JPH05102778A - Piezoelectric component - Google Patents
Piezoelectric componentInfo
- Publication number
- JPH05102778A JPH05102778A JP22869791A JP22869791A JPH05102778A JP H05102778 A JPH05102778 A JP H05102778A JP 22869791 A JP22869791 A JP 22869791A JP 22869791 A JP22869791 A JP 22869791A JP H05102778 A JPH05102778 A JP H05102778A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- piezoelectric
- substrate
- vibration
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000000919 ceramic Substances 0.000 claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 27
- 230000000694 effects Effects 0.000 abstract description 11
- 230000002238 attenuated effect Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 230000002411 adverse Effects 0.000 description 4
- 238000013016 damping Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】
【目的】 この発明は、セラミック圧電基板からセラミ
ック封止基板への不要振動の伝播を抑え、これによりエ
ネルギー閉じ込め効果を発揮できる圧電部品を提供する
ことにある。
【構成】 セラミック圧電基板２とセラミック封止基板
４，４の端面電極１１，１１をセラミックよりヤング率
の低い導電接着剤により形成したものであり、該導電接
着剤の部分で不要振動が減衰され、封止基板４，４には
伝わらないので、例えばディスクリミネータの復調歪率
特性の向上、フィルタの高域側のスプリアスの低減、あ
るいはトラップの映像帯域内Ｇ．Ｄ．Ｔの向上などを図
ることができるなど、電気特性が向上する。
(57) [Abstract] [PROBLEMS] To provide a piezoelectric component capable of suppressing the propagation of unnecessary vibration from the ceramic piezoelectric substrate to the ceramic sealing substrate and thereby exerting an energy trapping effect. [Structure] The ceramic piezoelectric substrate 2 and the end electrodes 11 of the ceramic sealing substrates 4 and 4 are formed by a conductive adhesive having a Young's modulus lower than that of ceramic, and unnecessary vibration is attenuated at the conductive adhesive. , The signal is not transmitted to the sealing substrates 4 and 4, so that, for example, the demodulation distortion characteristic of the discriminator is improved, spurious on the high frequency side of the filter is reduced, or G.G. D. The electrical characteristics are improved such that T can be improved.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、各種電子回路に組み
込んで使用される圧電部品に関し、詳しくはエネルギー
閉じ込め形の圧電共振子における制振構造に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used by incorporating it into various electronic circuits, and more particularly to a vibration damping structure for an energy trap type piezoelectric resonator.
【０００２】[0002]
【従来の技術】従来の厚みすべりエネルギー閉じ込め形
の圧電共振子は、例えばセラミック製圧電基板の両面に
対向電極を形成してなる圧電共振子をセラミック封止基
板により封止すると共に、上記対向電極を封止基板の端
面電極に導通させたものが知られており、上記セラミッ
ク封止基板を用いることにより、圧電チップ部品の耐熱
性の向上が図られるようになっている。2. Description of the Related Art A conventional thickness-shear energy trapping type piezoelectric resonator is formed by sealing a piezoelectric resonator formed by opposing electrodes on both surfaces of a ceramic substrate made of ceramic, for example, with a ceramic sealing substrate, It is known that the electrode is electrically connected to the end surface electrode of the sealing substrate, and the heat resistance of the piezoelectric chip component can be improved by using the ceramic sealing substrate.
【０００３】[0003]
【発明が解決しようとする課題】ところが、上記従来の
如く、セラミック圧電基板をセラミック封止基板で挟ん
だ構成では、圧電共振子の不要振動による弊害が生じ
る。即ち、チップの長短辺のサイズで決定される長さ方
向の高周波や輪郭振動等により、圧電基板の不要振動が
セラミック封止基板に伝播して、圧電基板と封止基板と
が共振し、電気特性が劣化する。また、圧電体基板２の
メインの漏れ振動による弊害、即ち、チップの振動部分
の両端において減衰されるべき振動が減衰されずに、該
振動部分に反射することによって、メインの振動に悪影
響を与える。However, in the structure in which the ceramic piezoelectric substrate is sandwiched between the ceramic sealing substrates as in the above-mentioned conventional technique, there is a problem due to unnecessary vibration of the piezoelectric resonator. That is, unnecessary vibration of the piezoelectric substrate is propagated to the ceramic sealing substrate due to high frequency in the length direction determined by the size of the long and short sides of the chip, contour vibration, etc., and the piezoelectric substrate and the sealing substrate resonate, causing electrical resonance. The characteristics deteriorate. Further, the main leakage vibration is adversely affected by the main leakage vibration of the piezoelectric substrate 2, that is, the vibration to be attenuated at both ends of the vibration portion of the chip is not attenuated but is reflected to the vibration portion. ..
