JPH0488616A - Surface-mounted electronic part - Google Patents
Surface-mounted electronic partInfo
- Publication number
- JPH0488616A JPH0488616A JP2203383A JP20338390A JPH0488616A JP H0488616 A JPH0488616 A JP H0488616A JP 2203383 A JP2203383 A JP 2203383A JP 20338390 A JP20338390 A JP 20338390A JP H0488616 A JPH0488616 A JP H0488616A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- case
- lead wire
- lead
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はプリント基板へ面実装される電子部品の改良に
関するものである。以下の説明に於いては、コンデンサ
のチップ部品を例にとって詳述する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to improvements in electronic components that are surface-mounted on printed circuit boards. In the following description, a capacitor chip component will be explained in detail as an example.
（ロ）従来の技術
従来、コンデンサ素子をアルミケースに収納したコンデ
ンサ等に於いては、コンデンサのチップ化を実現する為
に、例えば特開昭６０−２４５１１６号（ＨＯＩ Ｇ（
ｊｌｏ ８）公報に記載された技術のように、有底の外
装枠（ケース）にコンデンサを収納して、外装枠底面の
貫通孔からリード線を導出し、このリード線を、外装枠
の外表面に設けた凹部に収める様に、折曲げたものが提
案されテイル。マタ特開平２−３４９０４号（ＨＯＩＧ
ｌ、１０３５）公報に記載された技術のように、外装枠
にコンデンサを収納して外装枠端面に設けられた壁部を
越えてリード線を導出し、このリード線を外装枠の壁部
および底面に沿って折曲げたものが提案されている。(B) Conventional technology Conventionally, in the case of capacitors in which the capacitor element is housed in an aluminum case, in order to realize the chipping of the capacitor, for example, Japanese Patent Laid-Open No. 60-245116 (HOI G)
jlo 8) Like the technology described in the publication, a capacitor is housed in a bottomed exterior frame (case), a lead wire is led out from a through hole on the bottom of the exterior frame, and this lead wire is connected to the outside of the exterior frame. The tail was proposed to be bent so that it would fit into the recess provided on the surface. Mata Unexamined Patent Publication No. 2-34904 (HOIG
l, 1035) As in the technique described in the publication, a capacitor is housed in an exterior frame, a lead wire is led out beyond the wall provided on the end face of the exterior frame, and this lead wire is connected to the wall of the exterior frame and One that is bent along the bottom has been proposed.
また、特開平２−２８９１２号（ＨＯＩＧＩ／’１４）
公報に記載された技術のようにリード線を導出した外装
枠端面と反対側の端面に補助リード線を装着することに
より、基板実装時の半田熱による浮き上がり防止対策を
施したものが提案されている。Also, JP-A No. 2-28912 (HOIGI/'14)
As in the technique described in the publication, a method has been proposed in which auxiliary lead wires are attached to the end face opposite to the end face of the exterior frame from which the lead wires are led out, to prevent floating due to solder heat during board mounting. There is.
（ハ）発明が解決しようとする課題
従来のチップ形コンデンサはコンデンサの外装枠（ケー
ス）の貫通孔や壁端部を支点としてリード線を折曲げな
ければならない為、リード線の成形時に外装枠の破損が
発生することがあった。特にモールド樹脂にてコンデン
サ業子を封止したタイプに於いてはリード線の位置寸法
のズレ等によリ−ド線成形げ支点が安定せず、リード線
成形が困難であった。これらのリード線成形時、外装枠
の半田付は側底面とリード線成形面とが平行にならず、
リード線端部が浮き上がったいわゆるスプリングバンク
状態と同じ成形曲げ不良が発生することがあった。この
曲げ不良は、浮き方向だけでなく、リード線間のピッチ
不良を引起こすこともある。これらの成形不良は基板搭
載時にリード線とクリームハンダとの接触面積を少なく
し、半田付は不良発生の原因と成っている。(c) Problems to be Solved by the Invention In conventional chip-type capacitors, the lead wires must be bent using the through holes or wall ends of the capacitor's outer frame (case) as fulcrums. Damage may occur. Particularly in the type in which the capacitor elements are sealed with a molding resin, the fulcrum for forming the lead wires is unstable due to deviations in the position and dimensions of the lead wires, making it difficult to form the lead wires. When forming these lead wires, the side bottom surface and the lead wire forming surface are not parallel to each other when soldering the exterior frame.
