JPH0485541A - Photosensitive planographic printing plate - Google Patents
Photosensitive planographic printing plateInfo
- Publication number
- JPH0485541A JPH0485541A JP20191790A JP20191790A JPH0485541A JP H0485541 A JPH0485541 A JP H0485541A JP 20191790 A JP20191790 A JP 20191790A JP 20191790 A JP20191790 A JP 20191790A JP H0485541 A JPH0485541 A JP H0485541A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- photosensitive layer
- photosensitive
- printing plate
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 41
- 229920000642 polymer Polymers 0.000 claims abstract description 24
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000003118 aryl group Chemical group 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 238000004581 coalescence Methods 0.000 claims description 2
- 239000000178 monomer Substances 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 abstract description 3
- 125000004185 ester group Chemical group 0.000 abstract 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 28
- 238000000576 coating method Methods 0.000 description 28
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- 229910052782 aluminium Inorganic materials 0.000 description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- -1 polyethylene Polymers 0.000 description 19
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 11
- 238000011282 treatment Methods 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 229920002050 silicone resin Polymers 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000011342 resin composition Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000004115 Sodium Silicate Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 150000008049 diazo compounds Chemical class 0.000 description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 6
- 229910052911 sodium silicate Inorganic materials 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical group 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 235000010724 Wisteria floribunda Nutrition 0.000 description 4
- 238000010306 acid treatment Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000000542 sulfonic acid group Chemical group 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000010559 graft polymerization reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical group OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- HSJKGGMUJITCBW-UHFFFAOYSA-N 3-hydroxybutanal Chemical compound CC(O)CC=O HSJKGGMUJITCBW-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical group CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 150000001241 acetals Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000007824 aliphatic compounds Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 150000003459 sulfonic acid esters Chemical class 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- ODXVNGGVVIDEPQ-UHFFFAOYSA-N (4-chlorophenoxy)methylphosphonic acid Chemical compound OP(O)(=O)COC1=CC=C(Cl)C=C1 ODXVNGGVVIDEPQ-UHFFFAOYSA-N 0.000 description 1
- CQGBQHVFCCEEPW-UHFFFAOYSA-N (4-nonylphenyl) hydrogen sulfate Chemical compound CCCCCCCCCC1=CC=C(OS(O)(=O)=O)C=C1 CQGBQHVFCCEEPW-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- FPDWEIACOORPNF-UHFFFAOYSA-N (5-nitronaphthalen-1-yl)phosphonic acid Chemical compound C1=CC=C2C(P(O)(=O)O)=CC=CC2=C1[N+]([O-])=O FPDWEIACOORPNF-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- IRLYGRLEBKCYPY-UHFFFAOYSA-N 2,5-dimethylbenzenesulfonic acid Chemical compound CC1=CC=C(C)C(S(O)(=O)=O)=C1 IRLYGRLEBKCYPY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- FEVVTKCAZXCXEQ-UHFFFAOYSA-N 2-(4-hydroxyphenyl)pentanoic acid Chemical compound CCCC(C(O)=O)C1=CC=C(O)C=C1 FEVVTKCAZXCXEQ-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ZRUOTKQBVMWMDK-UHFFFAOYSA-N 2-hydroxy-6-methylbenzaldehyde Chemical compound CC1=CC=CC(O)=C1C=O ZRUOTKQBVMWMDK-UHFFFAOYSA-N 0.000 description 1
- 229940044192 2-hydroxyethyl methacrylate Drugs 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical group OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- DIYZUWALSKUDMZ-UHFFFAOYSA-N 2-phenylethyl hydrogen sulfate Chemical compound OS(=O)(=O)OCCC1=CC=CC=C1 DIYZUWALSKUDMZ-UHFFFAOYSA-N 0.000 description 1
- GLULCKCBVYGUDD-UHFFFAOYSA-N 2-phosphonobutane-1,1,1-tricarboxylic acid Chemical compound CCC(P(O)(O)=O)C(C(O)=O)(C(O)=O)C(O)=O GLULCKCBVYGUDD-UHFFFAOYSA-N 0.000 description 1
- LBBOQIHGWMYDPM-UHFFFAOYSA-N 2-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=CC=C1O LBBOQIHGWMYDPM-UHFFFAOYSA-N 0.000 description 1
- VXVUDUCBEZFQGY-UHFFFAOYSA-N 4,4-dimethylpentanenitrile Chemical compound CC(C)(C)CCC#N VXVUDUCBEZFQGY-UHFFFAOYSA-N 0.000 description 1
- LBSXSAXOLABXMF-UHFFFAOYSA-N 4-Vinylaniline Chemical compound NC1=CC=C(C=C)C=C1 LBSXSAXOLABXMF-UHFFFAOYSA-N 0.000 description 1
- KWXICGTUELOLSQ-UHFFFAOYSA-N 4-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=C(S(O)(=O)=O)C=C1 KWXICGTUELOLSQ-UHFFFAOYSA-N 0.000 description 1
- KDGASBMKCFVAGA-UHFFFAOYSA-N 5-benzoyl-2-hydroxybenzenesulfonic acid Chemical compound OC1=C(C=C(C=C1)C(C1=CC=CC=C1)=O)S(=O)(=O)O KDGASBMKCFVAGA-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PLFWKEBYFVGLME-UHFFFAOYSA-N C1(=CC=CC=C1)C1=C(C(N=N1)=O)C.[Na] Chemical compound C1(=CC=CC=C1)C1=C(C(N=N1)=O)C.[Na] PLFWKEBYFVGLME-UHFFFAOYSA-N 0.000 description 1
- QGDSPAPQURDOCF-UHFFFAOYSA-N C1=CC(O)(O)CC(O)=C1C(=O)C1=CC=CC=C1O Chemical compound C1=CC(O)(O)CC(O)=C1C(=O)C1=CC=CC=C1O QGDSPAPQURDOCF-UHFFFAOYSA-N 0.000 description 1
- 229920000623 Cellulose acetate phthalate Polymers 0.000 description 1
- 229920001747 Cellulose diacetate Polymers 0.000 description 1
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Chemical group 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DRAJWRKLRBNJRQ-UHFFFAOYSA-N Hydroxycarbamic acid Chemical class ONC(O)=O DRAJWRKLRBNJRQ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 description 1
- 240000007320 Pinus strobus Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000999 acridine dye Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229940081734 cellulose acetate phthalate Drugs 0.000 description 1
- 229920006218 cellulose propionate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical group 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical group OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001760 dimethyl sulfoxide Drugs 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- BJZIJOLEWHWTJO-UHFFFAOYSA-H dipotassium;hexafluorozirconium(2-) Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[K+].[K+].[Zr+4] BJZIJOLEWHWTJO-UHFFFAOYSA-H 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- 229940043264 dodecyl sulfate Drugs 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- FCQJEPASRCXVCB-UHFFFAOYSA-N flavianic acid Chemical compound C1=C(S(O)(=O)=O)C=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FCQJEPASRCXVCB-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 1
- YRVUCYWJQFRCOB-UHFFFAOYSA-N n-butylprop-2-enamide Chemical compound CCCCNC(=O)C=C YRVUCYWJQFRCOB-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 125000002081 peroxide group Chemical group 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229940068041 phytic acid Drugs 0.000 description 1
- 235000002949 phytic acid Nutrition 0.000 description 1
- 239000000467 phytic acid Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- CXVGEDCSTKKODG-UHFFFAOYSA-N sulisobenzone Chemical compound C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 CXVGEDCSTKKODG-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
本発明は非シリコーン系感光層を設けた感光性平版印刷
版に関し、特に、支持体と感光層の接着力が向上し、耐
剛力及びクリーナー等の薬品に対する耐性が改良された
感光性平版印刷版に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a photosensitive lithographic printing plate provided with a non-silicone photosensitive layer, and in particular, the adhesive strength between the support and the photosensitive layer is improved, and the stiffness resistance and cleaner resistance are improved. This invention relates to a photosensitive lithographic printing plate with improved resistance to chemicals such as.
平版印刷版用支持体は、片面又は両面に感光層を設けて
使用される。この感光層は、直接使用者によって、又は
プレコーテッド印刷版のメーカーによって施される。こ
の感光層は通常のフォトメカニカル法により、オリジナ
ルから直接又はフィルムを通して露光される。その後、
有機溶媒又はアルカリ水溶液等により現像され、インキ
受容性の画像部と親水性の非画像部が形成される。A support for a lithographic printing plate is used with a photosensitive layer provided on one or both sides. This photosensitive layer is applied either directly by the user or by the manufacturer of the precoated printing plate. This photosensitive layer is exposed by conventional photomechanical methods, either directly from the original or through the film. after that,
It is developed with an organic solvent or an alkaline aqueous solution, and an ink-receptive image area and a hydrophilic non-image area are formed.
従って、平版印刷版の画像部と非画像部には次の要件が
要求される。Therefore, the following requirements are required for the image and non-image areas of the lithographic printing plate.
すなわち、画像部に於いては(a)感光層が支持体と強
固に接着し、より多くの印刷物が得られなければならず
、また℃)印刷機上で用いられる種々の薬品、例えばク
リーナー等が付着した場合でも感光層と支持体との接着
力が低下してはならない。That is, in the image area, (a) the photosensitive layer must firmly adhere to the support to obtain more printed matter, and (C) various chemicals used on the printing press, such as cleaners, etc. The adhesion between the photosensitive layer and the support must not be reduced even if the photosensitive layer is adhered to the support.
