JPH048756A - Resin composition for sealing - Google Patents
Resin composition for sealingInfo
- Publication number
- JPH048756A JPH048756A JP11105690A JP11105690A JPH048756A JP H048756 A JPH048756 A JP H048756A JP 11105690 A JP11105690 A JP 11105690A JP 11105690 A JP11105690 A JP 11105690A JP H048756 A JPH048756 A JP H048756A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- melamine
- resin composition
- sealing
- unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 12
- 238000007789 sealing Methods 0.000 title claims description 11
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 25
- 239000004640 Melamine resin Substances 0.000 claims abstract description 16
- 150000007974 melamines Chemical class 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 17
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 9
- 238000013329 compounding Methods 0.000 abstract 2
- 238000001723 curing Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- -1 amide compounds Chemical class 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000001227 electron beam curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229960003505 mequinol Drugs 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子あるいは電気部品の封圧用樹脂組成物に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a resin composition for sealing electronic or electrical parts.
（従来技術）
従来、ダイオード、トランジスタ、集積回路などの電子
部品を、熱硬化性樹脂を用いて封止する方法が広く実用
化されており、封止用樹脂組成物として熱硬化性樹脂で
あるエポキシ樹脂組成物が、電気的特性、耐湿性、密着
性などの点から最も一般的に用いられている。(Prior art) Conventionally, methods of sealing electronic components such as diodes, transistors, and integrated circuits using thermosetting resins have been widely put into practical use. Epoxy resin compositions are most commonly used in terms of electrical properties, moisture resistance, adhesion, etc.
一方、熱硬化性樹脂として古くから接着剤等に用いら九
るメラミン系樹脂は、表面硬度や耐熱性には優れるもの
の硬化系が脱水縮合反応によるためや、高固形分の樹脂
が得られ難いために、耐湿性や、電気的特性に劣り、封
止用樹脂としては不適とされていた。On the other hand, melamine resin, which has been used as a thermosetting resin for adhesives for a long time, has excellent surface hardness and heat resistance, but because the curing system uses a dehydration condensation reaction, it is difficult to obtain a resin with a high solid content. Therefore, it had poor moisture resistance and electrical properties, and was considered unsuitable as a sealing resin.
（発明の目的）
本発明は、前記のように不適とされていたメラミン系樹
脂を用いて、電子または電気部品の封止用樹脂組成物を
提供しようとするものである。(Object of the Invention) The present invention aims to provide a resin composition for sealing electronic or electrical parts using the melamine resin, which has been considered unsuitable as described above.
（発明の構成）
上記目的を達成するために、本発明の封止用樹脂組成物
は、樹脂主成分としてメラミン系樹脂である不飽和メラ
ミン樹脂１０〜８０重量部に対して、９０〜２０重量部
の無機質充填剤が添加された物であることを特徴とする
。(Structure of the Invention) In order to achieve the above object, the sealing resin composition of the present invention contains 90 to 20 parts by weight of an unsaturated melamine resin, which is a melamine resin as the main resin component, to 10 to 80 parts by weight of an unsaturated melamine resin. It is characterized by having an added amount of inorganic filler.
本発明に用いられる不飽和メラミン樹脂とは、エチレン
性不飽和結合に基づく重合硬化性の樹脂であって、例え
ば、メラミンとホルムアルデヒドとの初期締金物に、ア
クリル酸、メタクリル酸、多価アルコールとアクリル酸
やメタクリル酸とのモノエステル化合物、アリルアルコ
ール、アクリルアミド等のアミド化合物、あるいはこれ
らの混合物や共重合物などを添加反応あるいは混合させ
て得られる合成樹脂や、メラミンとホルムアルデヒドと
の初期縮合物にアルコールを添加反応させて得られるエ
ーテル化物に、アクリル酸やメタクリル酸あるいはこれ
らのエステル化物、アリルアルコール、アクリルアミド
等のアミド化合物、あるいはこれらの混合物や共重合物
などを添加反応あるいは混合させて得られる合成樹脂な
どである。The unsaturated melamine resin used in the present invention is a polymerizable curable resin based on ethylenically unsaturated bonds. Synthetic resins obtained by addition reaction or mixing of monoester compounds with acrylic acid or methacrylic acid, allyl alcohol, amide compounds such as acrylamide, or mixtures or copolymers thereof, and initial condensates of melamine and formaldehyde. Acrylic acid, methacrylic acid, esterified products thereof, allyl alcohol, amide compounds such as acrylamide, or mixtures or copolymers thereof, etc. are added to or mixed with the etherified product obtained by adding alcohol to the etherified product. synthetic resins etc.
