JPH0485743U - - Google Patents
Info
- Publication number
- JPH0485743U JPH0485743U JP12774890U JP12774890U JPH0485743U JP H0485743 U JPH0485743 U JP H0485743U JP 12774890 U JP12774890 U JP 12774890U JP 12774890 U JP12774890 U JP 12774890U JP H0485743 U JPH0485743 U JP H0485743U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- external leads
- view
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１実施例を示し、同図ａは
平面図、同図ｂは側面図、同図ｃは実装状態の縦
断面図、第２図は本考案の第２実施例を示し、同
図ａは平面図、同図ｂは側面図、同図ｃは実装状
態の縦断面図、第３図は従来の半導体装置の一例
を示し、同図ａは平面図、同図ｂは側面図、同図
ｃは実装状態の縦断面図、第４図は従来の半導体
装置の他の例を示し、同図ａは平面図、同図ｂは
側面図、同図ｃは実装状態の縦断面図である。
１，１１，２１，３１……樹脂、２，１２，２
２，３２……外部リード、２ａ，１２ａ，２２ａ
，３２ａ……先端部、２ｂ，１２ｂ，２２ｂ，３
２ｂ……付け根部分、３，１３，２３，３３……
プリント基板、４，１４，２４，３４……半田。
Figure 1 shows a first embodiment of the present invention, Figure a is a plan view, Figure b is a side view, Figure c is a vertical sectional view of the mounted state, and Figure 2 is a second embodiment of the present invention. FIG. 3 shows an example of a conventional semiconductor device, FIG. 3A shows a plan view, FIG. 3B shows a side view, FIG. b is a side view, c is a longitudinal sectional view of the mounted state, FIG. 4 shows another example of a conventional semiconductor device, a is a plan view, b is a side view, and c is a mounted state. It is a longitudinal cross-sectional view of the state. 1, 11, 21, 31...resin, 2, 12, 2
2, 32...External lead, 2a, 12a, 22a
, 32a... tip, 2b, 12b, 22b, 3
2b... Root part, 3, 13, 23, 33...
Printed circuit board, 4, 14, 24, 34...solder.
Claims (1)
ードを実装基板にろ−付けして実装を行う表面実
装型半導体装置において、前記外部リードを樹脂
の側面に沿つて曲げ形成し、かつその先端位置を
樹脂の底面に略一致させたことを特徴とする表面
実装型半導体装置。 ２ 外部リードの先端を、樹脂の底面に対して±
０．１mmの範囲に位置させてなる実用新案登録請
求の範囲第１項記載の表面実装型半導体装置。[Claims for Utility Model Registration] 1. In a surface mount semiconductor device in which external leads are protruded from a resin and mounted by brazing the external leads onto a mounting board, the external leads are bent along the side surface of the resin. What is claimed is: 1. A surface-mounted semiconductor device, characterized in that the top end of the semiconductor device is formed on the bottom surface of the resin, and its tip position is substantially aligned with the bottom surface of the resin. 2 Place the tip of the external lead ± against the bottom of the resin.
A surface-mounted semiconductor device according to claim 1, wherein the surface-mounted semiconductor device is located within a range of 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774890U JPH0485743U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774890U JPH0485743U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485743U true JPH0485743U (en) | 1992-07-24 |
Family
ID=31875236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12774890U Pending JPH0485743U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485743U (en) |
-
1990
- 1990-11-30 JP JP12774890U patent/JPH0485743U/ja active Pending