一方、非画像部に於いては、(a)親水性非画像部を得
るために、現像作業によって支持体から感光層が容易に
除去されなければならず、また、ら)非画像部において
露出された支持体は、水に対する高親和性を有しなけれ
ばならない。On the other hand, in the non-image area, (a) the photosensitive layer must be easily removed from the support by a development operation in order to obtain a hydrophilic non-image area, and (a) the photosensitive layer must be exposed in the non-image area. The supported support must have a high affinity for water.
このような要件を満たすべき方法としては、米国特許第
3,276.868号及び同第4,153,461号の
各明細書に記載されているポリビニルホスホン酸、又は
ビニルホスホン酸、アクリル酸及び酢酸ビニルを基荊と
するコポリマーを支持体上に下塗りする方法、特公昭4
5−16603号公報に記載されているジアゾニウム化
合物を支持体上に下塗りする方法などが知られている。As a method that should meet these requirements, polyvinylphosphonic acid, vinylphosphonic acid, acrylic acid and A method of undercoating a copolymer based on vinyl acetate on a support, Japanese Patent Publication No. 4
A method of undercoating a support with a diazonium compound described in Japanese Patent No. 5-16603 is known.
しかしながら、これの方法によっても、非画像部の感光
層が現像時にら容易に除去されるために汚染が生じ難(
、かつ、支持体と感光層の接着力が強いために、高耐剛
力を有し、種々の薬品に対する高い耐性を有する感光性
平版印刷版は得られていない。However, even with this method, contamination is difficult to occur because the photosensitive layer in the non-image area is easily removed during development (
Moreover, since the adhesive force between the support and the photosensitive layer is strong, a photosensitive lithographic printing plate having high stiffness resistance and high resistance to various chemicals has not been obtained.
〔発明が解決しようとする課B]
本発明の目的は、高性能印刷版に対して現場で要求され
る高耐剛性、種々の薬品に対する耐性、現像性等に優れ
、親水性が高く汚染しにくい感光性平版印刷版を提供す
ることである。特に、支持体と感光層の接着力が向上し
、オフセット輪転印刷機における高速かつ苛酷な印刷条
件でも高耐刷力を有し、かつクリーナー等の薬品に対す
る耐性が大巾に改善された感光性平版印刷版を提供する
ことである。[Problem B to be Solved by the Invention] The purpose of the present invention is to produce a high-performance printing plate that has excellent rigidity, resistance to various chemicals, developability, etc. required in the field, is highly hydrophilic, and is free from contamination. It is an object of the present invention to provide a photosensitive lithographic printing plate that is difficult to use. In particular, the adhesive strength between the support and the photosensitive layer is improved, the printing durability is high even under the high speed and harsh printing conditions of rotary offset printing presses, and the resistance to chemicals such as cleaners is greatly improved. The purpose is to provide lithographic printing plates.
本発明者らは上記の目的を達成すべく鋭意検討した結果
、特定の繰り返し単位を有する重合体を含有する中間層
を、支持体と非シリコーン系感光層の間に設けることに
より上記の目的を達成することを見出し、本発明を完成
するに至った。As a result of intensive studies to achieve the above object, the present inventors have found that the above object can be achieved by providing an intermediate layer containing a polymer having a specific repeating unit between the support and the non-silicone photosensitive layer. The present invention has been completed based on this discovery.
すなわち、本発明は、支持体上に非シリコーン系感光層
を設けてなる感光性平版印刷版において、該支持体と該
非シリコーン系感光層の間に、下記一般式で示される繰
り返し単位を有する重合体を含有する中間層を設けたこ
とを特徴とする感光性平版印刷版を提供するものである
。That is, the present invention provides a photosensitive lithographic printing plate comprising a non-silicone photosensitive layer on a support, in which a polymer having a repeating unit represented by the following general formula is provided between the support and the non-silicone photosensitive layer. The present invention provides a photosensitive lithographic printing plate characterized by being provided with an intermediate layer containing coalescence.
〔式中、
R’:HまたはCHl
R”、R3:H、アルキル基またはアリール基n:1〜
10の整数
m:1.2または3
である。〕
以下、本発明について順を追って詳しく説明する。[In the formula, R': H or CHl R'', R3: H, alkyl group or aryl group n: 1-
Integer m of 10: 1.2 or 3. ] Hereinafter, the present invention will be explained in detail step by step.
本発明の感光性平版印刷版に適した支持体は、寸度的に
安定な板状物である。かかる寸度的に安定な板状物とし
ては、従来印刷版の支持体として使用されたものが含ま
れ、それらは本発明に好適に使用することができる。か
かる支持体としては、紙、プラスチックス(例えば、ポ
リエチレン、ポリプロピレン、ポリスチレンなと)がラ
ミネートされた紙、アルミニウム(アルミニウム合金も
含む。)、亜鉛、銅などのような金属の板、二酢酸セル
ロース、三酢酸セルロース、プロピオン酸セルロース、
醋酸セルロース、酢酸酪酸セルロース、硝酸セルロース
、ポリエチレンテレフタレート、ポリエチレン、ポリス
チレン、ポリプロピレン、ポリカーボネート、ポリビニ
ルアセタールなどのようなプラスチックのフィルム、上
記の如き金属がラミネートもしくは蒸着された紙もしく
はプラスチックフィルムなどが含まれる。これらの支持
体のうち、アルミニウム板は寸度的に著しく安定であり
、しかも安価であるので特に好ましい。A suitable support for the photosensitive lithographic printing plate of the invention is a dimensionally stable plate. Such dimensionally stable plate-like materials include those conventionally used as supports for printing plates, and they can be suitably used in the present invention. Such supports include paper, paper laminated with plastics (e.g., polyethylene, polypropylene, polystyrene, etc.), plates of metals such as aluminum (including aluminum alloys), zinc, copper, etc., cellulose diacetate. , cellulose triacetate, cellulose propionate,
Plastic films such as cellulose acetate, cellulose acetate butyrate, cellulose nitrate, polyethylene terephthalate, polyethylene, polystyrene, polypropylene, polycarbonate, polyvinyl acetal, etc., and paper or plastic films laminated or vapor-deposited with metals such as those mentioned above are included. Among these supports, aluminum plates are particularly preferred because they are extremely dimensionally stable and inexpensive.
本発明に使用される支持体として特に好ましいものは粗
面化したアルミニウム板であり、これは種々の方法で製
造することができる。例えば、ワイヤブラシダレイニン
グ、研摩粒子のスラリーを注ぎながらナイロンブラシで
粗面化するブラシダレイニング、ボールグレイニング、
ケミカルダレイニング、電解グレイニングやこれらの粗
面化法を複合させた複合グレイニングによって表面を砂
目立てする。次に必要に応じて硫酸、燐酸、蓚酸、硼M
、クロム酸、スルファミン酸又はこれらの混酸中で直流
又は交流電源にて陽極酸化を行いアルミニウム表面に強
固な不動態皮膜を設けることが好ましい。このような不
動態皮膜自体でアルミニウム表面は親水化されるが、更
に必要に応じて米国特許第2.714,066号明細書
や米国特許第3.181,461号明細書に記載されて
いるケイ酸塩処理(ケイ酸ナトリウム、ケイ酸カリウム
)、米国特許第2,946,638号明細書に記載され
ている弗化ジルコニウム酸カリウム処理、米国特許第3
.201,247号明細書に記載されているホスホモリ
ブデート処理、独国特許第LO9L433号明細書に記
載されているポリアクリル酸処理、独国特許第1、.1
34,093号明細書や英国特許第1.230,447
号明細書に記載されているポリビニルホスホン酸処理、
特公昭44−6409号公報に記載されているホスホン
酸処理、米国特許第3,307.951号明細書に記載
されているフィチン酸処理、特開昭5816893号や
特開昭58−18291号の各公報に記載されている親
水性有機高分子化合物と2価の金属よりなる複合処理や
その他スルホン酸基を有する水溶性重合体の下塗によっ
て親水化処理を行ってもよい。その他の親水化処理方法
としては米国特許第3,658,662号明細書に記載
されているシリケート電着も挙げることが出来る。Particularly preferred as a support for use in the present invention is a roughened aluminum plate, which can be manufactured in a variety of ways. For example, wire brush graining, brush graining in which the surface is roughened with a nylon brush while pouring a slurry of abrasive particles, ball graining,
The surface is grained by chemical graining, electrolytic graining, or composite graining that combines these roughening methods. Next, as necessary, sulfuric acid, phosphoric acid, oxalic acid, borium M
It is preferable to perform anodization in chromic acid, sulfamic acid, or a mixed acid thereof using a direct current or alternating current power source to form a strong passive film on the aluminum surface. Such a passive film itself makes the aluminum surface hydrophilic, but if necessary, it can be further treated as described in U.S. Pat. No. 2,714,066 and U.S. Pat. No. 3,181,461. Silicate treatments (sodium silicate, potassium silicate), potassium fluorozirconate treatments as described in U.S. Pat. No. 2,946,638, U.S. Pat.
.. 201,247, polyacrylic acid treatment as described in German Patent No. LO9L433, German Patent No. 1, . 1
34,093 specification and British Patent No. 1.230,447
The polyvinylphosphonic acid treatment described in the specification of
The phosphonic acid treatment described in Japanese Patent Publication No. 44-6409, the phytic acid treatment described in U.S. Pat. The hydrophilic treatment may be performed by a composite treatment using a hydrophilic organic polymer compound and a divalent metal as described in each publication, or by undercoating with a water-soluble polymer having a sulfonic acid group. Other hydrophilic treatment methods include silicate electrodeposition as described in US Pat. No. 3,658,662.
本明細書に使用されるアルミニウム支持体として最も好
ましいものは、粗面化した後、陽極酸化皮膜を設け、次
いでケイ酸塩処理を施したアルミニウム板である。The most preferred aluminum support used herein is an aluminum plate that has been roughened, provided with an anodized coating, and then subjected to silicate treatment.
