JPH0510363Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a capillary used for wire bonding of semiconductor devices such as LSI and IC.

[Conventional technology]

In semiconductor devices, thin conductive wires made of gold or aluminum with a diameter of about 0.015 to 0.1 mm are used to connect the electrodes of the semiconductor chip and the lead electrodes of the package. As shown in the figure, a capillary C was used, which had a pore H with a diameter of about 0.025 to 0.1 mm through which the conductor was sent out to the tip.

This capillary C has various types with respect to the size of the pore H and the shape of the tip, and each type is used depending on the product to be bonded, the conditions of use, the type and thickness of the wire, etc. In addition, if gold, aluminum, or other stains were attached during use, they were cleaned with aqua regia, fuming nitric acid, etc., and used repeatedly.

Furthermore, although glass and ultra-hard materials were initially used for the material of the capillary C, from the viewpoint of wear resistance, it is now made of alumina polycrystalline ceramic, and ruby made from alumina and single crystal. , saphire, etc. have been widely used.

In addition, materials formed from silicon carbide ceramics, silicon nitride ceramics, and alumina ceramics with a hard film such as TiC or TiN coated on the surface have also been considered.

[Problems with conventional technology]

However, in such a capillary C, the size and tip shape of the pore H are extremely small, and it has been impossible to distinguish the various types of capillary C with the naked eye. Therefore, when multiple types of capillaries C are used, there is a risk that different types of capillaries C may be mixed during handling or cleaning. Different types of capillary C
When wire bonding is performed using, for example, if the pore H is too small, the wire will easily become clogged
On the other hand, if the pores H were too large, the crimping position of the wire would shift, which would easily cause a connection failure. Furthermore, when capillaries C with different tip shapes are used, the bonding conditions set in the bonding equipment are different, which tends to cause wire connection failures, and in either case, there is an inconvenience that the quality of the semiconductor device is degraded. .

[Means for solving problems]

In view of the above, in the present invention, an identification display portion is formed on the rear end face of a capillary for wire bonding, so that differences in pore diameter and tip shape can be identified.

Further, although the identification display portion can be formed by various means, the present invention is particularly characterized by using a glass transfer sticker.

〔Example〕

Hereinafter, first, a comparative example of the present invention will be explained with reference to the drawings.

The capillary 10 shown in FIG. 1A has a tapered surface formed on the edge portion of the rear end surface to serve as an identification display portion 11. In addition, the capillary 2 shown in FIG.
No. 0 has the edge portion of the rear end face cut out at four places to form the identification display portion 21, and the rear end face is made into a square shape. Similarly, the rear end surface may be triangular or pentagonal, and the capillary 10, 20 can be identified by the shape of the rear end surface. Such a shape of the capillary 10, 20 can be easily obtained by machining with a diamond grindstone or the like.

Further, the capillary 30 shown in FIG. 2 has a notch formed in the edge portion of the rear end surface to serve as an identification display portion 31, and can be identified by the number and position of the notch.

These capillaries 10, 20, 30 have identification display parts 11, 21, 31 formed by changing their shapes, and since no other material is used, not only can the cost be reduced, but also the identification display parts 11, 2
There is an advantage that 1 and 31 will not disappear.

However, since the actual capillary is small, it is difficult to identify the capillaries shown in FIGS. 1 and 2, and there are also problems in that it is difficult to process the capillary made of ceramics.

Next, an embodiment of the present invention will be described. The capillary 40 shown in FIG. 3a has a rear end surface colored to form an identification display section 41, and can be identified by color. Further, the capillary 50 shown in FIG. 3b has an annular identification display portion 51 formed on the rear end surface,
They can be identified by color, number, etc. The identification display portions 41, 51 can be easily formed by pasting a glass transfer sticker and baking it at 200 to 300°C. In this way, by printing the glass transfer sticker, the identification display parts 41, 51 of various colors can be created.
Identification is extremely easy. Furthermore, the glass transfer seal has excellent corrosion resistance and will not peel off when the capillary is used or cleaned.

In the embodiments shown above, the identification display portions 11 to
51 is formed on the rear end surface. Generally, when using capillary 10 to 50,
As shown in FIG. 5, the shank portion is held by a holder A, and the rear ends of the capillaries 10 to 50 are made to protrude above the holder A to facilitate the introduction of the wire. Therefore, by forming the identification display parts 11 to 51, the accuracy of the mounting position on the holder A is not deteriorated, and identification can be easily performed even after mounting.

[Effect of idea]

As described above, according to the present invention, by forming the identification display part on the rear end surface of the wire bonding capillary, the capillary can be easily identified, so that different kinds of capillaries can be prevented from getting mixed together during cleaning. As a result, it is possible to always use a capillary with an appropriate pore diameter and tip shape, which reduces wire clogging and connection failures, making it possible to manufacture high-quality semiconductor devices. A capillary for wire bonding can be provided.

[Brief explanation of the drawing]

Figures 1a, b and 2 are perspective views showing comparative examples of the present invention. FIGS. 3a and 3b are perspective views showing the capillary for wire bonding of the present invention. FIG. 4 is a perspective view showing a conventional capillary for wire bonding. FIG. 5 is a side view showing a state in which the wire bonding capillary according to the embodiment of the present invention is attached to a holder. 10, 20, 30, 40, 50... Capillary, 11, 21, 31, 41, 51... Identification display section.

Claims (1)

[Scope of utility model registration request] A capillary for wire bonding, which is made of ceramics and is characterized by having an identification display part with a glass transfer sticker baked on the rear end surface.