JPH05104258A - Manufacture of platy diffusion joined member - Google Patents
Manufacture of platy diffusion joined memberInfo
- Publication number
- JPH05104258A JPH05104258A JP26225591A JP26225591A JPH05104258A JP H05104258 A JPH05104258 A JP H05104258A JP 26225591 A JP26225591 A JP 26225591A JP 26225591 A JP26225591 A JP 26225591A JP H05104258 A JPH05104258 A JP H05104258A
- Authority
- JP
- Japan
- Prior art keywords
- capsule
- treated
- diffusion
- joining
- metal foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 241000276425 Xiphophorus maculatus Species 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 83
- 239000002775 capsule Substances 0.000 claims abstract description 47
- 239000011888 foil Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 32
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052582 BN Inorganic materials 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000008119 colloidal silica Substances 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000001513 hot isostatic pressing Methods 0.000 claims description 21
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000009849 vacuum degassing Methods 0.000 claims description 5
- 238000005304 joining Methods 0.000 abstract description 20
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000006082 mold release agent Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 10
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱間等方加圧(HI
P)処理による拡散接合によって、板状拡散接合部材を
製造する方法に関する。BACKGROUND OF THE INVENTION The present invention relates to hot isostatic pressing (HI).
P) The present invention relates to a method for producing a plate-shaped diffusion bonding member by diffusion bonding by treatment.
【0002】[0002]
【従来の技術】近年、機械部品等のように複数の部材を
面接合する場合、熱間等方加圧(HIP)法による拡散
接合が行われている。HIP法とは、加熱昇温と共に圧
力媒体としてガスを用いて四方八方から均一な圧力を加
える方法である。この方法は、HIP装置の利用により
一度に多数の部材を処理できるなど工業的生産性に優れ
ている。そして、HIPによる拡散接合は、立体的な面
の接合が可能で、接合面積の大きさに拘らず均一に接合
できる等の利点がある。その反面、接合面に圧力媒体た
るガスが侵入すると、接合しようとする部材(以下、被
処理材という)に高圧が作用しにくいばかりか、接合面
を汚染すると、うまく接合できなくなるという問題があ
る。2. Description of the Related Art In recent years, when a plurality of members such as mechanical parts are surface-bonded, diffusion bonding by a hot isostatic pressing (HIP) method is performed. The HIP method is a method in which a uniform pressure is applied from all sides using a gas as a pressure medium while heating and raising the temperature. This method is excellent in industrial productivity such that a large number of members can be processed at once by using the HIP device. The diffusion bonding by HIP has an advantage that three-dimensional surfaces can be bonded and the bonding can be performed uniformly regardless of the size of the bonding area. On the other hand, when gas as a pressure medium enters the joint surface, not only high pressure is unlikely to act on the member to be joined (hereinafter referred to as the material to be treated), but if the joint surface is contaminated, there is a problem that the joint cannot be successfully joined ..
【0003】このため、HIPによる拡散接合では、接
合しようとする面にガスが侵入しないようにすることが
必要であり、図6に示すような被処理材全体を金属製の
カプセルの中に真空封入してHIP処理する方法、図7
に示すような接合面の全周を予め溶接によりシールした
後HIP処理する方法等が用いられている。Therefore, in diffusion bonding by HIP, it is necessary to prevent gas from entering the surfaces to be bonded, and the entire material to be treated as shown in FIG. 6 is vacuum-encapsulated in a metal capsule. Encapsulation and HIP treatment method, FIG. 7
A method of HIPing after sealing the entire circumference of the joint surface by welding in advance as shown in FIG.