以上のように処理を施した支持体上に、下記一般式で示
される繰り返し単位を有する重合体を含有する中間層を
設ける。An intermediate layer containing a polymer having repeating units represented by the following general formula is provided on the support treated as described above.
(R3)3−1,1
〔式中、
R’:H又はCH3
R”、R”:H、アルキル基またはアリール基n:1〜
10の整数
m:1.2または3
である。]
上記一般式で示される繰り返し単位を有する重合体はア
クリルシリコーン樹脂であり、このアクリルシリコーン
樹脂は下記一般式によって示されるシリル基をエステル
残基に有する(メタ)アクリル酸エステルからなるモノ
マーを、公知の方法で他のモノマーと共重合もしくはグ
ラフト重合することによって得られる。(R3)3-1,1 [In the formula, R': H or CH3 R", R": H, alkyl group or aryl group n: 1-
Integer m of 10: 1.2 or 3. ] The polymer having the repeating unit represented by the above general formula is an acrylic silicone resin, and this acrylic silicone resin contains a monomer consisting of a (meth)acrylic acid ester having a silyl group represented by the following general formula in the ester residue, It can be obtained by copolymerization or graft polymerization with other monomers by a known method.
p+
(R3) 3−11
(R’ 、R2、Rff、n、mの意味は前記のものと
同じである。)
かかるシリル基をエステル残基に有する(メタ)アクリ
ル酸エステルからなるモノマーとしては、特にr−(メ
タ)アクリロキシプロピルトリメトキシシラン、γ−(
メタ)アクリロキシプロピルトリエトキシシランが好ま
しく、この他にβ−(メタ)アクリロキシエチルトリメ
トキシシラン、β−(メタ)アクリロキシエチルトリエ
トキシシラン、β−(メタ)アクリロキシエチルメチル
ジメトキシシラン、β−(メタ)アクリロキシエチルメ
チルジェトキシシラン、β−(メタ)アクリロキシプロ
ピルトリメトキシシラン、β−(メタ)アクリロキシプ
ロピルトリエトキシシラン、T(メタ)アクリロキシエ
チルトリメトキシシラン、r−(メタ)アクリロキシエ
チルトリエトキシシラン等のモノマーが例示される。p+ (R3) 3-11 (The meanings of R', R2, Rff, n, and m are the same as above.) As a monomer consisting of a (meth)acrylic acid ester having such a silyl group in the ester residue, , especially r-(meth)acryloxypropyltrimethoxysilane, γ-(
Meta)acryloxypropyltriethoxysilane is preferred, and in addition to this, β-(meth)acryloxyethyltrimethoxysilane, β-(meth)acryloxyethyltriethoxysilane, β-(meth)acryloxyethylmethyldimethoxysilane, β-(meth)acryloxyethylmethyljethoxysilane, β-(meth)acryloxypropyltrimethoxysilane, β-(meth)acryloxypropyltriethoxysilane, T(meth)acryloxyethyltrimethoxysilane, r- Examples include monomers such as (meth)acryloxyethyltriethoxysilane.
上記の(メタ)アクリル酸エステルからなるモノマーと
共重合可能なモノマーとしては、例天ば(メタ)アクリ
ル酸、(メタ)アクリル酸メチル、(メタ)アクリル酸
エチル、アクリルアミド、Nブチルアクリルアミド、ス
チレン、酢酸ビニルなどが挙げられる。Examples of monomers copolymerizable with the above-mentioned (meth)acrylic acid ester monomers include (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, acrylamide, N-butylacrylamide, and styrene. , vinyl acetate, etc.
前記のシリル基をエステル残基に有する(メタ)アクリ
ル酸以外のモノマーに基く繰り返し単位が共重合体中に
占める割合は好ましくは約10〜98重量%である。The proportion of the repeating unit based on a monomer other than (meth)acrylic acid having a silyl group as an ester residue in the copolymer is preferably about 10 to 98% by weight.
グラフト重合は例えば次のような方法によって行うこと
ができる。Graft polymerization can be carried out, for example, by the following method.
(1)重合開始基を幹ポリマー中に有するポリマーを開
始剤として他の千ツマ−を重合させる方法。(1) A method of polymerizing other polymers using a polymer having a polymerization initiating group in the backbone polymer as an initiator.
幹ポリマー中の重合開始基としては、ハロゲン基、ケト
ン基、過酸化物基、ジアゾ基などが選ばれる。As the polymerization initiating group in the backbone polymer, a halogen group, a ketone group, a peroxide group, a diazo group, etc. are selected.
(2)幹ポリマー存在下で重合し、ポリマーへの連鎖移
動反応を用いる方法。(2) A method of polymerizing in the presence of a backbone polymer and using a chain transfer reaction to the polymer.
連鎖移動によるグラフト重合では、幹ポリマーの連鎖移
動定数の大きいものほどよくグラフトするので、幹ポリ
マー中に例えば、−3H。In graft polymerization by chain transfer, the larger the chain transfer constant of the backbone polymer, the better the grafting, so for example, -3H is added to the backbone polymer.
導入しておくことが好ましい。It is preferable to introduce it.
(3)側鎖に官能基を有するポリマーと、末端に官能基
を有するポリマーとの重合反応による方法。(3) A method using a polymerization reaction between a polymer having a functional group in its side chain and a polymer having a functional group at its end.
官能基の組み合わせとしては、水素供与基(例えば、−
0H1−5H1−NPIZ 、−COOH1CO3H,
−CONH2、−3O□N1(z、〉NOHなど)と水
素受容基(例えば、−N=C=O1■
CH=CHz 、c=cti、 c=Nなど)の組み
合わせが好ましい。Combinations of functional groups include hydrogen donating groups (e.g. -
0H1-5H1-NPIZ, -COOH1CO3H,
A combination of -CONH2, -3O□N1 (z, >NOH, etc.) and a hydrogen accepting group (eg, -N=C=O1 CH=CHz, c=cti, c=N, etc.) is preferred.
上記アクリルシリコーン樹脂を含有する中間層を塗布す
る方法としては、ホイラー塗布機、ロールコータ−塗布
機、バーコーダ−塗布機等で塗布する方法、又は浸漬処
理する方法等、いかなる方法も用いることができる。Any method can be used to apply the intermediate layer containing the acrylic silicone resin, such as coating with a wheeler coating machine, roll coater coating machine, barcoder coating machine, etc., or dipping treatment. .
上記アクリルシリコーン樹脂を有機溶剤に希釈してO,
OO2〜4.0重量%のアクリルシリコーン樹脂塗布液
を調製し、該塗布液を塗布後、60〜110°Cの熱風
で30〜240秒間乾燥してアクリルシリコーン樹脂か
らなる中間層を設ける。The above acrylic silicone resin was diluted with an organic solvent and O.
An acrylic silicone resin coating solution containing 02 to 4.0% by weight is prepared, and after coating, the coating solution is dried with hot air at 60 to 110°C for 30 to 240 seconds to form an intermediate layer made of an acrylic silicone resin.
アクリルシリコーン樹脂の乾燥塗布量は0.1mg/m
2〜1000mg/m”の範囲が好ましい。特に好まし
くは0.5〜500gng/m”の範囲である。The dry coating amount of acrylic silicone resin is 0.1mg/m
The range is preferably from 2 to 1000 mg/m'', and particularly preferably from 0.5 to 500 gng/m''.
乾燥塗布量が0.1 mg/m”より少ないと耐剛力及
びクリーナー等の薬品に対する耐性が改良されず、逆に
、1000mg/m2より多いと汚れやすくなる。If the dry coating amount is less than 0.1 mg/m'', the stiffness resistance and resistance to chemicals such as cleaners will not be improved, and on the other hand, if it is more than 1000 mg/m2, it will become easily stained.
このようにして得られた、平版印刷版用支持体上に設け
られた中間層上に、非シリコーン系感光層を設ける。本
発明に用いられる非シリコーン系感光層の具体例を以下
に示す。A non-silicone photosensitive layer is provided on the intermediate layer provided on the lithographic printing plate support thus obtained. Specific examples of the non-silicone photosensitive layer used in the present invention are shown below.
(A) o−キノンジアジド化合物からなる感光層:
特に好ましい0−キノンジアジド化合物は0−ナフトキ
ノンジアジド化合物であり、例えば米国特許第2,76
6.118号、同2,767.092号、同第2、77
2.972号、同第2,859.112号、同第2,9
07,665号、同第3,046.110号、同第3.
046,111号、同第3.046,115号、同第3
,046,118号、同第3,046.119号、同第
3,046.120号、同第3,046.121号、同
第3.046,122号、同第3.046,123号、
同第3,061,430号、同第3,102,809号
、同第3,106.465号、同第3、635.709
号、同第3,647,443号の明細書をはじめ、多数
の刊行物に記されており、これらは好適に使用すること
ができる。これらの内でも、特に芳香族ヒドロキシ化合
物の0−ナフトキノンジアジドスルホン酸エステルまた
は0−ナフトキノンジアジドカルボン酸エステル、およ
び芳香族アミノ化合物の0−ナフトキノンジアジドスル
ホン酸アミドまたは0−ナフトキノンジアジドカルボン
酸アミドが好ましく、特に米国特許第3,635,70
9号明細書に記されているピロガロールとアセトンとの
縮合物に0−ナフトキノンジアジドスルホン酸をエステ
ル反応させたもの、米国特許第4,028.111号明
細書に記されている末端にヒドロキシ基を有するポリエ
ステルにO−ナフトキノンジアジドスルホン酸、または
0−ナフトキノンジアジドカルボン酸をエステル反応さ
せたもの、英国特許箱1.494,043号明細書に記
されているようなp−ヒドロキシスチレンのホモポリマ
ーまたはこれと他の共重合し得るモノマーとの共重合体
に0−ナフトキノンジアジドスルホン酸または0−ナフ
トキノンジアジドカルボン酸をエステル反応させたもの
、米国特許第3,759,711号明細書に記されてい
るようなp−アミノスチレンと他の共重合し得るモノマ
ーとの共重合体に0−ナフトキノンジアジドスルホン酸
または0−ナフトキノンジアジドカルボン酸をアミド反
応させたものが非常にすぐれている。(A) Photosensitive layer consisting of o-quinonediazide compound:
Particularly preferred 0-quinonediazide compounds are 0-naphthoquinonediazide compounds, such as U.S. Pat.
