JPS6023997Y2 - Heating crimp - Google Patents
Heating crimpInfo
- Publication number
- JPS6023997Y2 JPS6023997Y2 JP17162579U JP17162579U JPS6023997Y2 JP S6023997 Y2 JPS6023997 Y2 JP S6023997Y2 JP 17162579 U JP17162579 U JP 17162579U JP 17162579 U JP17162579 U JP 17162579U JP S6023997 Y2 JPS6023997 Y2 JP S6023997Y2
- Authority
- JP
- Japan
- Prior art keywords
- tip
- solder
- diamond
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 title claims description 5
- 239000010432 diamond Substances 0.000 claims description 17
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000010953 base metal Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
この考案は電子部品のＩＣ又はＬＳＩをプリント基板に
取り付けるボンデングマシンの加熱用圧着子に関するも
のである。[Detailed Description of the Invention] This invention relates to a heating crimp for a bonding machine that attaches an IC or LSI electronic component to a printed circuit board.
従来プリント基板にＩＣ等を取り付けるにはＩＣ等の端
子一本づつをプリント基板にハンダ付けしていた。Conventionally, to attach an IC or the like to a printed circuit board, each terminal of the IC or the like was soldered to the printed circuit board one by one.
本考案は従来より能率よくかつ自動化でプリント基板に
ＩＣをハンダ付する機械の堅牢でハンダの付着しない圧
着子を提供することを目的とするものである。It is an object of the present invention to provide a robust and solder-free crimp for a machine that solders ICs to printed circuit boards more efficiently and automatically than ever before.
図面に示す実施例について本考案を以下詳細に説明する
。The invention will be explained in detail below with reference to the embodiments shown in the drawings.
第１図は本考案の斜視図であり、金属ベース１はストレ
ート部１ａとテーパ一部１ｂが一体となっている。FIG. 1 is a perspective view of the present invention, in which a metal base 1 has a straight portion 1a and a tapered portion 1b integrated.
金属ベースの材料は熱伝導の優れた金属が使用される。The metal-based material used is a metal with excellent thermal conductivity.
先端はＩＣの端子のボンデング部６とほぼ等しい幅にす
る為先細りのテーパー形状となり、先端は１間以下の幅
で長さはＩＣの端子側の長さとほぼ等しい。The tip has a tapered shape to make the width approximately equal to the bonding portion 6 of the IC terminal, and the tip has a width of less than 1 inch and a length approximately equal to the length on the terminal side of the IC.
ベース金属１のストレート部にはヒーター取付穴２を形
成する。A heater mounting hole 2 is formed in the straight part of the base metal 1.
テーパ一部１ｂ先端には第４図、第５図に示すように表
面に非剥離性の金属被膜３を形成したダイヤモンド４を
固定する。As shown in FIGS. 4 and 5, a diamond 4 having a non-peelable metal coating 3 formed on its surface is fixed to the tip of the tapered portion 1b.
固定方法は第４図に示す球状や粒子状のダイヤモンド４
は電着によってベース金属先端に固定する実施例もある
し、又第５図に示すようにダイヤモンドをカットして立
方体としたものは銀ロウ材でベース金属先端に固定する
実施例もある。The fixing method is to use spherical or particulate diamond 4 as shown in Figure 4.
In some embodiments, diamonds are fixed to the tip of the base metal by electrodeposition, and in other embodiments, diamonds cut into cubes as shown in FIG. 5 are fixed to the tip of the base metal with silver solder.
第２図に示す断面図は粒子状又は球状のダイヤモンドを
固定した実施例であり、このダイヤモンド４の表面を含
む圧着子先端のテーパ一部１ｂ表面にハンダ等のロウ材
と親和性のない物質、すなわちハンダが溶融しても付着
しない物質例えばチタンをスパッタリング又は蒸着、イ
オンブレーティングによってコーテング層５を形成する
。The cross-sectional view shown in FIG. 2 is an embodiment in which particle or spherical diamonds are fixed, and the surface of the tapered part 1b of the tip of the crimper, which includes the surface of the diamond 4, is covered with a substance that has no affinity with the brazing material such as solder. That is, the coating layer 5 is formed by sputtering, vapor deposition, or ion blasting using a material that does not adhere even when the solder is melted, such as titanium.
この他にロウ材と親和性のない物質としてステンレスや
テフロン樹脂等が公知である。In addition, stainless steel, Teflon resin, and the like are known as substances that have no affinity with the brazing material.
第３図に示す立方体形体のダイヤモンドの場合も同様に
チタンコーテング層５を形成する。In the case of the cube-shaped diamond shown in FIG. 3, a titanium coating layer 5 is similarly formed.