【0004】ここで、図6の方法は、被処理材1,1を
中子2,2で挟持固定し(図中(a)に相当)、この周
囲にカプセル3、さらに脱気用パイプ4を形成し(図中
(b),(c)に相当)、該脱気用パイプ4からカプセ
ル3内部の空気を脱気(図中(d)に相当)した後、脱
気用パイプ4を切断溶接してカプセル3内部を真空状態
とし(図中(e)に相当)、これをHIP処理(図中
(f)に相当)している。また、図7において、被処理
材は5,5で示され、その接合部の周囲の溶接部は6で
示されている。図7(a)の状態にある被処理材をHI
P処理すると、拡散接合部材7(図中(b)に相当)が
得られる。Here, in the method of FIG. 6, the material to be treated 1, 1 is sandwiched and fixed by the cores 2 and 2 (corresponding to (a) in the figure), and the capsule 3 and the deaeration pipe 4 are provided around the material. Is formed (corresponding to (b) and (c) in the figure), the air inside the capsule 3 is degassed from the degassing pipe 4 (corresponding to (d) in the figure), and then the degassing pipe 4 is The inside of the capsule 3 is vacuum welded by cutting and welding (corresponding to (e) in the figure), and this is subjected to HIP processing (corresponding to (f) in the figure). Further, in FIG. 7, the materials to be treated are indicated by 5 and 5, and the welded portion around the joint is indicated by 6. The processed material in the state of FIG.
When the P treatment is performed, the diffusion bonding member 7 (corresponding to (b) in the figure) is obtained.
【0005】[0005]
【発明が解決しようとする課題】しかし、図6に示す方
法では、中子2により被処理材1が拘束を受けるため
に、HIP処理(図6中(f))において加圧状態が一
様にならず、得られる接合部材がいびつに変形している
ことがある。この際、中子2の形状を選択することによ
り均一に加圧することは可能であるが、種々の中子を準
備する必要があり、実用的でない。また、接合後におい
ても中子2,2及びカプセル3の除去作業が非常に困難
である。However, in the method shown in FIG. 6, since the material to be processed 1 is restrained by the core 2, the pressurizing state is uniform in the HIP processing ((f) in FIG. 6). However, the obtained joining member may be distorted. At this time, it is possible to pressurize uniformly by selecting the shape of the core 2, but it is not practical because it is necessary to prepare various cores. Further, even after the joining, it is very difficult to remove the cores 2 and 2 and the capsule 3.
【0006】カプセルの除去作業を容易にするために、
カプセルの内面と被処理材との間に、離型材や緩衝材を
介在させることが考えられる。離型材又は緩衝材とし
て、一般に、セラミック繊維(シリカ質、ムライト質、
アルミナ質など)からなるフェルトやペーパーが用いら
れるが、1100℃以上の高温で処理すると、繊維自体
が焼結して、カプセルあるいは被処理材に接合されてし
まう。一方、窒化ホウ素粉末も離型材として用いられ、
これは高温で使用しても離型性に優れているが、対象物
に対しても付着しにくいという欠点がある。また、図8
に示す方法では、接合後、被処理材の溶接部6を切断除
去しなればならず、かかる操作は面倒である。In order to facilitate the work of removing the capsule,
It is conceivable to interpose a release material or a cushioning material between the inner surface of the capsule and the material to be treated. Ceramic fibers (silica, mullite,
Felt or paper made of alumina or the like is used, but when treated at a high temperature of 1100 ° C. or higher, the fibers themselves sinter and are bonded to the capsule or the material to be treated. On the other hand, boron nitride powder is also used as a release material,
Although it has excellent releasability even when used at high temperatures, it has a drawback that it does not easily adhere to an object. Also, FIG.
In the method shown in (1), the welded portion 6 of the material to be treated must be cut and removed after the joining, which is troublesome.
【0007】本発明は、このような事情に鑑みてなされ
たものであり、その目的とするところは、従来製造が困
難であった板状の拡散接合部材を製造し、しかも接合後
のカプセル除去が容易な板状拡散接合部材の製造方法を
提供することにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to manufacture a plate-shaped diffusion bonding member, which has been difficult to manufacture in the past, and to remove the capsule after bonding. An object of the present invention is to provide a method for manufacturing a plate-shaped diffusion bonding member that is easy to manufacture.
