JPH0485724U - - Google Patents
Info
- Publication number
- JPH0485724U JPH0485724U JP13037190U JP13037190U JPH0485724U JP H0485724 U JPH0485724 U JP H0485724U JP 13037190 U JP13037190 U JP 13037190U JP 13037190 U JP13037190 U JP 13037190U JP H0485724 U JPH0485724 U JP H0485724U
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- bonding
- tab
- corner
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の実施例を示し、ＡはＴＡＢ
基板の平面図、Ｂ，Ｃは、本考案の基板を用いた
実装断面図を示す。第２図は従来例の斜視図、第
３図Ａ，Ｂは本考案の回路基板の形状例をそれぞ
れ示す。
１……デバイスホール、２……アライメントマ
ーク、３……インナーリード部、４……インナー
リード、５……ＩＣ、６……バンプ、７……ＴＡ
Ｂ基板、８……パターン面、９……フイルム面、
１０……スプロケツトホール。
FIG. 1 shows an embodiment of the present invention, A is TAB
The plan view of the board, B and C show a cross-sectional view of mounting using the board of the present invention. FIG. 2 is a perspective view of a conventional example, and FIGS. 3A and 3B show examples of the shape of the circuit board of the present invention. 1...Device hole, 2...Alignment mark, 3...Inner lead part, 4...Inner lead, 5...IC, 6...Bump, 7...TA
B substrate, 8... pattern surface, 9... film surface,
10... Sprocket hole.
Claims (1)
るために設けられた空隙にボンデイング用アライ
メントマークを突出させたことを特徴とするＴＡ
Ｂ基板。 (2) 前記アライメントマークの形状が四角パタ
ーンの１角を突出させたボンデイング用アライメ
ントマークを有することを特徴とする請求項１記
載のＴＡＢ基板。 (3) 前記アライメントマークの形状がＩＣコー
ナに平行なＬ型状に突出させたボンデイング用ア
ライメントマークを有することを特徴とする請求
項１記載のＴＡＢ基板。[Claims for Utility Model Registration] (1) A TA characterized in that an alignment mark for bonding is protruded from a gap provided for bonding an IC on a TAB substrate.
B board. (2) The TAB substrate according to claim 1, wherein the alignment mark has a shape of a bonding alignment mark in which one corner of a square pattern projects. (3) The TAB board according to claim 1, wherein the alignment mark has a bonding alignment mark projected in an L-shape parallel to an IC corner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13037190U JPH0485724U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13037190U JPH0485724U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485724U true JPH0485724U (en) | 1992-07-24 |
Family
ID=31877721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13037190U Pending JPH0485724U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485724U (en) |
-
1990
- 1990-11-29 JP JP13037190U patent/JPH0485724U/ja active Pending
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