JPH0485716U - - Google Patents
Info
- Publication number
- JPH0485716U JPH0485716U JP12831890U JP12831890U JPH0485716U JP H0485716 U JPH0485716 U JP H0485716U JP 12831890 U JP12831890 U JP 12831890U JP 12831890 U JP12831890 U JP 12831890U JP H0485716 U JPH0485716 U JP H0485716U
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- lead members
- radial direction
- component body
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 7
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の回路部品１１を配
線基板１５に配置した斜視図、第２図は第１図に
示される回路部品１１を配線基板１５に配置した
正面図、第３図は第１図に示される回路部品１１
を配線基板１５に配置した側面図、第４図は第２
図の切断面線−から見た側断面図、第５図は
第２図の切断面線−から見た底断面図、第６
図は第２図の切断面線−から見た側断面図、
第７図は本考案の他の実施例の回路部品１１ａを
配線基板１５に配置した側断面図、第８図は本考
案のさらに他の実施例の回路部品１１ｃを配線基
板１８に配置した側断面図、第９図は本考案の他
の実施例の回路部品１１ｄを配線基板１８に配置
した側断面図、第１０図は本考案のさらに他の実
施例のリード１３ｆに形成されている支持突起１
７ｆの底断面図、第１１図は本考案の一実施例で
ある回路部品製造装置２１の回路部品１１押圧時
の底断面図、第１２図は第１の従来例を示す図、
第１３図は第１２図に示される従来例の側面図、
第１４図は第２の従来例を示す図、第１５図は第
１４図の切断面線−から見た断面図であ
る。
１１，１１ａ，１１ｃ，１１ｄ……回路部品、
１２……本体、１３，１３ｃ，１３ｄ，１３ｅ，
１３ｆ，１４……リード、１５，１８……配線基
板、１６ａ，１６ｂ，１９……挿通孔、１７ａ，
１７ｂ，１７ｃ，１７ｄ，１７ｅ，１７ｆ……支
持突起、２１……回路部品製造装置、２２……第
１部材、２３……第２部材。
FIG. 1 is a perspective view of a circuit component 11 according to an embodiment of the present invention arranged on a wiring board 15, FIG. 2 is a front view of the circuit component 11 shown in FIG. 1 arranged on a wiring board 15, and FIG. is the circuit component 11 shown in FIG.
FIG. 4 is a side view of the wiring board 15 arranged with
Fig. 5 is a side sectional view taken from the cutting plane line - in Fig. 5, a bottom sectional view taken from the cutting plane line - in Fig. 2, and Fig. 6
The figure is a side sectional view taken from the cutting plane line - in Figure 2.
FIG. 7 is a side sectional view of a circuit component 11a according to another embodiment of the present invention arranged on a wiring board 15, and FIG. 8 is a side sectional view of a circuit component 11c according to still another embodiment of the present invention arranged on a wiring board 18. 9 is a side sectional view of a circuit component 11d according to another embodiment of the present invention arranged on a wiring board 18, and FIG. 10 is a support formed on a lead 13f of still another embodiment of the present invention. Protrusion 1
7f, FIG. 11 is a bottom sectional view of the circuit component manufacturing apparatus 21 according to an embodiment of the present invention when the circuit component 11 is pressed, and FIG. 12 is a diagram showing the first conventional example.
FIG. 13 is a side view of the conventional example shown in FIG.
FIG. 14 is a diagram showing a second conventional example, and FIG. 15 is a sectional view taken along the cutting plane line - in FIG. 14. 11, 11a, 11c, 11d...circuit components,
12...Main body, 13, 13c, 13d, 13e,
13f, 14... Lead, 15, 18... Wiring board, 16a, 16b, 19... Insertion hole, 17a,
17b, 17c, 17d, 17e, 17f... Support projection, 21... Circuit component manufacturing device, 22... First member, 23... Second member.