【0008】[0008]
【課題を解決するための手段】本発明の板状拡散接合部
材の製造方法は、窒化ホウ素にコロイダルシリカ又はア
ルミナゾルを混合した離型材を塗布した2枚の金属箔で
被処理材を挟持し、前記金属箔の縁部をシールして形成
されるカプセルの内部を真空脱気することにより、前記
被処理材を前記カプセル内に密封し、次いで、カプセル
全体を熱間等方加圧処理して、前記被処理材を拡散接合
した後、前記カプセルを除去する。A method for manufacturing a plate-shaped diffusion bonding member of the present invention is to sandwich a material to be treated with two metal foils coated with a release material in which boron nitride is mixed with colloidal silica or alumina sol, By vacuum degassing the inside of the capsule formed by sealing the edge of the metal foil, the material to be treated is sealed in the capsule, and then the entire capsule is subjected to hot isostatic pressing. After the materials to be treated are diffusion-bonded, the capsules are removed.
【0009】[0009]
【実施例】以下、本発明の実施例を、図面に基づいて説
明する。図1は、本発明一実施例として、2枚のステン
レス製の窓枠部材にステンレス製の網を挟持接合した拡
散接合部材、例えばフィルターの製造方法を示す工程図
である。図1(a)は被処理材10を示し、2枚の窓枠
部材11,11と金網12とからなる。図1(b)は被
処理材10を挟持してカプセルを形成するための2枚の
金属箔13,13を示しており、各金属箔13の被処理
材10を挟持する面には離型材が塗布されている。14
は離型材の塗膜である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a process diagram showing a method of manufacturing a diffusion bonding member, for example, a filter, in which a stainless steel net is sandwiched and bonded to two stainless window frame members as one embodiment of the present invention. FIG. 1A shows a material to be processed 10, which is composed of two window frame members 11 and 11 and a wire net 12. FIG. 1B shows two metal foils 13 and 13 for sandwiching the material 10 to be processed to form a capsule, and a release material is provided on the surface of each metal foil 13 that sandwiches the material 10 to be processed. Has been applied. 14
Is a coating film of the release material.
【0010】本実施例に示す方法は、2枚の金属箔1
3,13の離型材塗膜14と被処理材10の窓枠部材1
1,11とが接触するようにして被処理材10を挟持
し、金属箔13の夫々端部を一部だけ残して、金属箔1
3,13の縁部を溶接して、カプセル15を形成する
(図1(c))。金属箔13の端部で溶接しなかった部
分、いわゆる開口部分17からカプセル15内部を真空
脱気した後、この開口部分17を溶接して、カプセル1
5を密封する(図1(d))。次に、このカプセル15
をHIP装置にセットし、高温下で高圧ガスで加圧し
て、被処理材10を拡散接合する(図1(e))。接合
後、カプセル15の縁部を切り取り、カプセル15の金
属箔13,13を剥がして(図1(f))、拡散接合さ
れた被処理材10’を取り出す。得られた接合部材1
0’は図1(g)に示されている。In the method shown in this embodiment, two metal foils 1 are used.
Molding material coating film 14 of 3 and 13 and window frame member 1 of material 10 to be processed
The material to be treated 10 is sandwiched so that the metal foil 1 and the metal foil 13 are in contact with each other, leaving only a part of each end of the metal foil 13.
The edges of 3 and 13 are welded to form a capsule 15 (FIG. 1 (c)). After vacuum degassing the inside of the capsule 15 from a portion which is not welded at the end of the metal foil 13, a so-called opening portion 17, the opening portion 17 is welded to form the capsule 1
5 is sealed (FIG. 1 (d)). Next, this capsule 15
Is set in a HIP device and pressurized with a high pressure gas at high temperature to diffusion-bond the material 10 to be processed (FIG. 1 (e)). After joining, the edges of the capsule 15 are cut off, the metal foils 13 and 13 of the capsule 15 are peeled off (FIG. 1 (f)), and the diffusion-bonded workpiece 10 'is taken out. Obtained joining member 1
0'is shown in FIG. 1 (g).
