JPH048785B2 - - Google Patents

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention is directed to a photopolymerizable resin layer formed on the surface of a printed wiring board, such as when forming an etching resist, in the manufacturing process of a printed wiring board. The present invention relates to a device for printing a predetermined image.

[Conventional technology]

Conventionally, when forming an etching resist using a photopolymerizable resin on a copper-clad laminate, a plate-making film is layered on a printed wiring board with a photopolymerizable resin layer formed on the surface, and these are placed between a transparent support plate of a printing machine and a transparent flexible film. The space between the transparent support plate and the transparent flexible film is evacuated to perform exposure. In order to improve the adhesion between the transparent support plate and the plate-making film, narrow grooves are provided on the side of the transparent support plate that comes into contact with the plate-making film, or pores are provided that pass through the transparent support plate.

[Problem to be solved by the invention]

Conventional apparatuses process the transparent support plate itself, which is difficult to process, and may not be able to process with high precision, resulting in a loss of adhesion between the transparent support plate and the plate-making film.

The present invention seeks to eliminate these drawbacks.

[Means to solve the problem]

In the present invention, an ultraviolet transmitting film 10 having a thickness of 15 to 50 μm is adhered to the surface of the transparent plate 3 that comes into contact with the plate-making film 2 by cutting a part of it into a groove shape to form an air exhaust groove 11. solved problems such as.

[Effect]

Processing is easy, as all you have to do is glue a UV-transparent film of a predetermined thickness to the transparent plate 3 and cut it off. Furthermore, the depth of the groove is determined by the thickness of the film, so there is no need to worry about processing accuracy. There's no need to do that at all.

〔Example〕

An embodiment of the present invention will be described below based on the drawings.

In FIG. 1, 1 is a printed wiring board substrate having a photopolymerizable resin layer formed on its surface, 2 is a negative or positive film, 3 is a transparent plate, 4 is a transparent flexible film, 5 is a transparent support plate, 6 is a vacuum pump, 7 is an ultraviolet lamp, and 8 is a reflector.
The transparent plate 3 is preferably a transparent glass plate with a thickness of 3 to 5 mm, and as shown in FIG.
The air exhaust groove 11 is formed by adhering the film and partially peeling off the film. Air exhaust groove 11
As shown in FIG. 3, it is more effective if they are formed radially around the center of the transparent plate 3.
The width of the air exhaust groove is preferably 5 to 15 mm. If the groove is narrower than this, air cannot be sufficiently exhausted and adhesion is impaired, and if it is wider than this, the plate-making film falls into the groove and the flatness is impaired.

An etching resist was formed on a copper-clad laminate using the apparatus of the present invention. The circuit position accuracy (the amount of change relative to the 0.03 mm line width of the negative film used) is 0.02 to 0.03 mm, the circuit dimensional accuracy (the amount of change relative to the line width of 0.15 mm of the negative film used) is 0.01 to 0.03 mm, and the transparent glass This was equivalent to using a device in which grooves were formed by processing a plate.

〔Effect of the invention〕

In the present invention, an ultraviolet transmitting film 10 having a thickness of 15 to 50 μm is adhered to the surface of the transparent plate 3 that is in contact with the plate-making film 2 by cutting a part of it into a groove shape to form an air exhaust groove 11, so that processing is easy. It is simple, and since the depth of the groove is determined by the thickness of the film, there is no need to worry about processing accuracy.

[Brief explanation of drawings]

Each of the drawings shows an embodiment of the present invention; FIG. 1 is a schematic diagram of the entire device, FIG. 2 is a sectional view of a transparent plate,
FIG. 3 is a plan view of the transparent plate. Explanation of symbols, 3... Transparent plate, 10... Ultraviolet transmitting film, 11... Air exhaust groove.

Claims (1)

[Claims] 1. A plate-making film is stacked on a printed wiring board on which a photopolymerizable resin layer is formed, and these are sandwiched between a transparent support plate of a printing machine and a transparent flexible film, and the transparent support plate and the transparent flexible film are In a device that performs exposure by creating a vacuum in the space between
A transparent plate is placed between the plate-making film and the transparent flexible film, with a part of it cut off in the form of a groove on the surface that contacts the plate-making film and an ultraviolet transmitting film with a thickness of 15 to 50 μm is glued to form an air exhaust groove. A printing device for printed wiring boards featuring: 2. The printed wiring board baking apparatus according to claim 1, wherein the air exhaust grooves have a width of 5 to 15 mm and are radial from the center of the transparent plate to the ends.