ここで用いられるメラミンとは、メラミン単体の他、尿
素、エチレン尿素、ジシアンジアミド、アセトグアナミ
ン、ベンゾグアナミン、シクロヘキサカルボグアナミン
などのグアナミン類などメラミンと混合あるいは共縮合
可能な化合物との混合物あるいは共縮合物が用いられる
。The melamine used here refers to melamine alone, as well as mixtures or co-condensates with compounds that can be mixed or co-condensed with melamine, such as guanamines such as urea, ethylene urea, dicyandiamide, acetoguanamine, benzoguanamine, and cyclohexacarboguanamine. is used.
また、ホルムアルデヒドとしては、パラホルムアルデヒ
ド、アルコール性ホルムアルデヒドあるいは水性ホルマ
リンなどであって、これらのうちパラホルムアルデヒド
を使用すると容易に高固形分の樹脂が得られ好ましく、
メラミンあるいはその混合物の分子中のアミノ基が全て
ホルムアルデヒドと反応置換されるようにする、例えば
メラミン１モルに対してホルムアルデヒド６モルとする
のが好ましい。In addition, the formaldehyde includes paraformaldehyde, alcoholic formaldehyde, aqueous formalin, etc. Among these, it is preferable to use paraformaldehyde because a resin with a high solid content can be easily obtained.
It is preferable that all the amino groups in the molecule of melamine or a mixture thereof be reacted and substituted with formaldehyde, for example, 6 moles of formaldehyde per 1 mole of melamine.
次に、該不飽和メラミン樹脂に添加される無機質充填剤
とは、アルミナ、シリカなどの通常の封止用樹脂組成物
に添加される無機質充填剤であって、特に限定するもの
ではない。Next, the inorganic filler added to the unsaturated melamine resin is an inorganic filler added to ordinary sealing resin compositions such as alumina and silica, and is not particularly limited.
その他成分として、エポキシ樹脂やシリコーン樹脂など
の他の合成樹脂、ワックス類や直鎖脂肪酸の金属塩など
の離型剤、塩素化パラフィンや二酸化アンチモンなどの
難燃剤、着色剤、カップリング剤などの添加剤が必要に
応じて適宜添加され調合される。Other ingredients include other synthetic resins such as epoxy resins and silicone resins, mold release agents such as waxes and metal salts of linear fatty acids, flame retardants such as chlorinated paraffin and antimony dioxide, colorants, coupling agents, etc. Additives are appropriately added and prepared as needed.
調合された樹脂組成物は、有機過酸化物等の重合開始剤
が添加された後に、電子または電気部品等に注型、トラ
ンスファー成形などの手段により被覆され、加熱硬化、
紫外線硬化、電子線硬化などの硬化手段により硬化せし
められる。After a polymerization initiator such as an organic peroxide is added to the prepared resin composition, it is coated on electronic or electrical parts by means such as casting or transfer molding, and then heat-cured and cured.
It is cured by curing means such as ultraviolet curing and electron beam curing.
（実施例）
実施例１
メラミン、ホルムアルデヒドとの初期縮合物をメチルア
ルコールにてエーテル化して得られたベキサメトキシメ
チルメラミン１モルに対して、ヒドロキシプロピルモノ
メタクリレート６．５モル、パラトルエンスルホン酸及
びハイドロキノンメチルエーテルとが、攪拌機及び蒸留
用冷却器付き反応フラスコに仕込まれ、温度９０〜１４
０℃で反応が進められる。(Example) Example 1 6.5 mol of hydroxypropyl monomethacrylate and p-toluenesulfonic acid per 1 mol of bexamethoxymethylmelamine obtained by etherifying an initial condensate of melamine and formaldehyde with methyl alcohol. and hydroquinone methyl ether were charged into a reaction flask equipped with a stirrer and a distillation condenser, and the temperature was raised to 90-14.
