, an embodiment of the third invention device will be described.

第4図に示すように、円筒形の回転弾性体5′を用い、
この回転弾性体5′の円筒外周面を、被加工物8の被研
磨面8aに対して平行に対向させるように、回転弾性体
5′を支持するモータ2の出力軸4が水平方向と平行と
なるように配置する。
As shown in FIG. 4, using a cylindrical rotating elastic body 5',
The output shaft 4 of the motor 2 that supports the rotary elastic body 5' is parallel to the horizontal direction so that the cylindrical outer peripheral surface of the rotary elastic body 5' faces parallel to the polished surface 8a of the workpiece 8. Arrange it so that

この回転弾性体5′を用いて上記第2の発明方法を行う
場合を例に挙げて説明する。つまり、円筒形の回転弾性
体5′を回転のみ行わせながら、Xテーブル12を適当
な速度でY方向(図中、左方向)へ移動させるとともに
、Xテーブル1oを上記第1の発明方法と同様に微小ス
トロークで往復変位させる。このときの送り軌跡につい
ても鋸刃状となる。この場合、第2Mに示すように、被
研磨面8aは、Xテーブル10の変位ストロークに回転
弾性体5′の長さを加えた寸法と、Xテーブル12の送
り量とで決まる矩形領域G、が研磨されることになる。
An example in which the second method of the invention is carried out using this rotating elastic body 5' will be explained. That is, while only rotating the cylindrical rotary elastic body 5', the X table 12 is moved in the Y direction (to the left in the figure) at an appropriate speed, and the X table 1o is moved according to the first invention method described above. Similarly, it is reciprocated with a minute stroke. The feed locus at this time also has a sawtooth shape. In this case, as shown in 2M, the surface to be polished 8a has a rectangular area G determined by the displacement stroke of the X-table 10 plus the length of the rotary elastic body 5' and the feed amount of the X-table 12; will be polished.

この矩形領域G、のX方向に沿う辺がXテーブル10の
変位ストロークと回転弾性体5′の長さとを加えた寸法
となり、また、矩形領域G、のY方向に沿う辺がY方向
への移動量となる。各辺の比により、矩形領域の形状が
、正方形や長方形にと変わることになる。
The side of this rectangular area G along the X direction is the sum of the displacement stroke of the X table 10 and the length of the rotating elastic body 5', and the side of the rectangular area G along the Y direction is the The amount of movement. Depending on the ratio of each side, the shape of the rectangular area changes from square to rectangle.

なお、第2の発明方法および円筒形の回転弾性体5′を
用いた研磨において、Xテーブル12の送り速度は任意
であり、その送り速度を遅くすれば、上述したように横
帯状に研磨できるが、送り速度を速くした場合には鋸状
に研磨されることになる。また、上記実施例では、Xテ
ーブルlOを介して被加工物8を、微小ストロークで往
復変位させるようにしているが、本発明はこれに限定さ
れず、例えば、回転弾性体5を支持するモータ2の出力
軸4を被加工物8の被加工面8aに対して平行となるよ
う配置し、出力軸4またはモータ2そのものを回転弾性
体5の回転軸線と同一方向に微小ストロークで往復変位
させるようにしてもよい、このときの振動付加手段とし
ては、高周波発生装置、超音波振動装置、圧電振動子装
置などが考えられ、適宜に選択される。
In addition, in the second invention method and polishing using the cylindrical rotating elastic body 5', the feed rate of the X table 12 is arbitrary, and if the feed rate is slowed down, polishing can be performed in a horizontal band shape as described above. However, if the feed speed is increased, the material will be polished into a saw-like shape. Further, in the above embodiment, the workpiece 8 is reciprocated with a minute stroke via the X-table IO, but the present invention is not limited to this. 2 is arranged so as to be parallel to the workpiece surface 8a of the workpiece 8, and the output shaft 4 or the motor 2 itself is reciprocated in the same direction as the rotational axis of the rotary elastic body 5 with a minute stroke. As the vibration applying means at this time, a high frequency generator, an ultrasonic vibrator, a piezoelectric vibrator, etc. can be considered, and are selected as appropriate.