6.118, 2,767.092, 2,77
No. 2.972, No. 2,859.112, No. 2.9
No. 07,665, No. 3,046.110, No. 3.
No. 046,111, No. 3.046,115, No. 3
, 046,118, 3,046.119, 3,046.120, 3,046.121, 3.046,122, 3.046,123 ,
3,061,430, 3,102,809, 3,106.465, 3,635.709
No. 3,647,443, and many other publications, which can be suitably used. Among these, 0-naphthoquinonediazide sulfonic acid ester or 0-naphthoquinonediazidecarboxylic acid ester of an aromatic hydroxy compound, and 0-naphthoquinonediazide sulfonic acid amide or 0-naphthoquinonediazidecarboxylic acid amide of an aromatic amino compound are particularly preferred. , especially U.S. Pat. No. 3,635,70
No. 9 describes a condensate of pyrogallol and acetone subjected to ester reaction with 0-naphthoquinone diazide sulfonic acid, and U.S. Pat. O-naphthoquinonediazide sulfonic acid or O-naphthoquinonediazidecarboxylic acid is ester-reacted with a polyester having or a copolymer of this and other copolymerizable monomers with 0-naphthoquinonediazide sulfonic acid or 0-naphthoquinonediazidecarboxylic acid, as described in U.S. Pat. No. 3,759,711. A very good example is a copolymer of p-aminostyrene and another copolymerizable monomer, such as the one described above, which is subjected to an amide reaction with 0-naphthoquinonediazide sulfonic acid or 0-naphthoquinonediazidecarboxylic acid.
これらの0−キノンジアジド化合物は、単独で使用する
ことができるが、アルカリ可溶性樹脂と混合して用いた
方が好ましい。好適なアルカリ可溶性樹脂には、ノボラ
ック型フェノール樹脂が含まれ、具体的には、フェノー
ルホルムアルデヒド樹脂、0−クレゾールホルムアルデ
ヒド樹脂、m−クレゾールホルムアルデヒド樹脂などが
含まれる。更に米国特許第4.123,279号明細書
に記されている様に上記のようなフェノール樹脂と共に
、t−ブチルフェノールホルムアルデヒド樹脂のような
炭素数3〜8のアルキル基で置換されたフェノールまた
はクレゾールとホルムアルデヒドとの縮合物とを併用す
ると、より一層好ましい。アルカリ可溶性樹脂は、感光
層を構成する組成物の全重量を基準として約50〜約8
5重量%、より好ましくは60〜80重量%、含有させ
ることができる。Although these 0-quinonediazide compounds can be used alone, it is preferable to use them in combination with an alkali-soluble resin. Suitable alkali-soluble resins include novolak-type phenolic resins, and specifically include phenol formaldehyde resins, 0-cresol formaldehyde resins, m-cresol formaldehyde resins, and the like. Furthermore, as described in U.S. Pat. No. 4,123,279, in addition to the above-mentioned phenolic resins, phenol or cresol substituted with an alkyl group having 3 to 8 carbon atoms such as t-butylphenol formaldehyde resin can be used. It is even more preferable to use a condensate of formaldehyde and formaldehyde together. The alkali-soluble resin has an amount of about 50 to about 8 based on the total weight of the composition constituting the photosensitive layer.
It can be contained in an amount of 5% by weight, more preferably 60 to 80% by weight.
(B) ジアゾ樹脂とバインダーとからなる感光層:ネ
ガ作用型感光性ジアゾ化合物としては米国特許第2,0
63,631号及び同第2,667.415号の各明細
書に開示されているジアゾニウム塩とアルドールやアセ
タールのような反応性カルボニル基を含有する有機縮合
剤との反応生成物であるジフェニルアミン−p−ジアゾ
ニウム塩とホルムアルデヒドとの縮合生成物(所謂感光
性ジアゾ樹脂)が好適に用いられる。この他の有用な縮
合ジアゾ化合物は特公昭49−48001号、同49−
45322号、同49−45323号の各公報等に開示
されている。これらの型の感光性ジアゾ化合物は通常水
溶性無機塩の形で得られ、従って水溶液から塗布するこ
とができる。又、これらの水溶性ジアゾ化合物を特公昭
47−1167号公報に開示された方法により1個又は
それ以上のフェノール性水酸基、スルホン酸基又はその
両者を有する芳香族又は脂肪族化合物と反応させ、その
反応生成物である実質的に水不溶性の感光性ジアゾ樹脂
を使用することもできる。(B) Photosensitive layer consisting of diazo resin and binder: As a negative-acting photosensitive diazo compound, U.S. Pat.
Diphenylamine, which is a reaction product of a diazonium salt disclosed in the specifications of No. 63,631 and No. 2,667.415, and an organic condensing agent containing a reactive carbonyl group such as an aldol or an acetal. A condensation product of p-diazonium salt and formaldehyde (so-called photosensitive diazo resin) is preferably used. Other useful condensed diazo compounds are disclosed in Japanese Patent Publication No. 49-48001 and Japanese Patent Publication No. 49-48001.
It is disclosed in publications such as No. 45322 and No. 49-45323. These types of photosensitive diazo compounds are usually obtained in the form of water-soluble inorganic salts and can therefore be coated from aqueous solution. Further, these water-soluble diazo compounds are reacted with an aromatic or aliphatic compound having one or more phenolic hydroxyl groups, sulfonic acid groups, or both by the method disclosed in Japanese Patent Publication No. 47-1167, The reaction product, a substantially water-insoluble photosensitive diazo resin, can also be used.
また、これらの水溶性ジアゾ化合物を特開昭56−I2
1031号公報に記載されているようにヘキサフルオロ
燐酸塩または、テトラフルオロ硼酸塩との反応生成物と
して使用することもできる。In addition, these water-soluble diazo compounds were
It can also be used as a reaction product with hexafluorophosphate or tetrafluoroborate as described in Japanese Patent No. 1031.
フェノニル性水酸基を有する化合物の反応生成物である
実質的に水不溶の感光性ジアゾ樹脂の例としては、ヒド
ロキシベンゾフェノン、4.4−ビス((4’−ヒドロ
キシフェニル)ペンタン酸、レゾルシノール、又はジレ
ゾルシノールのようなジフェノール酸が挙げられるが、
これらは更に置換基を有していてもよい。ヒドロキシベ
ンゾフェノンには2.4−ジヒドロキシベンゾフェノン
、2−ヒドロキシ−4−メトキシベンゾフェノン、2.
2′−ジヒドロキシ−44′−ジメトキシベンゾフェノ
ン又は2.2’、4.4−テトラヒドロキシベンゾフェ
ノンが含まれる。好ましいスルホン酸としては、例えば
ベンゼン、トルエン、キシレン、ナフタレン、フェノー
ル、ナフトールおよびベンゾフェノン等のスルホン酸の
ような芳香族スルホン酸、又はそれ等の可溶性塩類、例
えば、アンモニウム塩及びアルカリ金属塩が例示できる
。スルホン酸基含有化合物は、一般に低級アルキル、ニ
トロ基、ハロ基、及び/又はもう一つのスルホン酸基で
置換されていてもよい。このような化合物の好ましいも
のとしては、ベンゼンスルホン酸、トルエンスルホン酸
、ナフタリンスルホン酸、2.5−ジメチルベンゼンス
ルホン酸、ベンゼンスルホン酸ナトリウム、ナフタリン
−2−スルホン酸、1−ナフトール−2−(又は4)−
スルホン酸、2.4−ジニトロ−1−ナフトール−7−
スルホン酸、2−ヒドロキシ−4−メトキシベンゾフェ
ノン−5−スルホン酸、4−ドデシルベンゼンスルホン
酸、m−(p’ −アニリノフェニルアゾ)ベンゼンス
ルホン酸ナトリウム、アリザリンスルホン酸、0−トル
イジン〜m−スルホン酸及びエタンスルホン酸等が挙げ
られる。Examples of substantially water-insoluble photosensitive diazo resins that are reaction products of compounds having phenonylic hydroxyl groups include hydroxybenzophenone, 4,4-bis((4'-hydroxyphenyl)pentanoic acid, resorcinol, or Examples include diphenolic acids such as resorcinol,
These may further have a substituent. Hydroxybenzophenone includes 2.4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2.
Included are 2'-dihydroxy-44'-dimethoxybenzophenone or 2,2',4,4-tetrahydroxybenzophenone. Preferred sulfonic acids include aromatic sulfonic acids such as sulfonic acids such as benzene, toluene, xylene, naphthalene, phenol, naphthol, and benzophenone, or soluble salts thereof, such as ammonium salts and alkali metal salts. . Sulfonic acid group-containing compounds may generally be substituted with lower alkyl, nitro groups, halo groups, and/or another sulfonic acid group. Preferred examples of such compounds include benzenesulfonic acid, toluenesulfonic acid, naphthalenesulfonic acid, 2,5-dimethylbenzenesulfonic acid, sodium benzenesulfonate, naphthalene-2-sulfonic acid, 1-naphthol-2-( or 4)-
Sulfonic acid, 2,4-dinitro-1-naphthol-7-
Sulfonic acid, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 4-dodecylbenzenesulfonic acid, sodium m-(p'-anilinophenylazo)benzenesulfonate, alizarinsulfonic acid, 0-toluidine to m- Examples include sulfonic acid and ethanesulfonic acid.