【０００４】上記のように振動エネルギーの閉じ込め効
果が悪化することにより、例えばディスクリミネータに
おいては復調歪率波形に不要振動によるリップルが現れ
て、復調歪率特性が低下するなどの欠点が生じる。As described above, the effect of confining the vibration energy is deteriorated, so that, for example, in a discriminator, a ripple due to unnecessary vibration appears in the demodulation distortion rate waveform, and the demodulation distortion rate characteristic is deteriorated.
【０００５】この発明は、上記従来の課題を解消するた
めになされたもので、セラミック封止基板への不要振動
等の伝播を抑えることができ、これにより閉じ込め効果
を発揮できる圧電部品を提供することを目的とする。The present invention has been made in order to solve the above-mentioned conventional problems, and provides a piezoelectric component capable of suppressing the propagation of unnecessary vibrations to the ceramic sealing substrate and thereby exerting a confinement effect. The purpose is to
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、セラミック圧電基板の両面に対向電極
を設けた圧電共振子をセラミック封止基板により封止す
ると共に、上記対向電極を封止基板の端面電極に導通さ
せた圧電部品であり、上記端面電極をセラミックよりも
ヤング率の低い導電接着剤により形成したことを特徴と
するものである。In order to solve the above problems, the present invention seals a piezoelectric resonator having opposing electrodes provided on both surfaces of a ceramic piezoelectric substrate with a ceramic sealing substrate, and A piezoelectric component electrically connected to an end face electrode of a sealing substrate, characterized in that the end face electrode is formed of a conductive adhesive having a Young's modulus lower than that of ceramics.
【０００７】[0007]
【作用】この発明によれば、セラミック圧電基板をセラ
ミック封止基板で挟んだ構造において、両基板の端面電
極をセラミックよりもヤング率の低い導電接着剤により
形成して、端面電極そのものに制振効果を持たせるよう
にしたので、圧電基板の不要振動やメインの漏れ振動が
導電接着剤の部分で効率良く減衰され、封止基板には伝
わらない。従って、振動エネルギーの閉じ込め効果が向
上し、不要振動等による悪影響を極力抑えることができ
る。According to the present invention, in the structure in which the ceramic piezoelectric substrates are sandwiched by the ceramic sealing substrates, the end face electrodes of both substrates are formed of a conductive adhesive having a Young's modulus lower than that of the ceramic, and the end face electrodes themselves are damped. Since the effect is provided, unnecessary vibration of the piezoelectric substrate and main leakage vibration are efficiently attenuated at the conductive adhesive portion and are not transmitted to the sealing substrate. Therefore, the effect of confining the vibration energy is improved, and the adverse effect due to unnecessary vibration or the like can be suppressed as much as possible.
【０００８】[0008]
【実施例】以下、この発明の一実施例を添付図面に従っ
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.
【０００９】図１及び図２において、１は厚みすべりエ
ネルギー閉じ込め形圧電共振子で、セラミック圧電基板
２の両面がセラミック封止基板４，４により封止されて
いる。１０は外部電極で、端面電極１１と、この端面電
極１１に導通する上下電極１２，１２と、該端面電極１
１と上下電極１２，１２とを全面に亘って被覆する金属
メッキ層１３とで構成されている。In FIGS. 1 and 2, reference numeral 1 denotes a thickness-shear energy trapping type piezoelectric resonator in which both sides of a ceramic piezoelectric substrate 2 are sealed by ceramic sealing substrates 4 and 4. Reference numeral 10 denotes an external electrode, which is an end surface electrode 11, upper and lower electrodes 12 and 12 which are electrically connected to the end surface electrode 11, and the end surface electrode 1.
1 and the upper and lower electrodes 12, 12 with a metal plating layer 13 covering the entire surface.
【００１０】上記端面電極１１，１１は、セラミック圧
電基板２とセラミック封止基板４，４の両端面にそれぞ
れ形成されると共に、セラミック圧電基板２の対向電極
１ａ，１ｂに個別に導通している。この端面電極１１
は、セラミックよりもヤング率の低い電極材料の導電接
着剤により形成されている。通常のセラミックのヤング
率は１０11Ｎ／ｍ2 程度であり、これと比較して導電接
着剤のヤング率は、１０2 Ｎ／ｍ2 程度と非常に低い。
この導電接着剤は、圧電基板２と封止基板４，４の両端
面のみ塗布されて、封止基板４，４への不要振動の伝播
を抑える働きをする。このような導電接着剤としては、
活性化タイプのものが使用され、これにより、端面電極
１１の全体を金属メッキ処理することが可能である。The end face electrodes 11 and 11 are formed on both end faces of the ceramic piezoelectric substrate 2 and the ceramic sealing substrates 4 and 4, respectively, and are individually electrically connected to the counter electrodes 1a and 1b of the ceramic piezoelectric substrate 2. .. This end face electrode 11
Is formed of a conductive adhesive of an electrode material having a Young's modulus lower than that of ceramics. The Young's modulus of ordinary ceramics is about 10 11 N / m 2 , and in comparison with this, the Young's modulus of conductive adhesives is very low, about 10 2 N / m 2 .
