JPH0485721U - - Google Patents
Info
- Publication number
- JPH0485721U JPH0485721U JP1990128567U JP12856790U JPH0485721U JP H0485721 U JPH0485721 U JP H0485721U JP 1990128567 U JP1990128567 U JP 1990128567U JP 12856790 U JP12856790 U JP 12856790U JP H0485721 U JPH0485721 U JP H0485721U
- Authority
- JP
- Japan
- Prior art keywords
- package
- recess
- insulating base
- semiconductor element
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの丸部拡大断面図、第３図は従
来の半導体素子収納用パツケージの断面図である
。 １……絶縁基体、２……蓋体、３……半導体素
子、５ａ，５ｂ……凸条部、６……接着材、Ａ…
…空間。
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの丸部拡大断面図、第３図は従
来の半導体素子収納用パツケージの断面図である
。 １……絶縁基体、２……蓋体、３……半導体素
子、５ａ，５ｂ……凸条部、６……接着材、Ａ…
…空間。
Claims (1)
- 半導体素子を収容するための凹部を有する絶縁
基体と蓋体とから成る半導体素子収納用パツケー
ジにおいて、前記絶縁基体の凹部底面に、条間に
半導体素子を接着固定するための接着材が充填さ
れる二つの凸条部を設けたことを特徴とする半導
体素子収納用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128567U JPH0485721U (ja) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128567U JPH0485721U (ja) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485721U true JPH0485721U (ja) | 1992-07-24 |
Family
ID=31876022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990128567U Pending JPH0485721U (ja) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485721U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017007059A (ja) * | 2015-06-24 | 2017-01-12 | 京セラ株式会社 | 電子部品搭載用パッケージおよび電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041044B2 (ja) * | 1981-04-22 | 1985-09-13 | カネボウ株式会社 | 抱水性透明ゲル状のロ−ション |
-
1990
- 1990-11-29 JP JP1990128567U patent/JPH0485721U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041044B2 (ja) * | 1981-04-22 | 1985-09-13 | カネボウ株式会社 | 抱水性透明ゲル状のロ−ション |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017007059A (ja) * | 2015-06-24 | 2017-01-12 | 京セラ株式会社 | 電子部品搭載用パッケージおよび電子装置 |