以上説明したような構造の加熱用圧着子Ａを第６図に示
すようなセラミックのプリント基板Ｂ上にＩＣ，Ｃが並
列され、これを取り付けるのに本考案の加熱用圧着子Ａ
を使って行う。The heating crimp A having the structure explained above is used to attach ICs and ICs in parallel on a ceramic printed circuit board B as shown in FIG.
Do this using
ＩＣ，Ｃの端子６にはあらかじめハンダが付着しており
、このハンダを圧着子により第７図１こ示すように一度
にＩＣ，Ｃの片側の端子図面の実施例に於いては４本の
ハンダを一度溶かしてプリント基板Ｂに固定する。Solder is attached to the terminals 6 of IC and C in advance, and this solder is applied with a crimper to four terminals at once as shown in FIG. Melt the solder once and fix it to printed circuit board B.
ヒーターの熱は、ベース金属１を伝わってダイヤモンド
層を経て非常に薄い数ミクロンのチタンのコーテング層
５よりハンダに伝わる。The heat from the heater is transmitted through the base metal 1, through the diamond layer, and then through the extremely thin titanium coating layer 5 of several microns to the solder.
チタンはハンダと親和性がないのでハンダはチタンに付
着しない。Titanium has no affinity with solder, so solder will not adhere to titanium.
従ってハンダは溶融してすべてＩＣの端子とプリント基
板との接合に作用することができ完全に接合し、接合不
良は皆無になる。Therefore, all the solder melts and acts on the bonding between the IC terminal and the printed circuit board, resulting in complete bonding and no bonding defects.
ダイヤモンドはハンダが溶ける程度の温度に於いては熱
によって変形することなく又熱伝導も非常に優れている
物質である。Diamond is a material that does not deform due to heat at temperatures that are high enough to melt solder, and has excellent thermal conductivity.
従ってピータ−からの伝導熱を容易にＩＣの端子に加え
、かつ圧着子先端は幅が狭く、加熱時に変形しやすかっ
たが、ダイヤモンド層が形威されたので形状は常に一定
形状に保持される。Therefore, conduction heat from the crimper can be easily applied to the IC terminal, and the tip of the crimper is narrow and easily deforms when heated, but since the diamond layer is shaped, the shape is always maintained in a constant shape. .
本考案は以上説明したように圧着子のベース先端にダイ
ヤモンド層を形威し、そのダイヤモンド層の表面にチタ
ンをコーテングしたので従来より能率よハンダ付けする
ことが可能で、自動化することが可能になる堅牢な加熱
用圧着子を提供できる効果がある。As explained above, in this invention, a diamond layer is formed on the base tip of the crimper, and the surface of the diamond layer is coated with titanium, making it possible to solder more efficiently than conventional methods, and it can be automated. This has the effect of providing a robust heating crimp.
第１図は本考案の斜視図である。
第２図は第１図Ｘ−Ｘ線の縦断面図である。
第３図は他の実施例の縦断面図である。
第４図はダイヤモンド粒の断面図である。
第５図はダイヤモンドブロックの一部を断面した斜視図
である。
第６図はプリント基板の平面図である。
第７図はプリント基板に圧着子を作用させた時の側面図
である。FIG. 1 is a perspective view of the present invention. FIG. 2 is a longitudinal sectional view taken along line XX in FIG. 1. FIG. 3 is a longitudinal sectional view of another embodiment. FIG. 4 is a cross-sectional view of a diamond grain. FIG. 5 is a partially sectional perspective view of the diamond block. FIG. 6 is a plan view of the printed circuit board. FIG. 7 is a side view when the crimping element is applied to the printed circuit board.
Claims (1)
た微小ダイヤモンドを複数固定しダイヤモンド層を形成
し、このダイヤモンド層をも含む圧着手先端表面にロウ
材と親和性のない物質によってコーテング層を形成した
ことを特徴とする加熱圧着子。A diamond layer is formed by fixing multiple micro diamonds with a non-peelable metal coating on the tip of the metal base of the crimping tip, and a coating layer is formed on the tip of the crimping tip, which also includes the diamond layer, with a substance that has no affinity with the brazing material. A heating crimper characterized by forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162579U JPS6023997Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162579U JPS6023997Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5691674U JPS5691674U (en) | 1981-07-21 |
| JPS6023997Y2 true JPS6023997Y2 (en) | 1985-07-17 |
Family
ID=29682452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17162579U Expired JPS6023997Y2 (en) | 1979-12-13 | 1979-12-13 | Heating crimp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023997Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254585A (en) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | Current flowing heating electrode and method of producing same |
| JP2677642B2 (en) * | 1988-12-15 | 1997-11-17 | 株式会社東芝 | Heating head and electronic component mounting method |
-
1979
- 1979-12-13 JP JP17162579U patent/JPS6023997Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5691674U (en) | 1981-07-21 |
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