The reaction proceeds at 0°C.
蒸留用冷却器からの流出量が約６モルに達した時点を反
応終了点とし、室温まで冷却された後水洗及び加熱減圧
により未反応のヒドロキシプロピルモノメタクリレート
が除去されて１本発明に用いられる不飽和メラミン樹脂
が得られた。該不飽和メラミン樹脂は、粘度１２００ｃ
ｐｓ／２０℃の無色透明溶液であった。 該不飽和メラ
ミン樹０３０重量部に対し、重合開始剤としてｔ−ブチ
ルパーオキシ−２−エチルヘキサノエート０．５重量部
、パラトルエンスルホン酸０．２重量部及びシリカ粉末
７０重量部とが添加され、充分に混練されて本発明の封
止用樹脂組成物が得られた。The reaction end point is when the amount flowing out from the distillation cooler reaches about 6 moles, and after cooling to room temperature, unreacted hydroxypropyl monomethacrylate is removed by water washing and heating under reduced pressure. An unsaturated melamine resin was obtained. The unsaturated melamine resin has a viscosity of 1200c.
It was a colorless and transparent solution at ps/20°C. To 030 parts by weight of the unsaturated melamine tree, 0.5 parts by weight of t-butylperoxy-2-ethylhexanoate, 0.2 parts by weight of para-toluenesulfonic acid and 70 parts by weight of silica powder were used as polymerization initiators. The resin composition for sealing of the present invention was obtained by adding and sufficiently kneading.
得られた封止用樹脂組成物を、１６０〜１８０℃に加熱
された金型内に注型し硬化せしめて成形品を得た。この
成形品について耐湿性、電気的特性などの諸特性を試験
しその結果を表１に示した。The obtained sealing resin composition was cast into a mold heated to 160 to 180°C and cured to obtain a molded article. This molded article was tested for various properties such as moisture resistance and electrical properties, and the results are shown in Table 1.
実施例２
組成モル比３：１のメラミン−ベンゾグアナミン混合物
１モルに対して、ホルムアルデヒド５゜５モル、ヒドロ
キシプロピルモノメタクリレート６．０モル、ハイドロ
キノンメチルエーテル及びパラトルエンスルホン酸とが
、攪拌器、蒸留用冷却器付き反応フラスコに仕込まれ、
温度８０〜９５℃で反応が進められる。Example 2 5.5 moles of formaldehyde, 6.0 moles of hydroxypropyl monomethacrylate, hydroquinone methyl ether, and para-toluenesulfonic acid were added to 1 mole of a melamine-benzoguanamine mixture with a composition molar ratio of 3:1 using a stirrer and distillation. It is placed in a reaction flask with a condenser for
The reaction proceeds at a temperature of 80-95°C.
蒸留用冷却器からの流出量が約５．５モルに達した時点
を反応終了点とし、水洗及び加熱減圧により未反応のヒ
ドロキシプロピルモノメタクリレートが除去され、室温
まで冷却されて本発明に用いられる不飽和メラミン樹脂
が得られた。該不飽和メラミン樹脂は粘度１３００ ｃ
ｐ ｓ ／ ２０℃の無色透明溶液であった。 該不
飽和メラミン樹脂は、実施例１と同様に無機質充填剤等
の他の成分と調合され、成形された。The reaction end point is when the amount flowing out from the distillation cooler reaches about 5.5 moles, unreacted hydroxypropyl monomethacrylate is removed by washing with water and heating under reduced pressure, and the product is cooled to room temperature and used in the present invention. An unsaturated melamine resin was obtained. The unsaturated melamine resin has a viscosity of 1300 c
It was a colorless and transparent solution at ps/20°C. The unsaturated melamine resin was mixed with other components such as an inorganic filler and molded in the same manner as in Example 1.