【0011】上記方法において、金属箔13の材質は、
被処理材の種類、接合温度、入手の容易性等により適宜
選択される。例えば、ステンレス、アルミニウム、銅、
タンタル等が用いられる。これらのうち、ステンレスが
保存性に優れていることから特に好ましく用いられる。In the above method, the material of the metal foil 13 is
It is appropriately selected depending on the type of the material to be treated, the joining temperature, the availability, and the like. For example, stainless steel, aluminum, copper,
Tantalum or the like is used. Among these, stainless steel is particularly preferably used because it has excellent storage stability.
【0012】金属箔13の厚みは、被処理材の大きさ、
箔の材質等により異なるが、一般に、30〜300μm
程度が好ましい。例えばステンレス製の箔の場合、1m
m角程度の被処理材の接合には、50〜100μmの箔
が好ましく用いられる。また、金属箔13の厚みは、2
枚共同じであってもよいし、異なる厚みのものを用いて
もよい。特に、被処理材10が非常に薄くて歪み易い場
合には、2枚の金属箔13,13のうち、1枚を厚くし
てもよい。The thickness of the metal foil 13 depends on the size of the material to be treated,
Generally 30 to 300 μm, depending on the material of the foil, etc.
A degree is preferable. For example, for stainless steel foil, 1m
A foil having a thickness of 50 to 100 μm is preferably used for joining the materials to be processed having an angle of about m square. The thickness of the metal foil 13 is 2
The sheets may be the same or may have different thicknesses. In particular, if the material 10 to be processed is very thin and easily distorted, one of the two metal foils 13 may be thickened.
【0013】このような金属箔13の被処理材挟持面に
は、離型材が塗布されている。本発明に用いられる離型
材は、窒化ホウ素(BN)にコロイダルシリカ又はアル
ミナゾルを混合したものであり、適宜界面活性剤等の添
加剤が添加され得る。コロイダルシリカ又はアルミナゾ
ルとは、各々水中にナノメータオーダのシリカ(SiO
2 )又はアルミナ(Al2 O3 )を分散したもので、接
着剤のような特性を有している。一般に、水又は有機溶
剤中にセラミック粉末を単独で分散させても接着性は得
られない。また、セラミック粉末と有機系バインダーを
混合しても、HIP処理により有機系バインダーが熱分
解して接着力が低下する上にカーボンが残留するという
問題がある。しかし、本発明に用いられるコロイダルシ
リカ又はアルミナゾルは、高温に加熱されても水分が残
存する割合が高く、接着力を高温まで保持できる上に、
加熱後残存するのは高純度のシリカ又はアルミナだけで
ある。これらの化合物はカーボンに比べて窒化ホウ素や
被処理材と反応しにくいので、被処理材の表面を汚染せ
ずに済み、しかもシリカ粒子又はアルミナ粒子は微細で
あるから、離型材塗膜が滑らかで、高圧に加圧しても被
処理材の表面を荒らさないという利点がある。特に、離
型材におけるシリカ粒子又はアルミナ粒子と窒化ホウ素
との混合比(重量比)が、BN/SiO2 又はBN/A
l2 O3 として1/2〜1/1の場合には、離型材塗膜
が非常に滑らかになり、光沢のあるような塗膜面とする
こともできる。SiO2 又はAl2 O3 は、コロイダル
シリカ又はアルミナゾルとなって離型材の流れ性を良好
にし、平滑な離型材塗膜が得られやすくなるためであ
る。A release material is applied to the surface of the metal foil 13 between which the material to be treated is sandwiched. The release material used in the present invention is a mixture of boron nitride (BN) and colloidal silica or alumina sol, and an additive such as a surfactant may be added as appropriate. Colloidal silica or alumina sol means nanometer-order silica (SiO 2) in water.