〈発明の効果〉 以上説明したように、第1の発明によれば、送りのない
研磨を行っても加工痕にすし状の傷が発生するのを防ぐ
ことができる。
<Effects of the Invention> As explained above, according to the first invention, even if polishing is performed without feeding, it is possible to prevent the occurrence of slit-like scratches in the machining marks.

また、第2の発明によれば、従来からすし状の傷が発生
していた方向の送りを行っても、加工痕にすし状の傷が
発生するのを防くことができ、そのため、従来のように
送り方向が限定されることもなく使い勝手が向上するこ
とになる。
Further, according to the second invention, even if feeding is performed in the direction in which sushi-shaped scratches have conventionally occurred, it is possible to prevent sushi-shaped scratches from occurring in the machining marks. The feeding direction is not limited as in the above, and the usability is improved.

さらに、第3の発明によれば、加工面積を従来に比べて
大幅に大きくすることができるので、加工時間を短縮で
きて製作コストの低減に貢献できるようになる。
Furthermore, according to the third aspect of the invention, the processing area can be significantly increased compared to the conventional method, so that processing time can be shortened and production costs can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は第1の発明にかかる研磨方法の動作説明に用い
る平面図、第2図は各研磨方法による加工痕を示す平面
図、第3図は第2の発明にかかる研磨方法の動作説明に
用いる平面図、第4図は第3の発明にかかる回転弾性体
を用いた研磨方法の動作説明に用いる平面図である。 第5図ないし第7図は従来例に係り、第5図は従来の研
磨装置の概略を示す側面図、第6図は研磨の原理を示す
側面図、第7図は研磨方法の動作説明に用いる平面図で
ある。 5.5′・・・回転弾性体
Fig. 1 is a plan view used to explain the operation of the polishing method according to the first invention, Fig. 2 is a plan view showing machining marks by each polishing method, and Fig. 3 is a plan view used to explain the operation of the polishing method according to the second invention. FIG. 4 is a plan view used to explain the operation of the polishing method using a rotating elastic body according to the third invention. Figures 5 to 7 relate to conventional examples; Figure 5 is a side view schematically showing a conventional polishing device, Figure 6 is a side view showing the principle of polishing, and Figure 7 is an explanation of the operation of the polishing method. FIG. 5.5'...Rotating elastic body

Claims (3)

【特許請求の範囲】[Claims] (1)被加工物を微細粉末砥粒が分散した懸濁液中に浸
漬させ、この被加工物の被研磨面に回転弾性体を非接触
で対向させた状態で、前記回転弾性体を回転させて被研
磨面との間で前記懸濁液を流動させることにより前記被
加工物の被研磨面を加工する研磨方法であって、 前記回転弾性体の回転中に、回転弾性体と被加工物との
相対位置を回転弾性体の回転軸線と同一方向へ連続的に
往復変位させることを特徴とする研磨方法。
(1) A workpiece is immersed in a suspension in which fine powder abrasive grains are dispersed, and the rotating elastic body is rotated with the rotating elastic body facing the surface to be polished of the workpiece without contact. A polishing method for processing the polished surface of the workpiece by flowing the suspension between the rotating elastic body and the polished surface, the polishing method comprising: rotating the rotating elastic body and the polished surface; A polishing method characterized by continuously reciprocating the relative position of an object in the same direction as the axis of rotation of a rotating elastic body.
(2)被加工物を微細粉末砥粒が分散した懸濁液中に浸
漬させ、この被加工物の被研磨面に回転弾性体を非接触
で対向させた状態で、前記回転弾性体を回転させて被研
磨面との間で前記懸濁液を流動させることにより前記被
加工物の被研磨面を加工する研磨方法であって、 前記回転弾性体の回転中に、回転弾性体と被加工物との
相対位置を回転弾性体の回転軸線と同一方向へ連続的に
往復変位させながら、回転弾性体または被加工物のどち
らか一方を前記回転軸線に対して直交する方向へ送るこ
とを特徴とする研磨方法。
(2) The workpiece is immersed in a suspension in which fine powder abrasive grains are dispersed, and the rotating elastic body is rotated with the rotating elastic body facing the surface to be polished of the workpiece without contact. A polishing method for processing the polished surface of the workpiece by flowing the suspension between the rotating elastic body and the polished surface, the polishing method comprising: rotating the rotating elastic body and the polished surface; It is characterized by sending either the rotary elastic body or the workpiece in a direction perpendicular to the rotation axis while continuously reciprocating its relative position with the object in the same direction as the rotation axis of the rotary elastic body. Polishing method.
(3)請求項(1)または(2)に記載の研磨方法に用
いる回転弾性体であって、円筒形に形成されていること
を特徴とする回転弾性体。
(3) A rotary elastic body used in the polishing method according to claim (1) or (2), characterized in that the rotary elastic body is formed in a cylindrical shape.
JP11246590A 1990-04-26 1990-04-26 Polishing method and rotary elastic body therefor Pending JPH048470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11246590A JPH048470A (en) 1990-04-26 1990-04-26 Polishing method and rotary elastic body therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11246590A JPH048470A (en) 1990-04-26 1990-04-26 Polishing method and rotary elastic body therefor