アルコールのスルホン酸エステルとその塩類も又有用で
ある。このような化合物は通常アニオン性界面活性剤と
して容易に入手できる。その具体例としてはラウリルサ
ルフェート、アルキルアリールサルフェート、p−ノニ
ルフェニルサルフェート、2−フェニルエチルサルフェ
ート、イソオクチルフェノキシジェトキシエチルサルフ
ェート等のアンモニウム塩又はアルカリ金属塩が挙げら
れる。Sulfonic esters of alcohols and their salts are also useful. Such compounds are usually readily available as anionic surfactants. Specific examples thereof include ammonium salts or alkali metal salts such as lauryl sulfate, alkylaryl sulfate, p-nonylphenyl sulfate, 2-phenylethyl sulfate, and isooctylphenoxyjethoxyethyl sulfate.
これ等の実質的に水不溶性の感光性ジアゾ樹脂は水溶性
の感光性ジアゾ樹脂と前記の芳香族又は脂肪族化合物の
水溶液を好ましくはほぼ等量となる量で混合することに
よって沈殿として単離される。These substantially water-insoluble photosensitive diazo resins are isolated as a precipitate by mixing the water-soluble photosensitive diazo resin and an aqueous solution of the aromatic or aliphatic compound, preferably in approximately equal amounts. It will be done.
さらに、英国特許第1,312,925号明細書に記載
されているジアゾ樹脂も好ましい。Also preferred are the diazo resins described in British Patent No. 1,312,925.
また、特開平2−29650号公報に記載されているよ
うなアルカリ可溶性ジアゾ樹脂も好ましい。Also preferred are alkali-soluble diazo resins such as those described in JP-A-2-29650.
もっとも好適なジアゾ樹脂はp−ジアゾジフェニルアミ
ンとホルムアルデヒドとの縮合物の2−メトキシ−4−
ヒドロキシ−5−ベンゾイルベンゼンスルホン酸塩であ
る。The most preferred diazo resin is 2-methoxy-4-condensate of p-diazodiphenylamine and formaldehyde.
Hydroxy-5-benzoylbenzene sulfonate.
ジアゾ樹脂の含有量は、感光層中に5〜50重量%含ま
れているのが適当である。ジアゾ樹脂の量が少なくなれ
ば感光性は当然大になるが、経時安定性が低下する。最
適のジアゾ樹脂の量は約8〜20重蓋%である。The appropriate content of the diazo resin in the photosensitive layer is 5 to 50% by weight. As the amount of diazo resin decreases, photosensitivity naturally increases, but stability over time decreases. The optimum amount of diazo resin is about 8 to 20 weight percent.
一方、バインダーとしては、種々の高分子化合物が使用
され得るが、本発明においては、ヒドロキシ、アミノ、
カルボン酸、アミド、スルホンアミド、活性メチレン、
チオアルコール、エポキシ等の基を含むものが望ましい
。このような好ましいバインダーには、英国特許第1,
350,521号明細書に記されているシェラツク、英
国特許筒L460,978号及び米国特許箱4,123
,276号の各明細書に記されているようなヒドロキシ
エチルアクリレート単位またはヒドロキシエチルメタク
リレート単位を主なる繰り返し単位として含むポリマー
、米国特許箱3,751.257号明細書に記されてい
るポリアミド樹脂、英国特許第1.074,392号明
細書に記されているフェノール樹脂及び例えばポリビニ
ルホルマール樹脂、ポリビニルブチラール樹脂のような
ポリビニルアセタール樹脂、米国特許箱3,660,0
97号明細書に記されている線状ポリウレタン樹脂、ポ
リビニルアルコールのフタレート化樹脂、ビスフェノー
ルAとエピクロルヒドリンから縮合されたエポキシ樹脂
、ポリアミノスチレンやポリアミノ(メタ)アク刀レー
トのようなアミノ基を含むポリマー酢酸セルロース、セ
ルロースアルキルエーテル、セルロースアセテートフタ
レート等のセルロース誘導体、特開昭61−26704
2号、同6258242号、同61−128123号の
各公報に記されているポリビニルアセタール樹脂、特開
昭62−1.23453号、同62−
123452号の各公報に記されているポリウレタン樹
脂等が包含される。On the other hand, various polymer compounds can be used as the binder, but in the present invention, hydroxy, amino,
Carboxylic acids, amides, sulfonamides, activated methylene,
Those containing groups such as thioalcohol and epoxy are desirable. Such preferred binders include those described in British Patent Nos.
350,521, British Patent Box L 460,978 and U.S. Patent Box 4,123.
Polymers containing hydroxyethyl acrylate units or hydroxyethyl methacrylate units as a main repeating unit as described in each specification of U.S. Patent No. 3,751.257, and polyamide resins described in U.S. Pat. , phenolic resins and polyvinyl acetal resins such as polyvinyl formal resins, polyvinyl butyral resins, as described in British Patent No. 1.074,392, US Pat. No. 3,660,0
Linear polyurethane resins, phthalated resins of polyvinyl alcohol, epoxy resins condensed from bisphenol A and epichlorohydrin, polymers containing amino groups such as polyaminostyrene and polyamino(meth)actolate, as described in No. 97. Cellulose derivatives such as cellulose acetate, cellulose alkyl ether, and cellulose acetate phthalate, JP-A-61-26704
2, 6258242, and 61-128123; polyurethane resins described in JP-A-62-1.23453 and JP-A-62-123452; is included.
(C)アジド化合物とバインダー(高分子化合物からな
る感光層)
例えば英国特許第1,235,281号、同第1.49
5,861号の各明細書及び特開昭51−32331号
、同51−36128号の各公報などに記されているア
ジド化合物と水溶性またはアルカリ可溶性高分子化合物
からなる組成物の他、特開昭50−5102号、同50
−84302号、同50−84303号、同53−12
984号の各公報などに記されているアジド基を含むポ
リマーとバインダーとしての高分子化合物からなる組成
物が含まれる。(C) Azide compound and binder (photosensitive layer consisting of a polymer compound) For example, British Patent No. 1,235,281, British Patent No. 1.49
In addition to the compositions comprising an azide compound and a water-soluble or alkali-soluble polymer compound described in the specification of No. 5,861 and the publications of JP-A-51-32331 and JP-A-51-36128, Kaisho 50-5102, same 50
-84302, 50-84303, 53-12
Included are compositions consisting of a polymer containing an azide group and a polymer compound as a binder, which are described in various publications such as No. 984.
(D)その他の感光性樹脂層
例えば、特開昭52−96696号に開示されているポ
リエステル化合物、英国特許第112,277号、同第
1,313,390号、同第1,341,004号、同
第L377.747号の各明細書に記載のポリビニルシ
ンナメート系樹脂、米国特許箱4.072,528号お
よび同第4,072,527号の各明細書などに記され
ている光重合型フォトポリマー組成物が含まれる。又、
特開昭60−107042号公報に示されている電子写
真感光材料を用いる場合も含まれる。(D) Other photosensitive resin layers For example, polyester compounds disclosed in JP-A-52-96696, British Patent No. 112,277, British Patent No. 1,313,390, British Patent No. 1,341,004 Polyvinyl cinnamate resins described in the specifications of U.S. Patent No. 4,072,528 and U.S. Patent No. 4,072,527 Polymerizable photopolymer compositions are included. or,
This also includes the use of the electrophotographic light-sensitive material disclosed in JP-A-60-107042.
前記(A)〜(D)の感光性層には更に種々の添加剤を
加えることができる。例えば、塗布性を改良するための
アルキルエーテル類(例えば、エチルセルロース、メチ
ルセルロース)や弗素系界面活性剤、塗膜の柔軟性、耐
摩耗性を付与するための可塑剤(例えば、トリクレジル
ホスフェート、ジメチルフタレート、ジブチルフタレー
ト、トリオクチルホスフェート、トリブチルホスフェー
ト、クエン酸トリブチル、ポリエチレングリコール、ポ
リプロピレングリコール)、現像後の画像部を可視画化
するための着色物質としてアクリジン染料、シアニン染
料、スチリル染料、トリフェニルメタン染料やフタロシ
アニンなどの顔料や、その他−船釣な安定化剤(燐酸、
亜燐酸、ピロ燐酸、蓚酸、ホウ酸、ベンゼンスルホン酸
、トルエンスルホン酸、リンゴ酸、ジピコリン酸、ポリ
アクリル酸及びその共重合体、ポリビニルホスホン酸及
びその共重合体、ポリビニルスルホン酸及びその共重合
体、5−ニトロナフタレン−1−ホスホン酸、4−クロ
ロフェノキシメチルホスホン酸、ナトリウムフェニル−
メチル−ピラゾロンスルホネート、2−ホスホノブタン
トリカルボン酸−1゜24.1−ホスホノエタントリカ
ルボン酸−122,1−ヒドロキシエタン−1、エージ
スルホン酸)を添加することが出来る。これらの添加剤
の添加量はその使用対象目的によって異なるが、一般に
は感光性層の全固形分に対して0.5〜30重量%であ
る。Various additives can be further added to the photosensitive layers (A) to (D). For example, alkyl ethers (e.g., ethyl cellulose, methyl cellulose) and fluorine-based surfactants to improve coating properties, plasticizers (e.g., tricresyl phosphate, dimethyl phthalate, dibutyl phthalate, trioctyl phosphate, tributyl phosphate, tributyl citrate, polyethylene glycol, polypropylene glycol), acridine dye, cyanine dye, styryl dye, triphenyl as a coloring substance to visualize the image area after development. Pigments such as methane dyes and phthalocyanines, and other stabilizing agents (phosphoric acid,
Phosphorous acid, pyrophosphoric acid, oxalic acid, boric acid, benzenesulfonic acid, toluenesulfonic acid, malic acid, dipicolinic acid, polyacrylic acid and its copolymers, polyvinylphosphonic acid and its copolymers, polyvinylsulfonic acid and its copolymers combination, 5-nitronaphthalene-1-phosphonic acid, 4-chlorophenoxymethylphosphonic acid, sodium phenyl-
Methyl-pyrazolone sulfonate, 2-phosphonobutanetricarboxylic acid-1, 24.1-phosphonoethanetricarboxylic acid-122,1-hydroxyethane-1, and agedisulfonic acid) can be added. The amount of these additives added varies depending on the purpose for which they are used, but is generally 0.5 to 30% by weight based on the total solid content of the photosensitive layer.
