JPH0487657U - - Google Patents

Info

Publication number
JPH0487657U
JPH0487657U JP12973490U JP12973490U JPH0487657U JP H0487657 U JPH0487657 U JP H0487657U JP 12973490 U JP12973490 U JP 12973490U JP 12973490 U JP12973490 U JP 12973490U JP H0487657 U JPH0487657 U JP H0487657U
Authority
JP
Japan
Prior art keywords
insulating substrate
wiring pattern
flexible
board
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12973490U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12973490U priority Critical patent/JPH0487657U/ja
Publication of JPH0487657U publication Critical patent/JPH0487657U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す混成集積回路
装置の斜視図、第２図はその一部を拡大した部分
断面斜視図、第３図は本考案の異なる実施例を示
す混成集積回路装置の斜視図である。第４図は本
考案の前提となる従来の混成集積回路装置の斜視
図、第５図はその一部を拡大した平面図である。 １……絶縁基板、２……半導体ペレツト、２ａ
……電極、３……外部リード、４……外装樹脂材
、６……配線パターン、８……ステツチランド、
１１，１２……フレキシブル配線基板、１１ａ…
…フレキシブル樹脂基板（フレキシブル絶縁基板
）、１１ｂ……導電パターン（接続用電極）、１
１ｃ，１１ｄ……突出部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 絶縁基板上にマウントした半導体ペレツト
    の電極と 絶縁基板上の配線パターンと外部リー
    ドとの間をそれぞれ電気的に接続したものにおい
    て、 上記電気的接続部材がフレキシブル配線基板で
    あり、かつその接続用電極の端部をフレキシブル
    絶縁基板の周縁部から少し突出させ、半導体ペレ
    ツトの電極と絶縁基板上の配線パターンとの間を
    電気的に接続したことを特徴とする混成集積回路
    装置。 (2) 上記請求項１に記載のフレキシブル配線基
    板により 絶縁基板上の配線パターンと外部リー
    ドとの間を電気的に接続したことを特徴とする混
    成集積回路装置。
JP12973490U 1990-11-30 1990-11-30 Pending JPH0487657U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12973490U JPH0487657U (ja) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12973490U JPH0487657U (ja) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0487657U true JPH0487657U (ja) 1992-07-30

Family

ID=31877125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12973490U Pending JPH0487657U (ja) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0487657U (ja)

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