比較例
クレゾールノボラックエポキシ樹脂（エポキシ当量２１
５）２０重量部に、ノボラック型フェノール樹脂（フェ
ノール当量１０７）１０重量部及びシリカ粉末７０重量
部からなる樹脂組成物を実施例と同様な方法にて成形さ
れた成形品を比較例とした。Comparative example Cresol novolac epoxy resin (epoxy equivalent: 21
5) A comparative example was a molded article obtained by molding a resin composition consisting of 20 parts by weight, 10 parts by weight of a novolac type phenol resin (phenol equivalent: 107), and 70 parts by weight of silica powder in the same manner as in the examples.
表 １
（効 果）
本発明の封止用樹脂組成物は、樹脂主成分としてメラミ
ン樹脂系の合成樹脂が用いられるためにＴｇ （ガラス
転移点）を従来のエポキシ樹脂系より高くすることが可
能であり、耐熱性に優れる。Table 1 (Effects) Since the sealing resin composition of the present invention uses a melamine resin-based synthetic resin as the main resin component, it is possible to make the Tg (glass transition point) higher than that of conventional epoxy resin systems. and has excellent heat resistance.
また、メラミン樹脂系であってもその硬化系がエチレン
性不飽和二重結合に基づく重合硬化系であり、水分や溶
剤を含まない高固形分の樹脂であるため、従来の縮合系
では得られなかった耐湿性にも優れる。Furthermore, even with melamine resins, the curing system is a polymerization curing system based on ethylenically unsaturated double bonds, and is a high solid content resin that does not contain water or solvents, so it cannot be obtained with conventional condensation systems. It also has excellent moisture resistance.
更に硬化手段を、実施例のような加熱硬化ばかりでなく
、紫外線硬化、電子線硬化、常温硬化などを採用するこ
とも可能であり、その結果として歪の少ない成形品が得
られる効果もある。Further, as the curing means, it is possible to employ not only heat curing as in the examples, but also ultraviolet curing, electron beam curing, room temperature curing, etc., and as a result, a molded product with less distortion can be obtained.
体積抵抗率：耐湿性との比較のため、１２１℃−１００
時間のプレッシャクツカーテスト（ＰＣＴ）後、ＪＩＳ
Ｋ６９１１に準拠。Volume resistivity: 121℃-100 for comparison with moisture resistance
After time pressure test (PCT), JIS
Compliant with K6911.
特許出願人 アイカニ業株式会社Patent applicant: Aikanigyo Co., Ltd.
Claims (1)
重量部に対し、９０〜２０重量部の無機質充填剤が添加
されてなることを特徴とする封止用樹脂組成物。1) Unsaturated melamine resin 10-80 as resin main component
A sealing resin composition characterized in that 90 to 20 parts by weight of an inorganic filler is added to the resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11105690A JPH048756A (en) | 1990-04-27 | 1990-04-27 | Resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11105690A JPH048756A (en) | 1990-04-27 | 1990-04-27 | Resin composition for sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048756A true JPH048756A (en) | 1992-01-13 |
Family
ID=14551287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11105690A Pending JPH048756A (en) | 1990-04-27 | 1990-04-27 | Resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048756A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920117A (en) * | 1994-08-02 | 1999-07-06 | Fujitsu Limited | Semiconductor device and method of forming the device |
| US7640920B2 (en) | 2007-10-25 | 2010-01-05 | Aisan Kogyo Kabushiki Kaisha | Fuel vapor processing apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59120614A (en) * | 1982-12-27 | 1984-07-12 | Hitachi Chem Co Ltd | Molding resin composition |
-
1990
- 1990-04-27 JP JP11105690A patent/JPH048756A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59120614A (en) * | 1982-12-27 | 1984-07-12 | Hitachi Chem Co Ltd | Molding resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920117A (en) * | 1994-08-02 | 1999-07-06 | Fujitsu Limited | Semiconductor device and method of forming the device |
| US7640920B2 (en) | 2007-10-25 | 2010-01-05 | Aisan Kogyo Kabushiki Kaisha | Fuel vapor processing apparatus |
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