本発明における感光性組成物の塗布量は、固形分として
0.1〜7g/m2が好ましく、より好ましくは0.5
〜5g/m2である。これらの感光層には必要により、
中間層に用いられるアクリルシリコーン樹脂を添加して
も良い。このアクリルシリコーン樹脂の添加量は感光性
組成物の種類により異なるが、感光性層の全固形分量に
対し0.01〜10重量%が適当であり、好ましくは0
.05〜5重量%である。The coating amount of the photosensitive composition in the present invention is preferably 0.1 to 7 g/m2 as solid content, more preferably 0.5 g/m2.
~5g/m2. For these photosensitive layers, if necessary,
An acrylic silicone resin used for the intermediate layer may be added. The amount of this acrylic silicone resin added varies depending on the type of photosensitive composition, but is suitably 0.01 to 10% by weight, preferably 0.01 to 10% by weight based on the total solid content of the photosensitive layer.
.. 05 to 5% by weight.
上記の感光性組成物は適当な溶剤に溶かして支持体上に
塗布する。ここで使用する溶媒として、エチレンジクロ
ライド、シクロヘキサノン、メチルエチルケトン、エチ
レングリコールモノメチルエーテル、エチレングリコー
ルモノエチルエーテル、2−メトキシエチルアセテート
、1−メトキシ−2−プロパツール、■−メトキシー2
−プロピルアセテート、トルエン、酢酸エチル、乳酸メ
チル、乳酸エチル、ジメチルスルホキシド、ジメチルア
セトアミド、ジメチルホルムアミド、水、N−メチルピ
ロリドン、テトラヒドロフルフリルアルコール、アセト
ン、ジアセトンアルコール、メタノール、エタノール、
イソプロパツール、ジエチレングリコールジメチルエー
テルなどがあり、これらの溶媒を単独あるいは混合して
使用する。The above photosensitive composition is dissolved in a suitable solvent and applied onto a support. Solvents used here include ethylene dichloride, cyclohexanone, methyl ethyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, 1-methoxy-2-propanol, -methoxy 2
-propyl acetate, toluene, ethyl acetate, methyl lactate, ethyl lactate, dimethyl sulfoxide, dimethylacetamide, dimethylformamide, water, N-methylpyrrolidone, tetrahydrofurfuryl alcohol, acetone, diacetone alcohol, methanol, ethanol,
Examples include isopropanol and diethylene glycol dimethyl ether, and these solvents can be used alone or in combination.
溶液中の固型分濃度は、通常2〜50重量%である。The solid content concentration in the solution is usually 2 to 50% by weight.
アルミニウム板上に感光性組成物溶液を塗布する方法と
しては従来公知の方法、たとえばロールコーティング、
バーコーティング、スプレーコーティング、カーテンコ
ーティング、回転塗布等の方法を用いることができる。Conventionally known methods for applying the photosensitive composition solution onto the aluminum plate include roll coating,
Methods such as bar coating, spray coating, curtain coating, and spin coating can be used.
上記のようにして設けられた感光層の表面は、真空焼枠
を用いた密着露光の際の真空引きの時間を短縮し、かつ
焼きボケを防ぐ為、特開昭50=125805号、特公
昭57−6582号、特公昭61−28986号の各公
報に記載されているようなマット層を設ける方法、特公
昭62−62337号公報に記載されているような固体
粉末を熱融着させる方法などがあげられる。The surface of the photosensitive layer provided as described above was prepared in accordance with Japanese Patent Application Laid-open No. 125805 (1973) and Japanese Patent Publication No. 125805, in order to shorten the evacuation time during contact exposure using a vacuum printing frame and to prevent blurring. A method of providing a matte layer as described in Japanese Patent Publication No. 57-6582 and Japanese Patent Publication No. 61-28986, a method of heat-sealing solid powder as described in Japanese Patent Publication No. 62-62337, etc. can be given.
本発明の感光性平版印刷版から平版印刷版を作成する製
版方法は、従来より行なわれている方法をそのまま利用
することができる。即ち、線画像および/または網点画
像を有する透明原画を通して露光し、次いで現像液で処
理すると非画像部の感光層が除去される。露光時に使用
される好適な光源としては、水銀灯、キセノンランプ、
ケミカルランプ、メタルハライドランプ、ストロボなど
が使用される。また現像液としては、感光層の組成に合
わせて適当なものを使用すれば良く、例えばジアゾ化合
物と有機高分子バインダーからなる感光層に対しては、
米国特許第3,475,171号、同第3,669,6
60号、同第4,186,006号などに記載されてい
る水性アルカリ現像液が使用される。As a plate-making method for producing a lithographic printing plate from the photosensitive lithographic printing plate of the present invention, a conventional method can be used as is. That is, exposure through a transparent original having a line image and/or halftone image and subsequent treatment with a developer removes the photosensitive layer in the non-image areas. Suitable light sources used during exposure include mercury lamps, xenon lamps,
Chemical lamps, metal halide lamps, strobes, etc. are used. Further, as a developer, an appropriate developer may be used depending on the composition of the photosensitive layer. For example, for a photosensitive layer consisting of a diazo compound and an organic polymer binder,
U.S. Patent No. 3,475,171, U.S. Patent No. 3,669,6
An aqueous alkaline developer described in No. 60, No. 4,186,006, etc. is used.
〔発明の効果]
本発明の感光性平版印刷版は、高性能印刷版に対して現
場で要求される高耐剛性、種々の薬品に対する耐性、現
像性等に優れ、親水性が高く汚染しにくく、特に、支持
体と感光層の接着力が向上し、オフセット輪転印刷機に
おける高速かつ苛酷な印刷条件でも高耐刷力を有し、か
つクリーナー等の薬品に対する耐性を大巾に改善するこ
とができる。[Effects of the Invention] The photosensitive lithographic printing plate of the present invention has excellent rigidity, resistance to various chemicals, developability, etc. required in the field for high-performance printing plates, and is highly hydrophilic and resistant to contamination. In particular, the adhesion between the support and the photosensitive layer is improved, it has high printing durability even under the high speed and harsh printing conditions of rotary offset printing presses, and it has significantly improved resistance to chemicals such as cleaners. can.
〈実施例〉
以下、本発明を実施例に基づいて詳細に説明するが、こ
れにより本発明の実施態様が限定されるものではない。<Examples> Hereinafter, the present invention will be described in detail based on Examples, but the embodiments of the present invention are not limited thereby.
実施例中の%は特に記されていない限り重量%とする。The percentages in the examples are by weight unless otherwise specified.
合成例1
(中間層用樹脂組成物1の合成)
三洋化成工業■製ポリウレタン“サンブレンLQ−39
0”(メチルエチルケトン/イソプロピルアルコール−
2フ1重量%溶剤に固形分42重量%溶解した)溶液7
1.4 gを約80°Cに加熱し、下記組成のモノマー
及び熱重合開始剤を約30分間かけて滴下した。Synthesis Example 1 (Synthesis of Resin Composition 1 for Intermediate Layer) Polyurethane "Sunbren LQ-39" manufactured by Sanyo Chemical Industries, Ltd.
0” (methyl ethyl ketone/isopropyl alcohol-
Solution 7 (solid content 42% by weight dissolved in 2F 1% by weight solvent)
1.4 g was heated to about 80°C, and monomers and a thermal polymerization initiator having the following composition were added dropwise over about 30 minutes.
(1)メタクリル酸メチル 30g(2)
T−メタクリロキシプロピル
トリエトキシシラン 18g(3)2.2
’−アゾビス(2,4
ジメチルバレロニトリル) 1.80mg滴下後
80°Cで約2時間加熱し、アゾビス(2゜4−ジメチ
ルバレロニトリル)180mgを添加し、更に80°C
で3時間加熱して中間層用樹脂組成物1を得た。(1) Methyl methacrylate 30g (2)
T-methacryloxypropyltriethoxysilane 18g (3) 2.2
'-Azobis(2,4-dimethylvaleronitrile) 1.80mg was added dropwise, heated at 80°C for about 2 hours, 180mg of azobis(2°4-dimethylvaleronitrile) was added, and further heated to 80°C.
The mixture was heated for 3 hours to obtain intermediate layer resin composition 1.
