JPH0487645U - - Google Patents

Info

Publication number
JPH0487645U
JPH0487645U JP1990129429U JP12942990U JPH0487645U JP H0487645 U JPH0487645 U JP H0487645U JP 1990129429 U JP1990129429 U JP 1990129429U JP 12942990 U JP12942990 U JP 12942990U JP H0487645 U JPH0487645 U JP H0487645U
Authority
JP
Japan
Prior art keywords
sensor
motor
ultrasonic horn
capillary
activation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990129429U
Other languages
English (en)
Other versions
JPH0755002Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990129429U priority Critical patent/JPH0755002Y2/ja
Publication of JPH0487645U publication Critical patent/JPH0487645U/ja
Application granted granted Critical
Publication of JPH0755002Y2 publication Critical patent/JPH0755002Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例にかかるワイヤボ
ンダヘツドを示す一部断面側面図、第２図は、第
１図−線に沿う一部断面図、第３図ａ〜ｃは
、作動説明図である。 １……キヤピラリ、３……チツプ、４……ワイ
ヤ、６……超音波ホーン、１１……駆動ブロツク
、１８……近接センサ（センサ）、１９……ロー
タリーエンコーダ（エンコーダ）、２０……モー
タ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 長尺状の超音波ホーンにはワイヤが挿通された
    キヤピラリが設けられ、長尺状の前記超音波ホー
    ンは、エンコーダを備えたモータにより揺動又は
    上下動される駆動ブロツクに揺動自在に支持され
    、前記駆動ブロツクには、長尺状の前記超音波ホ
    ーンの揺動により作動し、前記キヤピラリがボン
    デイング面に圧接されたことを検知するセンサが
    設けられたワイヤボンダにおいて、前記モータは
    前記センサの作動により回転方向を逆転され、前
    記センサの作動に伴い逆転される前記モータの回
    転量と回転速度とが、前記センサの作動時におけ
    る前記超音波ホーンの撓み量によつて決定された
    ことを特徴とするワイヤボンダの荷重制御構造。
JP1990129429U 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造 Expired - Lifetime JPH0755002Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990129429U JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990129429U JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Publications (2)

Publication Number Publication Date
JPH0487645U true JPH0487645U (ja) 1992-07-30
JPH0755002Y2 JPH0755002Y2 (ja) 1995-12-18

Family

ID=31876829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990129429U Expired - Lifetime JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Country Status (1)

Country Link
JP (1) JPH0755002Y2 (ja)

Also Published As

Publication number Publication date
JPH0755002Y2 (ja) 1995-12-18

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