JPH0485984A - Forming method for pattern of printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a pattern forming method for a printed wiring board manufactured by a subtractive method.

[Conventional technology]

FIG. 3 is a process diagram showing a pattern forming method for a printed wiring board manufactured by the conventional subtractive method. A through hole 2 is formed covering the copper film 1b and the above-mentioned through hole.
and a copper film 1c forming the copper film 1c. 5 is a tri film laminated on the copper film 1c, and 6 is a work film laminated on this dry film 5, on which a pattern image is drawn. 7 is an exposure light source, 8 is a land, 9
is a pattern.

Next, a pattern forming process for a printed wiring board will be explained.

First, Fig. 3(a) shows the workpiece film 6 as the outermost layer.
The copper film laminate 1 as shown in FIG. 1 is prepared. That is,
A dry film 5, which is an etching resist material, is pasted on both sides of the through-hole plated mesh laminate 1, a work film 6 is set in alignment with the through-hole 2, and exposed by an exposure light source 7. As a result, the unexposed portions of the dry film 5 are developed and dissolved, resulting in the state shown in FIG. 3(b). In this state, the remaining dry film 5 is used as a mask to form the copper film 1b.

When 1c is etched, it becomes as shown in FIG. 3(C). Thereafter, when the entire tri-film 5 is removed, lands 8 and patterns 9 made of copper film IC are formed as shown in FIG. 3(d).

[Problem to be solved by the invention]

The conventional pattern forming method for a printed wiring board is as described above, so the dry film 5 is pasted on the entire surface of the through-hole plated copper clad laminate 1, and the work film 6 is tightly attached on top of this. It is necessary to leave a pattern image and use it as an etching resist through exposure and development. Therefore, it is necessary to prepare a work film 6 and a try film 5 on which pattern images have been drawn, and these processes require expensive processing. This invention requires equipment such as a dry film laminator, exposure machine, and developing machine, which increases the number of steps, making it difficult to improve production efficiency.This invention solves the above problems. This was made for the purpose of eliminating the need for a work film and a try film, thereby eliminating the work film production process, the contact exposure and development process for the try film, and the equipment involved.

The object of the present invention is to obtain a pattern forming method for a printed wiring board that can shorten the manufacturing period and reduce costs.

[Means to solve the problem]

The method for forming a pattern on a printed wiring board according to the present invention includes:
A drawing step in which drawing is performed using an etching resist material poured directly from a drawing machine onto a through-hole plated copper clad laminate, and the etching resist material drawn in the drawing step is used as an etching mask to remove the copper of the copper clad laminate. An etching process for etching the film and an etching resist material removal process for removing the etching resist material on the copper film remaining in the etching process are performed sequentially.

[Effect]

The method of forming a pattern on a printed wiring board according to the present invention is to create a pattern image by mechanically directly drawing a resin or metal as an etching resist material only on the necessary portions on a copper film, and then etching the copper film. In addition, the remaining etching resist material is removed to form a pattern, thereby eliminating the need for conventional work films and dry films on which pattern images are drawn. Close contact and exposure.

To make it possible to omit a developing process and equipment for executing each of these processes.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a copper-clad laminate having a copper film 1b on an insulating substrate 1a and a copper film 1c forming through holes 2, and the same one as shown in FIG. 3 is used. 3
is an etching resist material made of resin or metal,
4 is a direct drawing machine that pours out (spouts) this etching resist material so that it can be drawn. Also, Figure 2 is similar to Figure 1 (a).
It is a perspective view for making it easy to understand.

Next, a pattern forming process for a printed wiring board according to this embodiment will be explained.

First, a copper-clad laminate 1 having a copper film 1c on the top layer is prepared. Next, as shown in FIG. 1(a), etching resist material 3 is jetted into the through-holes 2 of this copper-clad laminate 1 and on the upper surface of the copper film 1c using a direct drawing machine 4, and the through-holes are A predetermined pattern image is drawn within the etching resist material 3 and on the upper surface of the copper film 1c. Next, using the etching resist material 3 after drawing as an etching mask, the portions of the copper films 1c and lb which are not drawn by etching are removed as shown in FIG. 1(b).

Furthermore, the remaining etching resist material 3 is removed, and a pattern of a predetermined drawing pattern is formed using the copper films 1b and lc as shown in FIG. 1(C). Here, if the etching resist material 3 is a metal resist, it may not be removed.

Although the above embodiment shows the case where the etching resist material 3 is completely filled in the through hole 2, the upper and lower portions of the through hole 2 may be masked without completely filling the through hole 2. Further, the above etching resist material can also be used for forming inner layer patterns in multilayer printed wiring boards.

Further, although the above embodiment describes pattern formation on the copper-clad laminate 1, it can also be applied to pattern formation on a substrate made of other materials such as a ceramic substrate, and the same effects as in the above embodiment can be achieved. . In this case, compared to so-called thick-film substrates in which a conductor pattern is directly formed on a ceramic substrate, etc., it is possible to use a substrate with a conductor layer formed in advance by vapor deposition on the entire surface of the substrate. be effective.

Further, in the above embodiment, the case where a pattern of the copper film is formed on the copper clad laminate 1 having two layers of copper films 1b and lc was shown, but when forming the inner layer pattern in the multilayer print 1-wiring board, can also be applied.

〔Effect of the invention〕

As described above, according to the present invention, there is a drawing step in which drawing is performed on a through-hole plated copper-clad laminate using an etching resist material poured directly from a drawing machine, and a drawing step in which the etching resist material drawn in the drawing step is The etching process of etching the copper film of the copper-clad laminate as an etching mask and the etching resist material removal process of removing the etching resist material on the copper film remaining in the etching process are carried out in sequence. A pattern image can be created by mechanically directly drawing the etching resist material, such as resin or metal, only on the necessary areas on the copper film, and then the pattern can be formed by etching. This eliminates the need for a work film and a try film on which a pattern image has been drawn, and also eliminates the steps of creating a work film, contacting the try film, exposing it, and developing it, making it possible to shorten the manufacturing period and reduce costs.

Furthermore, since the pattern image is created by direct drawing, there is an effect that the through hole and the runt will not be misaligned due to expansion and contraction of the work film.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing a pattern forming method for a printed wiring board according to an embodiment of the present invention, FIG. 2 is a perspective view showing the drawing process in FIG. 1, and FIG. FIG. 3 is a process diagram showing a method for forming a pattern on a printed wiring board. 1 is a copper-clad laminate, 2 is a through hole, 3 is an etching resist material, and 4 is a direct drawing machine. In addition, in the figures, the same reference numerals indicate the same or (target parts).

Claims (1)

[Claims] A drawing step in which drawing is performed using an etching resist material directly dispensed from a drawing machine onto a through-hole plated copper clad laminate, and the etching resist material drawn in the drawing step is used as an etching mask to remove the copper of the copper clad laminate. A method for forming a pattern on a printed wiring board, comprising an etching step for etching a film, and an etching resist material removal step for removing the etching resist material on the copper film remaining in the etching step.