A molding bending defect similar to a so-called spring bank condition in which the end of the lead wire is raised may occur. This bending defect may cause not only a floating direction but also a pitch defect between the lead wires. These molding defects reduce the contact area between the lead wire and the cream solder when mounting the board, and soldering becomes a cause of defects.
別の間組として、リード線を外装枠底面の凹部に収納す
ることによりリード線間ピッチ寸法を規制した場合、半
田付は後の半田浮き等の不良を目視で確認出来ず、発生
を見逃がしてしまう場合がある。If the pitch between the lead wires is regulated by storing the lead wires in a recess on the bottom of the outer frame as a separate space arrangement, defects such as solder floating after soldering cannot be visually confirmed and the occurrence may be overlooked. It may be stored away.
更に別の問題として、基板に半田付けされるのが外装枠
の一端より導出したリード線である為、半田熱により本
体が起き上がってしまう不良が発生し、その対策として
、外装枠のリード線導出湯面を延ばす方法や反対側の端
面に補助リード線を装着する方法が提案されているが、
充分な機能を発揮させる為には、前者は外装枠寸法が必
要以上に長くなり、後者は別途補助リード線の追加、成
形が必要となる。Another problem is that because the lead wires that are soldered to the board are drawn out from one end of the outer frame, the solder heat can cause the main body to rise up, and as a countermeasure to this problem, the lead wires from the outer frame are soldered to the board. Methods have been proposed to extend the hot water surface and attach an auxiliary lead wire to the opposite end.
In order to exhibit sufficient functionality, the former requires an unnecessarily long exterior frame, and the latter requires additional auxiliary lead wires and molding.
本発明はリード線折曲げ成形時の寸法安定性および基板
搭載時の半田付は安定性の確保を目的とするものである
Ｊ
（ニ） 課題を解決するための手段
本発明では、コンデンサのリード線を予め所定の形状に
折曲げ成形後、外装ケース（枠）に収納し、コンデンサ
と外装枠は李擦力により保持される。、二の時コンデン
サの成形リード線の先端部は外装枠の挿入孔に挿入され
、固定される事を特徴としている。The purpose of the present invention is to ensure dimensional stability during lead wire bending and stability during soldering when mounting on a board. After the wire is bent into a predetermined shape, it is stored in an outer case (frame), and the capacitor and the outer frame are held together by friction force. In the second case, the tip of the molded lead wire of the capacitor is inserted into the insertion hole of the outer frame and fixed.
（ホ）作 用
コンデンサ（５）から延びるリード線（４）（４）は外
装ケース（枠）（６）に影響される事なく、折曲げ成形
されるので、金型治具による成形が容易で寸法精度も向
上する。(e) Function The lead wires (4) (4) extending from the capacitor (5) are bent and molded without being affected by the outer case (frame) (6), so molding with a mold jig is easy. This also improves dimensional accuracy.
一方、リード線のロット性による多少の寸法バラツキや
スプリングバックがあっても、コンデンサ（５）と外装
枠（６）の組合せ時には、引呂リード線先端部（，４ｂ
）（４ｂ）が挿入孔（１２）（１２）に挿入固定される
ので、外装枠の底面（８）とリード線半田付は部（４ａ
）（４ａ）の平行度は確保される。またリード線間の平
行度も確保される。外装枠の逃がし用凹陥部（１１）（
１１）は、リード線半田付は部（４ａ）（４ａ）を何ら
規制するものでは無い為、この部分でリード線は半田付
は後の状態を目視で容易に確認出来る。On the other hand, even if there is some dimensional variation or springback due to lead wire lot characteristics, when the capacitor (5) and exterior frame (6) are combined, the tip of the lead wire (, 4b
) (4b) are inserted and fixed into the insertion holes (12) (12), so the bottom surface (8) of the exterior frame and the lead wire solder are connected to the part (4a).