This conductive adhesive is applied only to both end surfaces of the piezoelectric substrate 2 and the sealing substrates 4 and 4, and serves to suppress propagation of unnecessary vibration to the sealing substrates 4 and 4. As such a conductive adhesive,
An activated type is used, which allows the entire end surface electrode 11 to be metal-plated.
【００１１】また、セラミック封止基板４，４の上下面
に形成される上下電極１２，１２は、ヤング率よりも導
電性を重視して、銀等の半田付け性の良い材料が使用さ
れており、例えばスパッタリングあるいは蒸着により被
着される。The upper and lower electrodes 12 and 12 formed on the upper and lower surfaces of the ceramic sealing substrates 4 and 4 are made of a material having good solderability such as silver, placing importance on conductivity rather than Young's modulus. And is applied, for example, by sputtering or vapor deposition.
【００１２】さらに、上記端面電極１１と上下電極１
２，１２を被覆する金属メッキ層１３は、両電極１１，
１２をそれぞれ保護する電極層になっている。Further, the end face electrode 11 and the upper and lower electrodes 1
The metal plating layer 13 covering the electrodes 2 and 12 is
12 is an electrode layer for protecting each.
【００１３】上記圧電部品を製造するにあたっては、図
３に示すように、セラミック圧電基板２をセラミック封
止基板４，４にて封止した後に、両者２，４の両端面に
エポキシ樹脂を塗布して端面電極１１を形成すると共
に、セラミック封止基板４，４の上下面に銀をスパッタ
あるいは蒸着により被着して端面電極１１に導通した上
下電極１２，１２を形成する。さらに、図４に示すよう
に、端面電極１１及び上下電極１２，１２の外表面全体
に亘って半田付け性に優れた金属をメッキ処理して金属
メッキ層１３を形成した後、リード線やボンディングワ
イヤなどを基板に半田付けする。In manufacturing the above-mentioned piezoelectric component, as shown in FIG. 3, after sealing the ceramic piezoelectric substrate 2 with the ceramic sealing substrates 4 and 4, epoxy resin is applied to both end faces of both. Then, the end face electrode 11 is formed, and silver is deposited on the upper and lower surfaces of the ceramic sealing substrates 4 and 4 by sputtering or vapor deposition to form the upper and lower electrodes 12 and 12 which are electrically connected to the end face electrode 11. Further, as shown in FIG. 4, a metal having an excellent solderability is plated on the entire outer surface of the end face electrode 11 and the upper and lower electrodes 12, 12 to form a metal plating layer 13, and then a lead wire or a bonding wire is formed. Solder wires etc. to the board.
【００１４】上記構成によれば、端面電極１１，１１を
エポキシ樹脂のようにセラミックより低ヤング率の導電
接着剤により形成して、端面電極１１そのものに制振効
果を持たせたから、セラミック圧電基板２の不要振動や
メインの漏れ振動の伝播が端面電極１１，１１の部分で
十分に減衰されてセラミック封止基板４，４には伝わら
ないので、振動エネルギーの閉じ込め効果が向上する。According to the above structure, the end face electrodes 11 and 11 are formed of a conductive adhesive having a Young's modulus lower than that of ceramic such as epoxy resin, and the end face electrode 11 itself has a vibration damping effect. The propagation of the unwanted vibration 2 and the main leakage vibration is sufficiently attenuated in the end face electrodes 11 and 11 and is not transmitted to the ceramic sealing substrates 4 and 4, so that the effect of confining the vibration energy is improved.
【００１５】その結果、セラミック圧電基板２の電気特
性は劣化せず、良品率が向上するので、例えばディスク
リミネータにおいて復調歪率波形に不要振動によるリッ
プルが現れず、復調歪率特性の向上を図ることができ
る。さらにはフィルタの高域側スプリアスの低減や、ト
ラップの映像帯域内Ｇ．Ｄ．Ｔの向上を図ることができ
るなど、不要振動による悪影響を極力抑えることができ
る。As a result, the electrical characteristics of the ceramic piezoelectric substrate 2 are not deteriorated and the non-defective rate is improved. For example, in the discriminator, the ripple due to unnecessary vibration does not appear in the demodulation distortion rate waveform, and the demodulation distortion rate characteristic is improved. Can be planned. Furthermore, the spurious of the high frequency side of the filter is reduced and the G.G. D. As a result, T can be improved, and the adverse effect of unnecessary vibration can be suppressed as much as possible.
【００１６】尚、上記金属メッキ層１３を省略し、図５
に示すように端面電極１１と上下電極１２，１２のみで
外部電極１０’を構成してもよい。It should be noted that the metal plating layer 13 is omitted in FIG.