合成例2
(中間層用樹脂組成物2の合成)
特開昭51−99810号にその合成法が記載されてい
る次のアクリル樹脂共重合体
をメチルエチルケトン60.4 gに溶解した。次いで
、γ−グリシドキシプロピルトリメトキシシラン2.3
6 gを添加した後、80°Cで2時間加熱して中間層
用樹脂組成物2を得た。Synthesis Example 2 (Synthesis of Resin Composition 2 for Intermediate Layer) The following acrylic resin copolymer, the synthesis method of which is described in JP-A-51-99810, was dissolved in 60.4 g of methyl ethyl ketone. Next, γ-glycidoxypropyltrimethoxysilane 2.3
After adding 6 g, the mixture was heated at 80°C for 2 hours to obtain intermediate layer resin composition 2.
実施例1
厚さ0.24111Iのアルミニウム板(JIS A
1050材)を10%水酸化ナトリウム水溶液中に50
°Cで20秒間浸漬して、脱脂/クリーニング処理を行
なった後、水洗し、次いで10%硝酸水溶液で中和洗浄
した。水洗後、粒径10〜80μm、平均301!mの
バミスを水に20%懸濁した液を研摩材として、回転ナ
イロンブラシ(太さ480μm、回転数30Orpm)
で表面を砂目室てした。このときの表面粗さ(中心線平
均粗さ)は0.5μmであった。水洗後、10%苛性ソ
ーダ水溶液を70°Cに温めた溶液中に12秒間浸漬し
て、アルミニウムの溶解量が6g/m”となるようにエ
ツチングした。水洗後、30%硝酸水溶液に常温で1分
間浸漬して中和し、十分水洗した。Example 1 Aluminum plate with a thickness of 0.24111I (JIS A
1050 material) in a 10% aqueous sodium hydroxide solution.
After degreasing/cleaning was performed by immersion at °C for 20 seconds, it was washed with water and then neutralized with a 10% nitric acid aqueous solution. After washing with water, particle size is 10-80 μm, average 301! A rotating nylon brush (thickness 480 μm, number of rotations 30 Orpm) was used as an abrasive using a 20% suspension of Bamisu m in water as an abrasive.
The surface was sand-grained. The surface roughness (center line average roughness) at this time was 0.5 μm. After washing with water, etching was carried out by immersing it in a 10% aqueous solution of caustic soda heated to 70°C for 12 seconds so that the amount of aluminum dissolved was 6 g/m. After washing with water, it was immersed in a 10% aqueous solution of nitric acid at room temperature for 12 seconds. It was soaked for a minute to neutralize it and thoroughly washed with water.
次に、濃度9g/2の硝酸水溶液を電解液として、特開
昭51−152302号公報記載の交番波形電流を用い
て電解粗面化処理した。電解条件は、周波数60Hz、
陽極時電流密度40 A /dra”で10秒間、電解
粗面化処理した。次いで、電解粗面化処理で生成したス
マットを60°Cで20%の硫酸水溶液に1分間浸漬し
て溶解除去した。Next, an electrolytic surface roughening treatment was performed using an aqueous nitric acid solution having a concentration of 9 g/2 as an electrolyte and an alternating waveform current described in JP-A-51-152302. The electrolytic conditions were a frequency of 60Hz,
Electrolytic surface roughening treatment was performed for 10 seconds at an anode current density of 40 A/dra''.Then, the smut generated by the electrolytic surface roughening treatment was immersed in a 20% sulfuric acid aqueous solution at 60°C for 1 minute to dissolve and remove it. .
このアルミニウム板を30°Cの15%硫酸水溶液中で
直流を用いて、3A/dm”で1.5分間陽極酸化皮膜
重量が2g/m”となるように陽極酸化処理し、水洗後
、3.0%珪酸ナトリウム水溶液70℃に30秒間浸漬
処理して水洗し、100゜の熱風で60秒間乾燥した。This aluminum plate was anodized using direct current in a 15% sulfuric acid aqueous solution at 30°C for 1.5 minutes at 3 A/dm so that the anodic oxide film weight was 2 g/m, and after washing with water, It was immersed in a 0% sodium silicate aqueous solution at 70°C for 30 seconds, washed with water, and dried with hot air at 100° for 60 seconds.
引続いて、得られたアルミニウム支持体上に、合成例1
の中間層用樹脂組成物1をトルエン溶液に希釈して0.
2%とした塗布液をホイラー塗布機で乾燥塗布量が50
mg/m”となる様に塗布し、100°Cの熱風で12
0秒間乾燥して中間層を設けた。Subsequently, Synthesis Example 1 was applied onto the obtained aluminum support.
Intermediate layer resin composition 1 was diluted with a toluene solution to give 0.
The dry coating amount was 50% using a wheeler coater using a 2% coating solution.
12 mg/m” with hot air at 100°C.
The intermediate layer was formed by drying for 0 seconds.
このようにして得られた、支持体上に設けた中間層上に
下記組成の感光液を塗布し、乾燥して感光層を設けた。A photosensitive liquid having the following composition was applied onto the thus obtained intermediate layer provided on the support and dried to provide a photosensitive layer.
感光層の乾燥塗布量は2.0g/m”であった。The dry coating weight of the photosensitive layer was 2.0 g/m''.
感光液
N−(4−ヒドロキシフェニル)メタクリルアミド/2
−ヒドロキシエチルメタクリレート/アクリロニトリル
/メチルメタクリレート/メタクリル酸(=15:10
:30:38ニアモル比)共重合体(平均分子量600
00) 5.0g4−ジアゾジ
フェニルアミンとホルムアルデヒドの縮合物の六弗化燐
酸塩 0.5g亜燐酸
0.05 gビクトリアピュアーブルーBOH
(採土ケ谷化学■社製) 0.1.g2−メ
トキシエタノール 100gこうして作成した
感光性平版印刷版をメタルハライドランプを光源として
、ネガ画像フィルムを通して露光後、富士写真フィルム
社製ネガ型PS版現像液DN−3Cの標準液にて現像処
理して、さらにガム引きして平版印刷版とした。Photosensitive liquid N-(4-hydroxyphenyl)methacrylamide/2
-Hydroxyethyl methacrylate/acrylonitrile/methyl methacrylate/methacrylic acid (=15:10
:30:38 near molar ratio) copolymer (average molecular weight 600
00) 5.0g 4-diazodiphenylamine and formaldehyde condensate hexafluorophosphate 0.5g phosphorous acid
0.05 g Victoria Pure Blue BOH (manufactured by Odogaya Chemical Co., Ltd.) 0.1. g2-Methoxyethanol 100g The photosensitive lithographic printing plate thus prepared was exposed through a negative image film using a metal halide lamp as a light source, and then developed with a standard solution of negative PS plate developer DN-3C manufactured by Fuji Photo Film Co., Ltd. , and further gummed to make a lithographic printing plate.
30分後に、インキ(東洋インキ昧製−eb King
スミ)と浸し水(富士写真フィルム■製EU−3100
倍希釈液)を用いて、小森印刷機■製オフセット輪転印
刷機(機種システム18 L R−418)で申越パル
プ■製のザラ紙に標準の印圧、40.000枚/時のス
ピードで印刷した。このようにして得られた平版印刷版
の耐刷枚数は120,000枚であった(以後、耐刷力
120,000枚と表わす)。After 30 minutes, ink (manufactured by Toyo Ink - eb King)
ink) and soaking water (EU-3100 manufactured by Fuji Photo Film)
Using Komori Printing Co., Ltd.'s offset rotary press (model system 18 L R-418), the standard printing pressure was applied to rough paper made by Shin'etsu Pulp ■ at a speed of 40,000 sheets/hour. Printed. The printing life of the lithographic printing plate thus obtained was 120,000 sheets (hereinafter referred to as printing durability 120,000 sheets).
また、10,000枚印刷ごとに印刷機を止めて、富士
写真フィルム■製プレートクリーナーCN−4をスポン
ジに付けて画像部に塗り、1分後に水ふきした。In addition, after every 10,000 sheets were printed, the printing press was stopped, and plate cleaner CN-4 manufactured by Fuji Photo Film ■ was applied to the image area with a sponge, and after 1 minute, it was wiped with water.
このようにして、画像部の、クリーナーに対する耐性を
調べた結果、100,000枚まで印刷可能であった(
以後、クリーナー適性100,000枚と表わす)。In this way, we investigated the resistance of the image area to cleaners and found that it was possible to print up to 100,000 sheets (
(hereinafter referred to as cleaner suitability 100,000 sheets).
実施例2
実施例1と同様にアルミニウム板の表面を粗面化し、陽
極酸化した後、珪酸ナトリウム水溶液で処理した。この
ようにして得られたアルミニウム支持体上に合成例2の
中間層用樹脂組成物2をトルエン溶液に希釈して0.2
%とした塗布液をホイラー塗布機で乾燥塗布量が5Qm
g/m”となる様に塗布し、100°Cの熱風で120
秒乾燥して中間層を設けた。Example 2 The surface of an aluminum plate was roughened and anodized in the same manner as in Example 1, and then treated with an aqueous sodium silicate solution. Intermediate layer resin composition 2 of Synthesis Example 2 was diluted with a toluene solution to 0.2
% coating liquid with a wheeler coating machine with a dry coating amount of 5Qm.
g/m” and apply it to 120 g/m with hot air at 100°C.
After drying for a few seconds, an intermediate layer was formed.
感光層塗布以降は、実施例1記載の処理を繰り返した。After coating the photosensitive layer, the process described in Example 1 was repeated.
耐刷枚数は120,000枚であった。また、クリーナ
ー適性は100,000枚であった。The printing durability was 120,000 sheets. Further, the suitability for cleaning was 100,000 sheets.
