JPH0485721U - - Google Patents

Info

Publication number
JPH0485721U
JPH0485721U JP1990128567U JP12856790U JPH0485721U JP H0485721 U JPH0485721 U JP H0485721U JP 1990128567 U JP1990128567 U JP 1990128567U JP 12856790 U JP12856790 U JP 12856790U JP H0485721 U JPH0485721 U JP H0485721U
Authority
JP
Japan
Prior art keywords
package
recess
insulating base
semiconductor element
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990128567U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990128567U priority Critical patent/JPH0485721U/ja
Publication of JPH0485721U publication Critical patent/JPH0485721U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの丸部拡大断面図、第３図は従
来の半導体素子収納用パツケージの断面図である
。 １……絶縁基体、２……蓋体、３……半導体素
子、５ａ，５ｂ……凸条部、６……接着材、Ａ…
…空間。 Fig. 1 is a sectional view showing an embodiment of a package for storing semiconductor elements according to the present invention, Fig. 2 is an enlarged sectional view of the round part of the package shown in Fig. 1, and Fig. 3 is a sectional view of a conventional package for storing semiconductor elements. FIG. DESCRIPTION OF SYMBOLS 1...Insulating base, 2...Lid, 3...Semiconductor element, 5a, 5b...Protruding stripes, 6...Adhesive material, A...
…space.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を収容するための凹部を有する絶縁
基体と蓋体とから成る半導体素子収納用パツケー
ジにおいて、前記絶縁基体の凹部底面に、条間に
半導体素子を接着固定するための接着材が充填さ
れる二つの凸条部を設けたことを特徴とする半導
体素子収納用パツケージ。 In a package for storing semiconductor elements consisting of an insulating base and a lid having a recess for accommodating a semiconductor element, the bottom surface of the recess of the insulating base is filled with an adhesive for adhesively fixing the semiconductor element between the strips. A package cage for storing semiconductor elements characterized by having two protruding stripes.
JP1990128567U 1990-11-29 1990-11-29 Pending JPH0485721U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990128567U JPH0485721U (en) 1990-11-29 1990-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990128567U JPH0485721U (en) 1990-11-29 1990-11-29

Publications (1)

Publication Number Publication Date
JPH0485721U true JPH0485721U (en) 1992-07-24

Family

ID=31876022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990128567U Pending JPH0485721U (en) 1990-11-29 1990-11-29

Country Status (1)

Country Link
JP (1) JPH0485721U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017007059A (en) * 2015-06-24 2017-01-12 京セラ株式会社 Electronic component mounting package and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041044B2 (en) * 1981-04-22 1985-09-13 カネボウ株式会社 Water-retaining transparent gel-like lotion

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041044B2 (en) * 1981-04-22 1985-09-13 カネボウ株式会社 Water-retaining transparent gel-like lotion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017007059A (en) * 2015-06-24 2017-01-12 京セラ株式会社 Electronic component mounting package and electronic device

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