As shown in FIG. 5, the external electrode 10 ′ may be composed of only the end surface electrode 11 and the upper and lower electrodes 12, 12.
【００１７】[0017]
【発明の効果】以上説明したように、この発明によれ
ば、セラミックよりヤング率の低い導電接着剤を端面電
極材料としたので、セラミック圧電基板をセラミック封
止基板で挟んだエネルギー閉じ込め形圧電共振子の構造
において、圧電体の不要振動やメインの漏れ振動が封止
基板に伝播されず、閉じ込め効果が向上する。その結
果、不要振動等による悪影響を極力小さくして、電気特
性の向上を図ることができる。As described above, according to the present invention, since the conductive adhesive having a Young's modulus lower than that of the ceramic is used as the end face electrode material, the energy trap type piezoelectric resonance in which the ceramic piezoelectric substrate is sandwiched by the ceramic sealing substrates is used. In the child structure, unnecessary vibration of the piezoelectric body and main leakage vibration are not propagated to the sealing substrate, and the confinement effect is improved. As a result, it is possible to minimize the adverse effects of unnecessary vibration and improve the electrical characteristics.
【図１】この発明の一実施例に係るエネルギー閉じ込め
形圧電共振子を示す斜視図。FIG. 1 is a perspective view showing an energy trap type piezoelectric resonator according to an embodiment of the present invention.
【図２】図１のＡ−Ａ線縦断面図。FIG. 2 is a vertical sectional view taken along the line AA of FIG.
【図３】端面電極と上下電極を形成した状態を示す工程
図。FIG. 3 is a process drawing showing a state in which end face electrodes and upper and lower electrodes are formed.
【図４】金属メッキ層を形成した状態を示す工程図。FIG. 4 is a process drawing showing a state in which a metal plating layer is formed.
【図５】この発明の他の実施例を示す縦断面図。FIG. 5 is a vertical sectional view showing another embodiment of the present invention.
１ 圧電共振子 ２ セラミック圧電基板 ４ セラミック封止基板 １０．１０’ 外部電極 １１ 端面電極 １２ 上下電極 １３ 金属メッキ DESCRIPTION OF SYMBOLS 1 Piezoelectric resonator 2 Ceramic piezoelectric substrate 4 Ceramic sealing substrate 10.10 'External electrode 11 End surface electrode 12 Upper and lower electrodes 13 Metal plating
Claims (1)
を設けた圧電共振子をセラミック製封止基板により封止
すると共に、上記対向電極を封止基板の端面電極に導通
させてなる圧電部品において、上記端面電極をセラミッ
クよりもヤング率の低い導電接着剤により形成したこと
を特徴とする圧電部品。1. A piezoelectric component in which a piezoelectric resonator having opposing electrodes provided on both surfaces of a ceramic piezoelectric substrate is encapsulated by a ceramic encapsulating substrate, and the opposing electrode is electrically connected to an end face electrode of the encapsulating substrate. A piezoelectric component, wherein the end face electrode is formed of a conductive adhesive having a Young's modulus lower than that of ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22869791A JPH05102778A (en) | 1991-08-13 | 1991-08-13 | Piezoelectric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22869791A JPH05102778A (en) | 1991-08-13 | 1991-08-13 | Piezoelectric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05102778A true JPH05102778A (en) | 1993-04-23 |
Family
ID=16880385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22869791A Pending JPH05102778A (en) | 1991-08-13 | 1991-08-13 | Piezoelectric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05102778A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012060628A (en) * | 2010-08-07 | 2012-03-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device and manufacturing method for the same |
| US9446989B2 (en) | 2012-12-28 | 2016-09-20 | United Technologies Corporation | Carbon fiber-reinforced article and method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310594A (en) * | 1986-07-01 | 1988-01-18 | 日本電気株式会社 | High heat conductivity multilayer ceramic interconnection board |
| JPS6432371U (en) * | 1987-08-20 | 1989-02-28 | ||
| JPH03175711A (en) * | 1989-12-04 | 1991-07-30 | Murata Mfg Co Ltd | Chip type electronic component |
-
1991
- 1991-08-13 JP JP22869791A patent/JPH05102778A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310594A (en) * | 1986-07-01 | 1988-01-18 | 日本電気株式会社 | High heat conductivity multilayer ceramic interconnection board |
| JPS6432371U (en) * | 1987-08-20 | 1989-02-28 | ||
| JPH03175711A (en) * | 1989-12-04 | 1991-07-30 | Murata Mfg Co Ltd | Chip type electronic component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012060628A (en) * | 2010-08-07 | 2012-03-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric device and manufacturing method for the same |
| US9446989B2 (en) | 2012-12-28 | 2016-09-20 | United Technologies Corporation | Carbon fiber-reinforced article and method therefor |
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