実施例3
実施例1と同様にアルミニウム板の表面を粗面化し、陽
極酸化した後、珪酸ナトリウム水溶液で処理した。この
ようにして得られたアルミニウム支持体上に、合成例1
の中間層用樹脂組成物1を乾燥塗布量が500vag/
m”となる様に塗布して、中間層を設けた。Example 3 The surface of an aluminum plate was roughened and anodized in the same manner as in Example 1, and then treated with an aqueous sodium silicate solution. On the thus obtained aluminum support, Synthesis Example 1
The dry coating amount of intermediate layer resin composition 1 was 500 vag/
An intermediate layer was formed by applying the coating to a thickness of 100 m''.
感光層塗布以降は、実施例1記載の処理を繰り返した。After coating the photosensitive layer, the process described in Example 1 was repeated.
耐刷枚数は120,000枚であった。また、クリーナ
ー適性は100,000枚であった。The printing durability was 120,000 sheets. Further, the suitability for cleaning was 100,000 sheets.
なお、上記実施例1〜3ではジアゾ樹脂とバインダーか
らなる感光層の場合について示したが、0−キノンジア
ジド化合物からなる感光層、アジド化合物とバインダー
からなる感光層、光重合型フォトポリマー組成物からな
る感光層の場合についても同様の効果が得られた。In Examples 1 to 3 above, the case of a photosensitive layer made of a diazo resin and a binder was shown, but a photosensitive layer made of an 0-quinonediazide compound, a photosensitive layer made of an azide compound and a binder, and a photosensitive layer made of a photopolymerizable photopolymer composition were used. A similar effect was obtained in the case of the photosensitive layer.
比較例1
実施例1と同様にアルミニウム板の表面を粗面化し、陽
極酸化した後、珪酸ナトリウム水溶液で処理した。その
後、得られたアルミニウム支持体上に中間層を設けなか
った。Comparative Example 1 The surface of an aluminum plate was roughened and anodized in the same manner as in Example 1, and then treated with an aqueous sodium silicate solution. Thereafter, no intermediate layer was provided on the resulting aluminum support.
感光層塗布以降は、実施例1記載の処理を繰り返した。After coating the photosensitive layer, the process described in Example 1 was repeated.
耐刷枚数は80,000枚であった。また、クリーナー
適性は30,000枚であった。The printing durability was 80,000 sheets. Further, the suitability for cleaning was 30,000 sheets.
比較例2
実施例1と同様にアルミニウム板の表面を粗面化し、陽
極酸化した。その後、得られたアルミニウム支持体を1
.0重量%ポリビニルホスホン酸水溶液25℃に30秒
浸漬処理した後100°Cで乾燥した。その後、得られ
たアルミニウム支持体上に中間層を設けなかった。Comparative Example 2 The surface of an aluminum plate was roughened and anodized in the same manner as in Example 1. After that, the obtained aluminum support was
.. It was immersed in a 0% by weight polyvinylphosphonic acid aqueous solution at 25°C for 30 seconds and then dried at 100°C. Thereafter, no intermediate layer was provided on the resulting aluminum support.
感光層塗布以降は、実施例1記載の処理を繰り返した。After coating the photosensitive layer, the process described in Example 1 was repeated.
耐刷枚数はso、ooo枚であった。また、クリーナー
適性は40,000枚であった。The number of printing sheets was so, ooo. Further, the suitability for cleaning was 40,000 sheets.
比較例3
実施例1と同様にアルミニウム板の表面を粗面化し、陽
極酸化した後、珪酸ナトリウム水溶液で処理した。この
ようにして得られたアルミニウム支持体上に、ポリアク
リル酸(日本純薬■製、商品名ジュリマーAC−1OL
)を乾燥塗布量が100mg/m”になる様に塗布して
中間層を設けた。Comparative Example 3 The surface of an aluminum plate was roughened and anodized in the same manner as in Example 1, and then treated with an aqueous sodium silicate solution. Polyacrylic acid (manufactured by Nippon Pure Chemical Industries Ltd., trade name Jurimer AC-1OL) was placed on the aluminum support thus obtained.
) was applied in a dry coating amount of 100 mg/m'' to form an intermediate layer.
感光層塗布以降は、実施例1記載の処理を繰り返した。After coating the photosensitive layer, the process described in Example 1 was repeated.
耐刷枚数は70,000枚であった。また、クリーナー
適性は30,000枚であった。The printing durability was 70,000 sheets. Further, the suitability for cleaning was 30,000 sheets.
1、事件の表示
2、発明の名称
3、補正をする者
事件との関係
4、代
平成2年特許願第20
1万
感光性平版印刷版
富士写真フィルム株式会社
5、補正命令の日付
方式
6、補正の対象
明細書の発明の詳細な説明の欄
7、補正の内容
(1)明細書第3頁第16行の“これ”の後に「ら」を
挿入する。1. Indication of the case 2. Name of the invention 3. Relationship between the person making the amendment and the case 4. 1990 Patent Application No. 20 10,000 photosensitive lithographic printing plate Fuji Photo Film Co., Ltd. 5. Date system of the amendment order 6. , Column 7 of Detailed Description of the Invention of the Specification Subject to Amendment, Contents of the Amendment (1) Insert "ra" after "Kore" on page 3, line 16 of the specification.
(2)同書同頁第18行の“容易”の前の「ら」を削除
する。(2) Delete "ra" before "easy" in line 18 of the same page of the same book.
(3)同書第25頁第20行の“特開昭”の前に「マッ
ト化することが好ましい。具体的には」を挿入する。(3) On page 25, line 20 of the same book, insert ``It is preferable to make it matte.Specifically'' before ``JP-A-Sho''.
Claims (1)
版印刷版において、該支持体と該非シリコーン系感光層
の間に、下記一般式で示される繰り返し単位を有する重
合体を含有する中間層を設けたことを特徴とする感光性
平版印刷版。 ▲数式、化学式、表等があります▼ 〔式中、R^1:H又はCH_3R^2、R^3:H、
アルキル基またはアリール基n:1〜10の整数m:1
、2または3である。〕[Scope of Claims] In a photosensitive lithographic printing plate comprising a non-silicone photosensitive layer on a support, a polymer having a repeating unit represented by the following general formula is provided between the support and the non-silicone photosensitive layer. A photosensitive lithographic printing plate characterized by having an intermediate layer containing coalescence. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the formula, R^1:H or CH_3R^2, R^3:H,
Alkyl group or aryl group n: an integer of 1 to 10 m: 1
, 2 or 3. ]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20191790A JPH0485541A (en) | 1990-07-30 | 1990-07-30 | Photosensitive planographic printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20191790A JPH0485541A (en) | 1990-07-30 | 1990-07-30 | Photosensitive planographic printing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485541A true JPH0485541A (en) | 1992-03-18 |
Family
ID=16448947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20191790A Pending JPH0485541A (en) | 1990-07-30 | 1990-07-30 | Photosensitive planographic printing plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485541A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510481A (en) * | 1990-11-26 | 1996-04-23 | The Regents, University Of California | Self-assembled molecular films incorporating a ligand |
| JP2006276768A (en) * | 2005-03-30 | 2006-10-12 | Kodak Polychrome Graphics Japan Ltd | Photosensitive planographic printing plate |
-
1990
- 1990-07-30 JP JP20191790A patent/JPH0485541A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510481A (en) * | 1990-11-26 | 1996-04-23 | The Regents, University Of California | Self-assembled molecular films incorporating a ligand |
| JP2006276768A (en) * | 2005-03-30 | 2006-10-12 | Kodak Polychrome Graphics Japan Ltd | Photosensitive planographic printing plate |
| WO2006109454A1 (en) * | 2005-03-30 | 2006-10-19 | Kodak Graphic Communications Japan Ltd. | Photosensitive lithographic printing plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3023570B2 (en) | Photosensitive lithographic printing plate support | |
| US5900345A (en) | Surfactant in precoat for lithographic plates | |
| JP2652093B2 (en) | Photosensitive composition | |
| JPH09160233A (en) | Radiation-sensitive recording material for manufacture of planographic printing plate | |
| JPH01160690A (en) | Method for electrolytically roughening lithographic aluminum substrate | |
| JPH1159007A (en) | Light-sensitive lithographic printing plate | |
| JPH05278362A (en) | Production of photosensitive planographic printing plate | |
| JP2648981B2 (en) | Photosensitive lithographic printing plate | |
| JP2571458B2 (en) | Manufacturing method of photosensitive lithographic printing plate | |
| JP2720224B2 (en) | Photosensitive lithographic printing plate | |
| US6517988B1 (en) | Radiation-sensitive, positive working coating composition based on carboxylic copolymers | |
| JPH0421184B2 (en) | ||
| JPH028919B2 (en) | ||
| GB2043281A (en) | Producing photosensitive lithographic printing plates | |
| JP3574987B2 (en) | Photosensitive lithographic printing plate material and method of preparing lithographic printing plate | |
| JP3142185B2 (en) | Manufacturing method of photosensitive lithographic printing plate | |
| JPH0798432B2 (en) | Method for producing aluminum support for lithographic printing plate | |
| JP2902382B2 (en) | Diazo-based imaging elements with enhanced sensitivity | |
| JPH03215098A (en) | Manufacture of support for planographic printing plate | |
| JPH05221177A (en) | Photosensitive lithographic printing plate | |
| JP2000015948A (en) | Aluminum support for lithographic printing plate and method for producing photosensitive lithographic printing plate | |
| JPH09109571A (en) | Manufacture of photosensitive lithographic printing plate | |
| JPH11212251A (en) | Photosensitive planographic printing plate and production of planographic printing plate | |
| JPH03243961A (en) | Production of photosensitive planographic printing plate | |
| JPH0213956A (en) | Photosensitive planographic printing plate |