) The parallelism of (4a) is ensured. Moreover, parallelism between the lead wires is also ensured. Exterior frame relief recess (11) (
As for 11), since the soldering of the lead wire does not restrict the parts (4a) (4a) in any way, the state of the soldering of the lead wire in this part can be easily confirmed visually.
そして引出リード端子（４）（４）はコンデンサ本体お
よびリード線先端部（４ｂ）（４ｂ）で外装枠と固定さ
れている為、半田熱による起き上りも防止出来る。Since the lead terminals (4) (4) are fixed to the exterior frame by the capacitor body and the lead wire tips (4b) (4b), rising due to solder heat can be prevented.
くべ）実施例
本発明の実施例を図面に従い説明する。第１図は、チッ
プ部品を構成するコンデンサ（５）と合成樹脂製外装ケ
ース（枠）（６）を分離して表した斜視図である。第２
図はチップ部品の正面図（ａ）、部分断面を表した側面
図（ｂ）及び下面図（ｃ）である。Embodiment An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a capacitor (5) and a synthetic resin outer case (frame) (6) separated from each other, which constitute a chip component. Second
The figures are a front view (a), a side view (b) showing a partial cross section, and a bottom view (c) of the chip component.
コンデンサ（５）は、第２図（ｂ）に示すようにアルミ
ケース等から成る、有底円筒状の金属ケース（１）に、
引呂す−ド境子（線）（４）（４）を導出したコンデン
サ素子（２）を収納し、ニポキシ等による封口体（３）
で固定したものである。リード線（４）（４）は封口体
（３）により、金属ケース（１）と位置決め保持され、
固定される。このコンデンサ（５）は第１図（ａ）に示
すように、外装ケース（枠）（６）と組合わされた時に
、基板接触面である外装枠の平面状底部（８）と平行で
且つ面接触となるように、リード線（４）（４）の半田
付は部（４ａ）（４ａ）を折曲げ成形し、なおかつ、リ
ード線先端部（４ｂ）（４ｂ）に、図のようなコノード
線挿入孔（１２）（１２）に合わせた段差付きの折曲げ
成形を施す。As shown in FIG. 2(b), the capacitor (5) is placed in a bottomed cylindrical metal case (1) made of an aluminum case or the like.
The capacitor element (2) from which the wire (wire) (4) (4) was derived is housed, and the capacitor element (2) is sealed with nipoxy or the like (3).
It is fixed at The lead wires (4) (4) are held in position with the metal case (1) by the sealing body (3),
Fixed. As shown in Fig. 1(a), when this capacitor (5) is combined with the outer case (frame) (6), it is parallel to the planar bottom part (8) of the outer case (8) which is the board contact surface. In order to make contact, the soldering parts (4a) (4a) of the lead wires (4) (4) are bent and formed, and the lead wire tips (4b) (4b) are connected with conodes as shown in the figure. The wire insertion hole (12) is bent and formed with a step to match the wire insertion hole (12) (12).
一方、第１図（ｂ）に示すように、外装枠（６）にはコ
ンデンサ（５）の金属ケース部（１）が収納される円筒
状の空間（１０）が設けられており、その内周面には、
金属ケース（１）の外径よりも小さい内接径と成るよう
な突出条（１５）、例えばリブが設けられている。コン
デンサ（５）と組合わされた時にＪ−ド線半田付は部（
４ａ）（４ａ）が位置する所には、凹陥部（１１）（１
１）が設けられている。またリード線先端部（４ｂ）（
４ｂ）が位置する所にはリード線挿入孔（１２）（１２
）が設けられている。On the other hand, as shown in Fig. 1(b), the outer frame (6) is provided with a cylindrical space (10) in which the metal case part (1) of the capacitor (5) is housed. On the periphery,
A protruding strip (15), for example a rib, is provided with an inscribed diameter smaller than the outer diameter of the metal case (1). When combined with the capacitor (5), the J-wire solder is
4a) Where the (4a) is located, there are recessed portions (11) (1
1) is provided. Also, the tip of the lead wire (4b) (
4b) is located, there are lead wire insertion holes (12) (12
) is provided.
コンデンサ（５）の挿入側の開口端面（７）と反対側の
端面には、第２図（ｂ）に示すように閉成壁面（９）が
設けられている。今外装枠（６）のコンデンサ収納空間
（１０）内にコンデンサ（５）を壁面（９）まで押圧挿
入すると同時にリード線先端部（４ｂ）（４ｂ）を挿入
孔（１２）（１２）に挿入する。この時収納空間（１０
）内周面に設けられた突出条（１５）は変形し、摩擦力
により金属ケース（１）を係止固定する。リード線（４
）（４）は、その先端部（４ｂ）（４ｂンで同じく外装
枠に係止固定され、外装枠の平面状底部（８）とフード
線半田付は部（４ａ）（４ａ）は定間隔で平行に保持さ
れる。凹陥部（１１）（１１）に連接して設けられてい
るリード端子挿入孔（１２）（１２）の延長上にあるガ
イド溝（１３）（１３）は、リード線先端部（４ｂ）（
４ｂ）をＪ−ド線挿入孔（１２）（１２）に挿入し易く
する為のものであり、コンデンサ（５）と外装枠（６）
の組合せ時に別途、挿入用外部ガイドを設ける等により
削除することも可能である。As shown in FIG. 2(b), a closed wall surface (9) is provided on the end surface of the capacitor (5) opposite to the open end surface (7) on the insertion side. Now press and insert the capacitor (5) into the capacitor storage space (10) of the exterior frame (6) up to the wall (9), and at the same time insert the lead wire tips (4b) (4b) into the insertion holes (12) (12). do. At this time, storage space (10
) The protruding strip (15) provided on the inner peripheral surface is deformed and locks and fixes the metal case (1) by frictional force. Lead wire (4
)(4) is also locked and fixed to the exterior frame at its tip (4b) (4b), and the planar bottom part (8) of the exterior frame and the hood wire soldering part (4a) (4a) are fixed at regular intervals. The guide grooves (13) (13) on the extensions of the lead terminal insertion holes (12) (12) provided in connection with the recesses (11) (11) allow the lead wires to be held parallel to each other. Tip (4b) (
4b) into the J-wire insertion hole (12) (12), and the capacitor (5) and exterior frame (6)
It is also possible to remove this by separately providing an external guide for insertion when combining the above.
また、１ｊ−ド線半田付は部（４ａ）（４ａ）は第７図
（ａ ）（ｂ ）に示すように偏平に加工されたもので
も、丸棒のままの状態でも良い。また、第２図に示すよ
うにコンデンサ（５）と外装枠（６）の組合せ時に、リ
ード線（４）（４）が開口端面（７）よりも内側に収納
されるように、開口端面（７）をコンデンサの金属ケー
ス（１）や封口体（３）の端部よりも突出させる事によ
り、チップマウンタ等による表面実装時、チップ部品位
置決めの為の治具押圧が外装枠（６）に掛り、コンデン
サ（５）およびそのリード線（４）（４）に掛らないよ
うにしている。Further, the 1j-wire soldering parts (4a) may be flattened as shown in FIGS. 7(a) and 7(b), or may be in the form of round bars. Further, as shown in FIG. 2, when the capacitor (5) and the exterior frame (6) are combined, the opening end surface ( By making 7) protrude beyond the ends of the metal case (1) and sealing body (3) of the capacitor, the jig for positioning the chip component can be pressed against the outer frame (6) during surface mounting using a chip mounter, etc. This prevents the capacitor (5) and its lead wires (4) from getting caught.
第３図には他の実施例を示す。外装枠の開口端面（７）
にリード線（４）（４）の線径Ａよりも小さい溝巾Ｂの
嵌合溝（１４）（１４）を設け、リード線（４）（４）
をリード線嵌合溝（１４）（１４）に押圧挿入し、壁面
（９）に金属ケース（１）を当接する。この時、フード
線（４）（４）と嵌合溝（１４）（１４）の嵌合、摩擦
力により、コンデンサ（５）と外装枠（６）を係止、固
定する。この場合、第３図（ｂ）に示すようにフード線
（４）（，１）をリード線嵌合溝（１４）（１４）の溝
底部（１６）（１６）に当接させる事により、位置決め
を行ない、壁面（９）を不要とする事も可能であり、そ
の分だけ外装枠（６）の寸法を短くする事が可能となる
。FIG. 3 shows another embodiment. Opening end surface of exterior frame (7)
A fitting groove (14) (14) with a groove width B smaller than the wire diameter A of the lead wire (4) (4) is provided in the lead wire (4) (4).
are press-inserted into the lead wire fitting grooves (14) (14), and the metal case (1) is brought into contact with the wall surface (9). At this time, the capacitor (5) and the outer frame (6) are locked and fixed by the fitting between the hood wires (4) (4) and the fitting grooves (14) (14) and the frictional force. In this case, by bringing the hood wire (4) (, 1) into contact with the groove bottom (16) (16) of the lead wire fitting groove (14) (14) as shown in Fig. 3(b), It is also possible to perform positioning and eliminate the need for the wall surface (9), making it possible to shorten the dimensions of the exterior frame (6) accordingly.
第４図および第６図には更に他の実施例を示す。第６図
（ａ）は、リード線挿入孔（１２）の２面寸法（Ｃ）を
リード線径寸法（Ａ）よりも狭めたものを示し、同図（
ｂ）はリード線先端部（４ｂ）を偏平に加工する事によ
り、その長大寸法（Ｄ）をリード線挿入孔（１２）の穴
径寸法（Ｅ）よりも大きくしたものを示す。コンデンサ
（５）を外装枠（６）に組合せた時、前記リード線先端
部（４ｂ）（４ｂ）をリード線挿入孔（１２）（１２）
に押圧挿入する事により、その嵌合摩擦力によってコン
デンサ（５）と外装枠（６）を嵌合固定するものである
。この場合も、リード線挿入孔（１２）の端面部（１７
）にリード線先端部（４ｂ）の段差部を当接する事によ
り位置決めを行ない、壁面（９）を削除する事が可能で
ある。FIGS. 4 and 6 show still other embodiments. FIG. 6(a) shows the lead wire insertion hole (12) with the two-sided dimension (C) narrower than the lead wire diameter dimension (A).
b) shows a lead wire tip (4b) which is processed to be flat so that its long dimension (D) is larger than the hole diameter dimension (E) of the lead wire insertion hole (12). When the capacitor (5) is assembled to the exterior frame (6), the lead wire tips (4b) (4b) are inserted into the lead wire insertion holes (12) (12).
By pressing and inserting the capacitor (5) into the outer frame (6), the capacitor (5) and the outer frame (6) are fitted and fixed by the frictional force of the fitting. In this case as well, the end face portion (17) of the lead wire insertion hole (12)
) by abutting the stepped portion of the lead wire tip (4b), positioning can be performed and the wall surface (9) can be removed.
第５図に示す実施例は、外装枠（６）の成型時の金型強
度のアップを計ったもので、生産性の向上を目的とする
。リード線径（Ａ）よりも小さい溝巾（Ｆ）のリード端
部挿入用開口溝（１８）は外装枠（６）の側面（１９）
に開口部を設ける事により、成型時のビン折れや曲りを
防止する働きをする。そしてコンデンサ（５）を外装枠
（６）に組合せた時、リード線先端部（４ｂ）（４ｂ）
をリード端部挿入用開口溝（１８）（１８）に押圧挿入
し、その嵌合摩擦力によってコンデンサ（５）と外装枠
（６）を嵌合固定するものである。The embodiment shown in FIG. 5 is designed to increase the strength of the mold when molding the exterior frame (6), and is intended to improve productivity. The lead end insertion opening groove (18), which has a groove width (F) smaller than the lead wire diameter (A), is located on the side surface (19) of the exterior frame (6).
By providing an opening in the bottle, it works to prevent the bottle from breaking or bending during molding. When the capacitor (5) is assembled to the exterior frame (6), the lead wire tips (4b) (4b)
are press-inserted into the lead end insertion opening grooves (18) (18), and the capacitor (5) and the exterior frame (6) are fitted and fixed by the fitting friction force.
外装枠は耐熱性に優れた材料を用いることが望ましく、
また可撓性の有るものが良い。即ち、エポキシ、フェノ
ール、ポリフェニレンサルファイド、ポリイミド、ポリ
ブチレン、テレフタレイト等の合成樹脂が適当である。It is desirable to use a material with excellent heat resistance for the exterior frame.
It is also good to have flexibility. That is, synthetic resins such as epoxy, phenol, polyphenylene sulfide, polyimide, polybutylene, and terephthalate are suitable.
（ト）発明の効果
このように本発明をコンデンサに適用した場合には、コ
ンデンサは単体でリード線の折曲げ成形が可能な偽、精
度の良い成形を行なう事が出来る。そして、コンデンサ
と外装ケース（枠）の組合せ時、リード線先端は、外装
枠挿入孔に係止される為、外装ケースの平面状底部とリ
ード線半田付は部は正確に位置決めされる。その為、プ
リント基板上にチップ部品を搭載した時、リード線とク
リームハンダの接触面は一定となり、良好な半田付けが
成される。また、リード線はコンデンサ本体とリード線
先端で外装枠に固定された状態となる為、半田熱による
外装枠の起き上がり等も防止出来る。コンデンサと外装
枠の組合せは押圧挿入のみとなる為、合成樹脂接着剤等
の補助材料が不要である等の効果が得られる。(G) Effects of the Invention As described above, when the present invention is applied to a capacitor, the capacitor can be molded with high accuracy by bending the lead wire. When the capacitor and the outer case (frame) are combined, the tip of the lead wire is locked in the outer frame insertion hole, so that the planar bottom of the outer case and the soldered part of the lead wire are accurately positioned. Therefore, when a chip component is mounted on a printed circuit board, the contact surface between the lead wire and the cream solder is constant, and good soldering is achieved. Furthermore, since the lead wire is fixed to the outer frame at the capacitor body and the tip of the lead wire, it is possible to prevent the outer frame from rising due to soldering heat. Since the combination of the capacitor and the exterior frame requires only press insertion, advantages such as no need for auxiliary materials such as synthetic resin adhesives can be obtained.
