JPH0487645U - - Google Patents
Info
- Publication number
- JPH0487645U JPH0487645U JP1990129429U JP12942990U JPH0487645U JP H0487645 U JPH0487645 U JP H0487645U JP 1990129429 U JP1990129429 U JP 1990129429U JP 12942990 U JP12942990 U JP 12942990U JP H0487645 U JPH0487645 U JP H0487645U
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- motor
- ultrasonic horn
- capillary
- activation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の一実施例にかかるワイヤボ
ンダヘツドを示す一部断面側面図、第２図は、第
１図−線に沿う一部断面図、第３図ａ〜ｃは
、作動説明図である。
１……キヤピラリ、３……チツプ、４……ワイ
ヤ、６……超音波ホーン、１１……駆動ブロツク
、１８……近接センサ（センサ）、１９……ロー
タリーエンコーダ（エンコーダ）、２０……モー
タ。
FIG. 1 is a partially sectional side view showing a wire bonder head according to an embodiment of the present invention, FIG. 2 is a partially sectional view taken along the line of FIG. It is a diagram. 1... Capillary, 3... Chip, 4... Wire, 6... Ultrasonic horn, 11... Drive block, 18... Proximity sensor (sensor), 19... Rotary encoder (encoder), 20... Motor .
Claims (1)
キヤピラリが設けられ、長尺状の前記超音波ホー
ンは、エンコーダを備えたモータにより揺動又は
上下動される駆動ブロツクに揺動自在に支持され
、前記駆動ブロツクには、長尺状の前記超音波ホ
ーンの揺動により作動し、前記キヤピラリがボン
デイング面に圧接されたことを検知するセンサが
設けられたワイヤボンダにおいて、前記モータは
前記センサの作動により回転方向を逆転され、前
記センサの作動に伴い逆転される前記モータの回
転量と回転速度とが、前記センサの作動時におけ
る前記超音波ホーンの撓み量によつて決定された
ことを特徴とするワイヤボンダの荷重制御構造。 The elongated ultrasonic horn is provided with a capillary through which a wire is inserted, and the elongated ultrasonic horn is swingably supported by a drive block that is oscillated or moved up and down by a motor equipped with an encoder. In the wire bonder, the driving block is provided with a sensor that is activated by the swinging of the elongated ultrasonic horn and detects that the capillary is pressed against the bonding surface, and the motor is connected to the sensor. The rotation direction of the motor is reversed by activation, and the rotation amount and rotation speed of the motor reversed by activation of the sensor are determined by the amount of deflection of the ultrasonic horn when the sensor is activated. Load control structure of wire bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990129429U JPH0755002Y2 (en) | 1990-11-30 | 1990-11-30 | Load control structure of wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990129429U JPH0755002Y2 (en) | 1990-11-30 | 1990-11-30 | Load control structure of wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0487645U true JPH0487645U (en) | 1992-07-30 |
| JPH0755002Y2 JPH0755002Y2 (en) | 1995-12-18 |
Family
ID=31876829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990129429U Expired - Lifetime JPH0755002Y2 (en) | 1990-11-30 | 1990-11-30 | Load control structure of wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755002Y2 (en) |
-
1990
- 1990-11-30 JP JP1990129429U patent/JPH0755002Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755002Y2 (en) | 1995-12-18 |