JPH0485734U - - Google Patents
Info
- Publication number
- JPH0485734U JPH0485734U JP12916490U JP12916490U JPH0485734U JP H0485734 U JPH0485734 U JP H0485734U JP 12916490 U JP12916490 U JP 12916490U JP 12916490 U JP12916490 U JP 12916490U JP H0485734 U JPH0485734 U JP H0485734U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- glass layer
- ceramic base
- electronic components
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例の縦断面部分図、第
２図はその全体斜視図、第３図は第２図の−
断面図、第４図はその等価回路図、第５図は製造
途中の状態を示す平面部分図である。
１……セラミツクパツケージ、２……水晶発振
回路、１０……セラミツクベース、１１，１２…
…リード、１３……セラミツクリング、１５ａ…
…第１ガラス層、１５ｂ……第３ガラス層、１６
……第２ガラス層。
Fig. 1 is a vertical cross-sectional partial view of an embodiment of the present invention, Fig. 2 is an overall perspective view thereof, and Fig. 3 is a - of Fig. 2.
A sectional view, FIG. 4 is an equivalent circuit diagram thereof, and FIG. 5 is a partial plan view showing a state in the middle of manufacturing. 1... Ceramic package, 2... Crystal oscillation circuit, 10... Ceramic base, 11, 12...
...Lead, 13...Ceramic ring, 15a...
...First glass layer, 15b...Third glass layer, 16
...Second glass layer.
Claims (1)
に第１ガラス層により重ねて固定されたリード及
びセラミツクリングと、前記セラミツクリング上
に第２ガラス層により固定された蓋体とを備えた
電子部品収納用セラミツクパツケージにおいて、 前記セラミツクベースから延出するリードと該
セラミツクベースの表面とが対向する部分の少な
くとも外周部に、第２ガラス層の封止温度以下の
軟化点を有する第３ガラス層が介在していること
を特徴とする電子部品収納用セラミツクパツケー
ジ。[Claims for Utility Model Registration] A ceramic base, a lead and a ceramic ring that are stacked and fixed on the ceramic base with a first glass layer, and a lid that is fixed on the ceramic ring with a second glass layer. In the ceramic package for storing electronic components, at least the outer peripheral portion of the portion where the leads extending from the ceramic base and the surface of the ceramic base face each other is provided with a glass layer having a softening point lower than the sealing temperature of the second glass layer. A ceramic package for storing electronic components characterized by having three glass layers interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12916490U JPH0485734U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12916490U JPH0485734U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485734U true JPH0485734U (en) | 1992-07-24 |
Family
ID=31876582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12916490U Pending JPH0485734U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485734U (en) |
-
1990
- 1990-11-29 JP JP12916490U patent/JPH0485734U/ja active Pending
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