Claims (1)
、 回路部品本体と、 前記回路部品本体から突出し、配線基板に設け
られる挿通孔に挿通される複数のリード部材であ
つて、回路部品本体における各リード部材の突出
位置に関する半径方向と交差する方向に突出した
支持突起が、前記交差する方向の両側にそれぞれ
形成されているリード部材とを含むことを特徴と
する回路部品。 (2) 回路部品本体と、回路部品本体から突出す
る複数のリード部材とを備える回路部品のリード
部材を加工する回路部品の製造装置において、 回路部品本体に関して略対称な配置位置の複数
のリード部材の各配置位置に対する半径方向に沿
う共通する一方側に配置され、前記複数のリード
部材の前記共通する一方側を押圧する前記半径方
向と交差する方向に延びる第１押圧面を有する第
１押圧部材と、 前記略対称な配置位置の複数のリード部材の各
配置位置に対する半径方向に沿う共通する他方側
に配置され、前記複数のリード部材の共通する他
方側を押圧する前記半径方向と交差する方向に延
びる第２押圧面を有する第２押圧部材とを含み、 第１部材および第２部材で複数のリード部材を
押圧し、複数のリード部材の押圧部分を前記第１
押圧面および前記第２押圧面に沿つて延展させる
ようにしたことを特徴とする回路部品製造装置。[Scope of Claim for Utility Model Registration] (1) A circuit component mounted on a wiring board, comprising: a circuit component body; and a plurality of lead members protruding from the circuit component body and inserted into insertion holes provided in the wiring board. A circuit characterized in that support protrusions protruding in a direction intersecting a radial direction with respect to the protruding position of each lead member in the circuit component body include lead members formed on both sides of the intersecting direction. parts. (2) In a circuit component manufacturing apparatus that processes lead members of a circuit component that includes a circuit component body and a plurality of lead members protruding from the circuit component body, the plurality of lead members are arranged at approximately symmetrical positions with respect to the circuit component body. a first pressing member disposed on one common side along a radial direction with respect to each arrangement position, and having a first pressing surface extending in a direction intersecting the radial direction that presses the common one side of the plurality of lead members; and a direction intersecting the radial direction that is arranged on the other common side along the radial direction with respect to each arrangement position of the plurality of lead members arranged in substantially symmetrical arrangement positions, and presses the other common side of the plurality of lead members. a second pressing member having a second pressing surface extending to the first member, the first member and the second member press the plurality of lead members, and the pressing portion of the plurality of lead members
A circuit component manufacturing apparatus characterized in that the circuit component manufacturing apparatus is configured to spread along a pressing surface and the second pressing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128318U JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128318U JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485716U true JPH0485716U (en) | 1992-07-24 |
| JP2592093Y2 JP2592093Y2 (en) | 1999-03-17 |
Family
ID=31875784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990128318U Expired - Fee Related JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2592093Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584067A (en) * | 1978-12-20 | 1980-06-24 | Hitachi Ltd | Misoperation preventing device for magnetic recorder/ reproducer |
| JPS5834727U (en) * | 1981-09-01 | 1983-03-07 | 松下電器産業株式会社 | Electronic components for printed circuit boards |
| JPS6355491U (en) * | 1986-09-25 | 1988-04-13 | ||
| JPH0213705U (en) * | 1988-07-11 | 1990-01-29 |
-
1990
- 1990-11-29 JP JP1990128318U patent/JP2592093Y2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584067A (en) * | 1978-12-20 | 1980-06-24 | Hitachi Ltd | Misoperation preventing device for magnetic recorder/ reproducer |
| JPS5834727U (en) * | 1981-09-01 | 1983-03-07 | 松下電器産業株式会社 | Electronic components for printed circuit boards |
| JPS6355491U (en) * | 1986-09-25 | 1988-04-13 | ||
| JPH0213705U (en) * | 1988-07-11 | 1990-01-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2592093Y2 (en) | 1999-03-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |