JPH0491475A - Semiconductor chip and semiconductor integrated circuit device using same - Google Patents

Abstract

PURPOSE:To provide flexibility to a semiconductor chip to alleviate restriction handling and mounting by forming a substrate with an organic semiconductor material having flexibility. CONSTITUTION:A semiconductor chip 1 is structured by an integrated circuit 2 formed on an organic semiconductor and a substrate 3 on which this integrated circuit 2 is mounted. The integrated circuit 2 integrates at least two or more of active elements or passive elements and is formed as the circuit wiring these circuit elements with each other. The substrate 3 is formed by an organic material such as resin having flexibility. As the electrode connection of the semiconductor chip 1, the electrode is bonded to a wiring substrate 5 through a bump electrode (electrode) 4. Thereby a semiconductor integrated circuit device 7 of the simplified package using a sealing material 6 such as water glass or cement milk having flexibility under the solid condition may be formed. The substrate 3 is formed as a film or sheet to give further flexibility to the semiconductor chip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a manufacturing technology for semiconductor integrated circuit devices, and in particular to a semiconductor chip and a semiconductor integrated circuit device that can improve the flexibility of semiconductor chips and semiconductor integrated circuit devices. This invention relates to techniques that are effective when applied to the semiconductor integrated circuit devices used.

[Prior Art] Conventionally, as a semiconductor chip for a semiconductor integrated circuit device, for example, as described in literature such as "Electronic Industrial Plastics" published by Kogyo Research Association Co., Ltd., January 10, 1985, pages 11 to 18, Circuit elements are formed on substrates such as single crystal semiconductors such as , Si, and Ge, and compound semiconductors such as GaAs and InSb.

[Problems to be Solved by the Invention] However, in the prior art as described above, a single crystal semiconductor or a compound semiconductor is used as the semiconductor material, and no consideration is given to the flexibility of the semiconductor chip, making it difficult to handle. There are also various problems in terms of implementation.

For example, they are easily damaged by even a small impact, require complicated packaging, and cannot be mounted on curved surfaces or places where stress is applied.

Moreover, the semiconductor integrated circuit device in which the above-mentioned semiconductor chips are assembled and sealed also has the disadvantage that mounting locations are limited and flexible mounting is not possible.

Therefore, the present inventors focused on flexible organic materials, for example, instead of conventional substrate materials such as single crystal semiconductors, as materials for substrates on which circuit elements are formed.
We have discovered that an organic semiconductor, which is a better electrical conductor than this organic material, can be used for the substrate of a semiconductor chip.

That is, an object of the present invention is to provide a semiconductor chip and a semiconductor integrated circuit device using the semiconductor chip, which can provide flexibility to the semiconductor chip and alleviate restrictions in terms of handling and mounting.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, the semiconductor chip of the present invention is a semiconductor chip in which a circuit element of an active element or a passive element is formed on or in a substrate, and the substrate is formed of a flexible organic semiconductor material. In this case, at least two or more circuit elements are integrated and these circuit elements are interconnected to form a semiconductor chip for an integrated circuit.

Further, the substrate is formed in the form of a film or a sheet.

Furthermore, the electrodes of the semiconductor chip are formed from a flexible organic conductive material.

Also, a semiconductor using the semiconductor chip of the present invention! Integrated circuit devices are devices in which flexible semiconductor chips are assembled and sealed using flexible materials.

[Function] According to the above-described semiconductor chip, the substrate on which the circuit elements of the active elements or the passive elements are formed is formed of a flexible organic semiconductor material. Chips can be made more flexible.

Thereby, it can be freely deformed by the action of stress and the like, and can also be easily returned to its initial shape.

Furthermore, by forming the substrate in the form of a film or sheet, it is possible to provide even more flexibility. This allows for incorporation into film or sheet products.

Further, since the electrodes of the semiconductor chip are formed of a flexible organic conductive material, the electrodes can be made flexible due to the flexibility of the organic conductive material. As a result, when testing a semiconductor chip, it becomes possible to apply uniform pressure to the electrode, adjust the contact area, and pierce the electrode, and it is possible to suppress inspection failures due to poor contact or the like.

Further, according to the semiconductor integrated circuit device described above, a flexible semiconductor chip is assembled and sealed with a flexible material, and the flexibility of the assembly and sealing material allows the semiconductor integrated circuit device to be It can be flexible. Thereby, even in the product state, it can be deformed into any shape.

[Example] Fig. 1 is a cross-sectional view showing a semiconductor chip according to an embodiment of the present invention, Fig. 2 is a plan view of the semiconductor chip of this embodiment, and Fig.
The figure is a cross-sectional view showing a semiconductor integrated circuit device in which the semiconductor chip of this example is assembled and sealed, and FIGS. It is a diagram.

First, the structure of the semiconductor chip of this embodiment will be explained with reference to FIGS. 1 and 2.

The semiconductor chip 1 of this embodiment includes an integrated circuit 2 formed of, for example, an organic semiconductor, and a substrate 3 on which the integrated circuit 2 is mounted.

The integrated circuit 2 is formed into a circuit in which at least two or more circuit elements, such as active elements or passive elements, are integrated, and these circuit elements are interconnected. It is made of organic semiconductor material and has flexibility,
It has a structure that can be deformed by the action of stress.

The substrate 3 is made of, for example, an organic material such as a flexible resin, and has a structure that can be deformed to follow the deformed integrated circuit 2.

As an example of electrode connection of the semiconductor chip 1 of this embodiment, for example, a bump electrode (electrode) as shown in FIG.
The semiconductor integrated circuit device 7 is bonded to the wiring board 5 via the semiconductor integrated circuit device 4 and is formed into a simple package using a sealing material 6 such as water glass or cement milk that is flexible in a solidified state.

The bump electrode 4 is made of, for example, a flexible organic conductive material, and has a structure that allows it to be easily deformed and returned to its initial shape.

Next, the operation of this embodiment will be explained.

In the semiconductor chip 1 configured as described above, the integrated circuit 2 is formed of an organic semiconductor material, and the integrated circuit 2
Since the substrate 3 on which the chip is mounted is made of an organic material, the semiconductor chip 1 can be made flexible due to the organic semiconductor material and the flexibility of the organic material, so that it can be freely deformed by the action of stress, etc. Moreover, it can be easily returned to its initial shape.

As a result, restrictions on the handling and mounting surface of the semiconductor chip I are relaxed, and mounting on a curved surface or a location where stress is applied is possible. In other words, there is no fear of damage caused by small impacts as in the conventional case, and packaging can be easily performed.

Furthermore, since the semiconductor integrated circuit device 7 in which the semiconductor chip 1 is packaged is also packaged with a flexible material, it can be deformed into any shape even in the product state.

Furthermore, regarding the inspection of the semiconductor chip 1, since the bump electrode 4 is formed of an organic conductive material, the bump electrode 4 can be made flexible due to the flexibility of the organic conductive material, resulting in simplified reliability. This enables highly accurate testing.

For example, in an inspection by crimping the test substrate 8 as shown in FIG. 4(a), the flexibility of the bump electrodes 4 makes it possible to crimp all the bump electrodes 4 evenly, and the contact area can be adjusted. Therefore, inspection defects due to poor contact can be suppressed.

Further, as shown in FIG. 4(b), since the test terminal 9 of the test device can be inserted into the bump electrode 4, the reliability of the test can be improved in this case as well.

Furthermore, not only the bump electrode 4 but also the substrate 3 on which the integrated circuit 2 is mounted is inspected by piercing the test terminal 9 and bringing it into contact with a predetermined location of the integrated circuit 2 as shown in FIG. 4(C). is possible.

Therefore, according to the semiconductor chip 1 of this embodiment and the semiconductor integrated circuit device 7 using the same, not only the flexibility of the semiconductor chip 1 is improved, but also the flexibility of the semiconductor integrated circuit device 7 that is puff-caged is improved. It can be formed into products with

As above, the invention made by the present inventor has been specifically explained based on Examples, but it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, with regard to the semiconductor chip l of this embodiment, a case has been described in which an integrated circuit 2 formed of an organic semiconductor is formed on a substrate 3, but the present invention is not limited to the above embodiment; The present invention is also applicable to the case where the integrated circuit 2 is formed inside the substrate 3 by using an organic semiconductor material as the substrate 3 itself.

In addition, regarding the connection of the semiconductor chip 1, the bump electrode 4
The present invention is not limited to the bonding connection made by the method, but is also applicable to, for example, a case where an electrode pad (electrode) is formed on the semiconductor chip 1 and wire bonding is performed from the electrode pad via a metal wire.

In this case as well, the electrode pads are formed of an organic conductive material, allowing easy and reliable inspection not only on the mounting surface but also on inspection.

Furthermore, the connection of the semiconductor chip 1 can be made by, for example, piercing the connection signal and power terminals, and the user can flexibly determine the terminal positions.

Further, it is possible to form the substrate 3 into a film or sheet to give the semiconductor chip 1 more flexibility, and in this case, it is incorporated into a flexible film or sheet card, etc. It is also possible.

[Effects of the Invention] Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

(1) A semiconductor chip in which circuit elements such as active elements or passive elements are formed on or in a substrate, and since the substrate is formed of a flexible organic semiconductor material, the organic semiconductor material has Since the semiconductor chip can be made flexible, it can be freely deformed by the action of stress and the like, and can easily return to its initial shape.

(2) By forming the substrate in the form of a film or sheet, it can be made more flexible, so it can be easily incorporated into a film or sheet product.

(3) By forming the electrodes of a semiconductor chip using a flexible organic conductive material, the flexibility of the organic conductive material allows the electrodes to be made flexible. Equal pressure bonding to the test board, adjustment of the contact area of the electrode, or test terminal.
This makes it possible to pierce the electrode, thereby suppressing inspection failures due to poor contact, etc.

(4) By assembling and encapsulating flexible semiconductor chips with flexible materials, the flexibility of the assembly and encapsulation materials allows semiconductor integrated circuit devices to be made flexible. Therefore, the structure can be freely deformed even in the product state.

(5) With (1), (2) and (3) above, restrictions on the handling and mounting of semiconductor chips are relaxed, making it possible to mount on curved surfaces or places where stress is applied, and at the same time It is possible to obtain a semiconductor chip that can be packaged easily and at low cost without worrying about damage caused by such a small impact.

(6) According to (3) above, it is possible to obtain a semiconductor chip in which testing of the semiconductor chip is simplified and at the same time, highly reliable testing is possible due to reduction in testing defects.

(7) According to (4) above, restrictions on the mounting of a semiconductor integrated circuit device are relaxed, and a semiconductor integrated circuit device that can be mounted in a wide range of products can be obtained.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view showing a semiconductor chip according to an embodiment of the present invention, Fig. 2 is a plan view of the semiconductor chip of this embodiment, and Fig. 3 is a semiconductor obtained by assembling and sealing the semiconductor chip of this embodiment. Cross-sectional views showing the integrated circuit device, FIGS. 4(a), (b) and (C)
FIG. 2 is an explanatory diagram showing a method of testing a semiconductor chip according to the present embodiment. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Integrated circuit, 3... Substrate, 4... Bump electrode (electrode), 5... Wiring board,
6... Sealing material, 7... Semiconductor integrated circuit device, 8...
-Test board, 9...Test terminal. Agent Patent Attorney Daiwa Tsutsui Figure 3: Board diagram

Claims (1)

[Claims] 1. A semiconductor chip in which a circuit element, an active element or a passive element, is formed on or in a substrate, characterized in that the substrate is formed of a flexible organic semiconductor material. semiconductor chip. 2. The semiconductor chip according to claim 1, wherein the semiconductor chip is an integrated circuit semiconductor chip in which at least two or more of the circuit elements are integrated and the circuit elements are interconnected. 3. The semiconductor chip according to claim 1, wherein the substrate is formed in the form of a film or a sheet. 4. The semiconductor chip according to claim 1, wherein the electrodes of the semiconductor chip are formed of a flexible organic conductive material. 5. The semiconductor chip according to claim 1, 2, 3 or 4,
A semiconductor integrated circuit device characterized by being assembled and sealed using a flexible material.