JPH0487658U - - Google Patents
Info
- Publication number
- JPH0487658U JPH0487658U JP13021890U JP13021890U JPH0487658U JP H0487658 U JPH0487658 U JP H0487658U JP 13021890 U JP13021890 U JP 13021890U JP 13021890 U JP13021890 U JP 13021890U JP H0487658 U JPH0487658 U JP H0487658U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- heat sink
- film substrate
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例である厚膜基板貼
付け時の平面図、第２図は第１図の正面図、第３
図、第４図は従来の厚膜基板の平面図および正面
図である。
図において、１は厚膜基板、２は放熱板、３は
リード、４は位置合せパターン、５は打ち上げだ
ぼを示す。なお、図中、同一符号は同一、又は相
当部分を示す。
Figure 1 is a plan view of one embodiment of this invention when a thick film substrate is pasted, Figure 2 is a front view of Figure 1, and Figure 3 is a front view of Figure 1.
4 are a plan view and a front view of a conventional thick film substrate. In the figure, 1 is a thick film substrate, 2 is a heat sink, 3 is a lead, 4 is an alignment pattern, and 5 is a raised dowel. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を有する左右対称な２組の厚膜基板を放熱板の両
面に貼付けた混成集積回路装置において、前記放
熱体と前記厚膜基板の貼付位置合わせに、前記放
熱板上に打ち出しだぼと、前記厚膜基板上には位
置合わせパターンを設けたことを特徴とする混成
集積回路装置。 In a hybrid integrated circuit device in which two sets of symmetrical thick film substrates each having a lead drawn out at a right angle from one side of the thick film substrate are attached to both sides of a heat sink, there is provided a method for aligning the heat sink and the thick film substrate. . A hybrid integrated circuit device, characterized in that a stamped dowel is provided on the heat sink and an alignment pattern is provided on the thick film substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021890U JPH0487658U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021890U JPH0487658U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487658U true JPH0487658U (en) | 1992-07-30 |
Family
ID=31877576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13021890U Pending JPH0487658U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487658U (en) |
-
1990
- 1990-11-30 JP JP13021890U patent/JPH0487658U/ja active Pending
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