Publications (1)

Publication Number Publication Date
JPH048470A true JPH048470A (en) 1992-01-13

Family

ID=14587323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11246590A Pending JPH048470A (en) 1990-04-26 1990-04-26 Polishing method and rotary elastic body therefor

Country Status (1)

Country Link
JP (1) JPH048470A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429488A (en) * 1987-07-25 1989-01-31 Shimizu Construction Co Ltd Additive for excavation stabilizing fluid
JP5018479B2 (en) * 2005-08-05 2012-09-05 勇蔵 森 Electron beam assisted EEM method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429488A (en) * 1987-07-25 1989-01-31 Shimizu Construction Co Ltd Additive for excavation stabilizing fluid
JP5018479B2 (en) * 2005-08-05 2012-09-05 勇蔵 森 Electron beam assisted EEM method

Similar Documents

Publication Publication Date Title
JP5061296B2 (en) Flat double-side polishing method and flat double-side polishing apparatus
KR940007405B1 (en) Micro-abrading method and tool
JP2022545477A (en) Displacement measurement and protection device for horizontal slide table
JP2003048152A (en) Recessed spherical face machining device by ultrasonic wave and method therefor
WO2020032106A1 (en) Local polishing method, local polishing device, and corrective polishing apparatus using said local polishing device
JPH048470A (en) Polishing method and rotary elastic body therefor
JP2011083827A (en) Magnetic fluid polishing method and polishing device
JP2002283216A (en) Magnetic polishing method and device using elliptical vibration and magnetic abrasive grains
JPH08192348A (en) Grinding and polishing method and device therefor
JP2020168677A (en) Dressing equipment and dressing method
JP2007098541A (en) Polishing tool and polish method
JP2002001657A (en) ELID grinding machine for fine shape processing
CN210435923U (en) Crystal material homogenization burnishing device
JPS63272457A (en) Polishing method for workpiece
JP2016132083A (en) Processing apparatus, processing method, and part manufacturing method
JP3729538B2 (en) Polishing equipment
JPH06320408A (en) Lapping method for roll to be processed
JP4162567B2 (en) Wafer notch mirror finishing machine
JPS63232975A (en) liquid polishing method
JP2003300131A (en) Method and device for fine processing
JPH10193262A (en) Method and device for dressing grinding wheel for centerless grinding machine and centerless grinding machine
JP5815814B1 (en) Centerless grinding method and apparatus
JPH05162064A (en) Microterritory polishing device
JPH0623663A (en) Super smoothing non-contact polishing method and device
JPS591151A (en) Tape processing equipment