JPH0487680U - - Google Patents
Info
- Publication number
- JPH0487680U JPH0487680U JP12947890U JP12947890U JPH0487680U JP H0487680 U JPH0487680 U JP H0487680U JP 12947890 U JP12947890 U JP 12947890U JP 12947890 U JP12947890 U JP 12947890U JP H0487680 U JPH0487680 U JP H0487680U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- connection leads
- synthetic resin
- harden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims 1
- 238000005187 foaming Methods 0.000 description 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図乃至第３図は本考案の第１実施例を示し
ており、第１図は斜視図、第２図は発泡後の断面
図、第３図は発泡後の斜視図、第４図は本考案の
第２実施例を示す斜視図である。
１……プリント配線基板本体、１Ａ……表面、
５……実装部品、６……接続リード、８……発泡
性合成樹脂。
Figures 1 to 3 show a first embodiment of the present invention, where Figure 1 is a perspective view, Figure 2 is a sectional view after foaming, Figure 3 is a perspective view after foaming, and Figure 4 is a perspective view. FIG. 2 is a perspective view showing a second embodiment of the present invention. 1...Printed wiring board main body, 1A...surface,
5... Mounting component, 6... Connection lead, 8... Foaming synthetic resin.
Claims (1)
続リードを装着したプリント配線基板において、
前記プリント配線基板の表面に少なくとも前記接
続リードを埋設するために絶縁性を有する発泡性
合成樹脂を発泡硬化させるように構成したもので
あることを特徴とするプリント配線基板。 In a printed wiring board where connection leads for mounted components are attached to the wiring part of the printed wiring board body,
A printed wiring board, characterized in that the printed wiring board is configured to foam and harden a foamable synthetic resin having insulating properties in order to embed at least the connection leads in the surface of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12947890U JPH0487680U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12947890U JPH0487680U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487680U true JPH0487680U (en) | 1992-07-30 |
Family
ID=31876877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12947890U Pending JPH0487680U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487680U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009072880A (en) * | 2007-09-21 | 2009-04-09 | Hitachi Koki Co Ltd | Electric tool |
| WO2010143379A1 (en) * | 2009-06-08 | 2010-12-16 | パナソニック株式会社 | Method of producing electronic component mounting structure, and electronic component mounting structure |
-
1990
- 1990-11-30 JP JP12947890U patent/JPH0487680U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009072880A (en) * | 2007-09-21 | 2009-04-09 | Hitachi Koki Co Ltd | Electric tool |
| WO2010143379A1 (en) * | 2009-06-08 | 2010-12-16 | パナソニック株式会社 | Method of producing electronic component mounting structure, and electronic component mounting structure |
| CN102460667A (en) * | 2009-06-08 | 2012-05-16 | 松下电器产业株式会社 | Manufacturing method of electronic component mounting structure and electronic component mounting structure |