JPH048512B2 - - Google Patents
Info
- Publication number
- JPH048512B2 JPH048512B2 JP58013777A JP1377783A JPH048512B2 JP H048512 B2 JPH048512 B2 JP H048512B2 JP 58013777 A JP58013777 A JP 58013777A JP 1377783 A JP1377783 A JP 1377783A JP H048512 B2 JPH048512 B2 JP H048512B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- chemical
- solution
- copper plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1377783A JPS59143058A (ja) | 1983-02-01 | 1983-02-01 | 化学銅めつき液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1377783A JPS59143058A (ja) | 1983-02-01 | 1983-02-01 | 化学銅めつき液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143058A JPS59143058A (ja) | 1984-08-16 |
| JPH048512B2 true JPH048512B2 (de) | 1992-02-17 |
Family
ID=11842668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1377783A Granted JPS59143058A (ja) | 1983-02-01 | 1983-02-01 | 化学銅めつき液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143058A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2595319B2 (ja) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| US5965211A (en) * | 1989-12-29 | 1999-10-12 | Nippondenso Co., Ltd. | Electroless copper plating solution and process for formation of copper film |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343890A (en) * | 1976-10-02 | 1978-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Corrosion protective device for submarine coaxial cable, repeater frame |
| JPS5654386A (en) * | 1979-10-11 | 1981-05-14 | Hitachi Ltd | Fuel cladding tube with composit clad |
| JPS5852466A (ja) * | 1981-09-21 | 1983-03-28 | Hitachi Chem Co Ltd | 無電解銅めつき液 |
-
1983
- 1983-02-01 JP JP1377783A patent/JPS59143058A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59143058A (ja) | 1984-08-16 |
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