第１図は本発明の面実装電子部品の実施例を示し、その
組立途上の斜視図で同図（ａ）はコンデンサ、（ｂ）は
外装ケースを示す。第２図は本発明の組立完成状態を示
し、同図（ａ）は正面図、（ｂ）は部分断面側面図、（
ｃ）は下面図である。第３図は本発明の他の実施例を示
し、同図（ａ）はその斜視図、（ｂ）は部分断面側面図
である。第４図は、本発明の更に他の実施例を示し、引
出リード端子の挿入断面図である。第５図は本発明の他
の実施例を示す斜視図である。第６図は本発明の詳細な
説明するための形状詳細図であり、同図（ａ）は丸リー
ド端部、（ｂ）は偏平リード端部の実施例を示す。第７
図は、リード線半田付は部（４ａ）の形状を示す実施例
であり、同図（ａ）は偏平形状、（ｂ）は丸形状を示す
。第８図は、従来の実施例によるチップ部品の基板への
半田付は状態を示し、同図（ａ）はリード線半田付は部
の成形不良による半田浮き状態を示し、（ｂ）は半田熱
等による本体が起き上った状態を示す正面図である。
（１）・・・金属ケース、（２）・・・コンデンサ素子
、（３）・・・封口体、（４）・・・引出リード端子、
（４ａ）・・・リード線半田付は部、（４ｂ）・・・リ
ード線先端部、（５）・・・コンデンサ、（６）・・・
外装ケース、（７）・・・開口端面、（８）・・・外装
ケースの平面状底部、（９）・・・閉成壁面、（１０）
・・・コンデンサ収納円筒状空間、（１１）・・・凹陥
部、（１２）・・・リード線挿入孔、（１３）・・・ガ
イド溝、（１４）・・・リード線嵌合溝、（１５）・・
・外装ケースの内周面突出条、（１６）・・・リード線
嵌合溝底部、（１７）・・・リード線挿入孔端面部、（
１８）・・・リード端部挿入用開口溝、（１９）・・・
外装ケース側面、（２ｏ）・・・チップ部品、（２１）
・・・プリント基板、（２２）・・・クリーム半田。
出願人 三洋電機株式会社外１名
代理人 弁理士 西野卓嗣（外２名）
第２図
（ａ）
（Ｃ）
（ｂ）
第３図
（ｂ）
（ａ）
（ｂ）
第５図
第４図
ｂFIG. 1 shows an embodiment of the surface-mounted electronic component of the present invention, and is a perspective view of the device in the process of being assembled, with (a) showing a capacitor and (b) showing an exterior case. FIG. 2 shows the assembled state of the present invention, in which (a) is a front view, (b) is a partially sectional side view, and (
c) is a bottom view. FIG. 3 shows another embodiment of the present invention, in which FIG. 3(a) is a perspective view and FIG. 3(b) is a partially sectional side view. FIG. 4 shows still another embodiment of the present invention, and is a sectional view of an inserted lead terminal. FIG. 5 is a perspective view showing another embodiment of the present invention. FIG. 6 is a detailed view of the shape for explaining the present invention in detail, and FIG. 6(a) shows an example of a round lead end, and FIG. 6(b) shows an example of a flat lead end. 7th
The figure shows an example in which the shape of the lead wire soldering part (4a) is shown, with (a) showing a flat shape and (b) showing a round shape. FIG. 8 shows the state of soldering of chip components to the board according to the conventional embodiment; FIG. FIG. 3 is a front view showing a state in which the main body is raised due to heat or the like. (1)...Metal case, (2)...Capacitor element, (3)...Sealing body, (4)...Output lead terminal,
(4a)... Lead wire soldering part, (4b)... Lead wire tip, (5)... Capacitor, (6)...
Exterior case, (7)...Opening end surface, (8)...Planar bottom of the exterior case, (9)...Closing wall surface, (10)
... Capacitor storage cylindrical space, (11) ... Recessed part, (12) ... Lead wire insertion hole, (13) ... Guide groove, (14) ... Lead wire fitting groove, (15)...
・Protruding stripes on the inner circumferential surface of the exterior case, (16)...Lead wire fitting groove bottom, (17)...Lead wire insertion hole end surface, (
18)... Opening groove for inserting the lead end, (19)...
External case side, (2o)...Chip parts, (21)
...Printed circuit board, (22)...Cream solder. Applicant: 1 other person from Sanyo Electric Co., Ltd. Representative: Patent attorney Takuji Nishino (2 others) Figure 2 (a) (C) (b) Figure 3 (b) (a) (b) Figure 5 Figure 4 b
Claims (3)
部品素子を筒状金属ケース内に収納してなる部品本体と
、外部の平面状底部の一部に凹陥部を設け且つ該凹陥部
に連接して挿入孔を設けると共に筒状内周面の一部に突
出条を設けて前記ケースの外径よりも少許内径を狭くし
た合成樹脂製筒状外装ケースとを備え、前記外装ケース
に前記部品本体の金属ケースを圧入収納すると共に前記
部品本体の引出リード端子を前記外装ケースに沿って折
曲げて前記ケースの凹陥部に嵌入し且つ該引出リード端
子の端縁を前記挿入孔に挿入固定してなる面実装電子部
品。(1) A component body in which a component element from which a pair of lead terminals are drawn out from the same end face is housed in a cylindrical metal case, and a recessed portion is provided in a part of the external planar bottom, and the recessed portion is provided with a recessed portion. a synthetic resin cylindrical outer case having an insertion hole connected thereto and a protruding strip formed on a part of the cylindrical inner circumferential surface so as to have an inner diameter slightly narrower than the outer diameter of the case; The metal case of the component body is press-fitted and housed, and the pull-out lead terminal of the component body is bent along the outer case and fitted into the recessed part of the case, and the edge of the pull-out lead terminal is inserted and fixed into the insertion hole. Surface-mounted electronic components.
