JPH0487682U - - Google Patents
Info
- Publication number
- JPH0487682U JPH0487682U JP12879390U JP12879390U JPH0487682U JP H0487682 U JPH0487682 U JP H0487682U JP 12879390 U JP12879390 U JP 12879390U JP 12879390 U JP12879390 U JP 12879390U JP H0487682 U JPH0487682 U JP H0487682U
- Authority
- JP
- Japan
- Prior art keywords
- solder pad
- mounting structure
- component
- view
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図〜第５図はこの考案の一実施例を説明す
るもので、第１図は要部の拡大断面図、第２図は
要部の平面図、第３図は電子部品の実装状態の回
路基板の平面図、第４図は電子部品の実装状態の
回路基板の側面図、第５図は要部の一部拡大断面
図、第６図以下は従来構造を説明するもので、第
６図は要部の平面図、第７図は要部の側面図、第
８図は配線パターンの破断状態を説明する側面図
である。
１……回路基板、２，３……配線パターン、４
……半田パツド、５，９……電子部品、７……半
田、８……スルーホール、１２……ループアンテ
ナ。
Figures 1 to 5 illustrate an embodiment of this invention, with Figure 1 being an enlarged cross-sectional view of the main parts, Figure 2 being a plan view of the main parts, and Figure 3 showing the state in which electronic components are mounted. 4 is a side view of the circuit board with electronic components mounted on it, FIG. 5 is an enlarged sectional view of a part of the main part, and FIG. 6 and subsequent figures explain the conventional structure. 6 is a plan view of the main part, FIG. 7 is a side view of the main part, and FIG. 8 is a side view illustrating a broken state of the wiring pattern. 1... Circuit board, 2, 3... Wiring pattern, 4
...Solder pad, 5,9...Electronic component, 7...Solder, 8...Through hole, 12...Loop antenna.
Claims (1)
状の半田パツド上に部品の基部を半田付けして固
定する部品取付構造において、 前記半田パツドの一部にスルーホールを設けた
ことを特徴とする部品取付構造。[Claims for Utility Model Registration] In a component mounting structure in which the base of a component is soldered and fixed onto a film-like solder pad made of a conductive material formed on a circuit board, a part of the solder pad is formed through a part of the solder pad. A parts mounting structure characterized by the provision of holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12879390U JPH0487682U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12879390U JPH0487682U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487682U true JPH0487682U (en) | 1992-07-30 |
Family
ID=31876234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12879390U Pending JPH0487682U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487682U (en) |
-
1990
- 1990-11-30 JP JP12879390U patent/JPH0487682U/ja active Pending