分を突出させて、引出リード端子を前記外装ケースに沿
って折曲げ固定した際、引出リード端子が外装ケース端
面より突出しないようにしたことを特徴とする特許請求
の範囲第１項に記載の面実装電子部品。(2) A portion of the outer case that is different from the bent portion of the drawer lead terminal is made to protrude so that when the drawer lead terminal is bent and fixed along the outer case, the drawer lead terminal does not protrude from the end surface of the outer case. A surface-mounted electronic component according to claim 1, characterized in that:
、外装ケースの挿入孔の一部を開口させ、部品本体のリ
ード端子を該開口から挿入孔に圧入固定することを特徴
とする特許請求の範囲第１項或は第２項記載の面実装電
子部品。(3) A patent characterized in that a part of the insertion hole of the outer case is opened in a direction perpendicular to the insertion direction of the outer case of the component body, and the lead terminal of the component body is press-fitted and fixed into the insertion hole from the opening. A surface-mounted electronic component according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2203383A JPH07105304B2 (en) | 1990-07-31 | 1990-07-31 | Surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2203383A JPH07105304B2 (en) | 1990-07-31 | 1990-07-31 | Surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488616A true JPH0488616A (en) | 1992-03-23 |
| JPH07105304B2 JPH07105304B2 (en) | 1995-11-13 |
Family
ID=16473130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2203383A Expired - Fee Related JPH07105304B2 (en) | 1990-07-31 | 1990-07-31 | Surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07105304B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202011000854U1 (en) * | 2011-04-12 | 2012-07-13 | Frolyt Kondensatoren Und Bauelemente Gmbh | electrolytic capacitor |
| WO2017170497A1 (en) * | 2016-03-29 | 2017-10-05 | 日立金属株式会社 | Terminal structure for surface-mounted electronic component, surface-mounted electronic component comprising terminal structure, and surface-mounted reactor |
| JP2022129775A (en) * | 2021-02-25 | 2022-09-06 | パナソニックＩｐマネジメント株式会社 | Power storage module and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258209A (en) * | 1988-08-23 | 1990-02-27 | Nippon Chemicon Corp | Chip type capacitor |
-
1990
- 1990-07-31 JP JP2203383A patent/JPH07105304B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258209A (en) * | 1988-08-23 | 1990-02-27 | Nippon Chemicon Corp | Chip type capacitor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202011000854U1 (en) * | 2011-04-12 | 2012-07-13 | Frolyt Kondensatoren Und Bauelemente Gmbh | electrolytic capacitor |
| WO2017170497A1 (en) * | 2016-03-29 | 2017-10-05 | 日立金属株式会社 | Terminal structure for surface-mounted electronic component, surface-mounted electronic component comprising terminal structure, and surface-mounted reactor |
| JPWO2017170497A1 (en) * | 2016-03-29 | 2019-01-10 | 日立金属株式会社 | Terminal structure of surface mount electronic component, surface mount electronic component having the terminal structure, and surface mount reactor |
| JP2022129775A (en) * | 2021-02-25 | 2022-09-06 | パナソニックＩｐマネジメント株式会社 | Power storage module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07105304B2 (en) | 1995-11-13 |
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