2 ) or alumina (Al 2 O 3 ) dispersed, and has properties like an adhesive. Generally, even if the ceramic powder is dispersed alone in water or an organic solvent, adhesiveness cannot be obtained. Further, even if the ceramic powder and the organic binder are mixed, there is a problem that the organic binder is thermally decomposed by the HIP treatment to reduce the adhesive force and carbon remains. However, the colloidal silica or alumina sol used in the present invention has a high percentage of water remaining even when heated to a high temperature, and in addition to being capable of holding the adhesive force up to a high temperature,
Only high-purity silica or alumina remains after heating. Compared to carbon, these compounds are less likely to react with boron nitride and the material to be treated, so the surface of the material to be treated is not contaminated, and since the silica particles or alumina particles are fine, the release agent coating film is smooth. Therefore, there is an advantage that the surface of the material to be processed is not roughened even when a high pressure is applied. In particular, the mixing ratio (weight ratio) of silica particles or alumina particles and boron nitride in the mold release material is BN / SiO 2 or BN / A.
When l 2 O 3 is ½ to 1/1, the release agent coating film becomes very smooth, and the coating film surface may be glossy. This is because SiO 2 or Al 2 O 3 becomes colloidal silica or alumina sol to improve the flowability of the release agent, and it becomes easy to obtain a smooth release agent coating film.
【0014】上記離型材において、窒化ホウ素とコロイ
ダルシリカ又はアルミナゾルとの混合比(重量比)が、
窒化ホウ素をBN、コロイダルシリカ中のシリカ成分を
SiO2 、アルミナゾル中のアルミナ成分をAl2 O3
として、BN/SiO2 =1/2〜3/2又はBN/A
l2 O3 =1/2〜3/2であることか好ましい。BN
の含有量が、BN/SiO2 又はBN/Al2 O3 とし
て1/2を下回る場合には、離型材におけるアルミナ成
分又はシリカ成分の含有量が相対的に大きくなるため、
離型材自体がHIP処理により強固に焼結されて被処理
材に固着されてしまい、離型材として機能しなくなる。
このことはHIP処理温度が1000℃以上で特に顕著
である。一方、BN/SiO2 又はBN/Al2 O3 の
値が3/2を越えると、離型材におけるアルミナ成分又
はシリカ成分の含有量が相対的に少なくなるため、金属
箔に対する接着性が不十分となり、離型材塗布面が剥が
れやすくなる。In the above mold release material, the mixing ratio (weight ratio) of boron nitride and colloidal silica or alumina sol is
Boron nitride is BN, silica component in colloidal silica is SiO 2 , and alumina component in alumina sol is Al 2 O 3.
As BN / SiO 2 = 1/2 to 3/2 or BN / A
It is preferable that l 2 O 3 = 1/2 to 3/2. BN
When the content of BN / SiO 2 or BN / Al 2 O 3 is less than 1/2, the content of the alumina component or the silica component in the release material becomes relatively large,
The mold release material itself is strongly sintered by the HIP process and is fixed to the material to be treated, so that it does not function as a mold release material.
This is particularly remarkable when the HIP processing temperature is 1000 ° C. or higher. On the other hand, when the value of BN / SiO 2 or BN / Al 2 O 3 exceeds 3/2, the content of the alumina component or the silica component in the release material becomes relatively small, resulting in insufficient adhesion to the metal foil. Therefore, the release agent coated surface is easily peeled off.
【0015】このような離型材の塗布に際しては、金属
箔に離型材が付着しやすいように、金属箔の塗布面を予
めサンドペーパなどで粗面にしておくことが好ましい。
また、離型材は被処理材が接触する部分に塗布し、カプ
セルを密封するために溶接等を行う部分には塗布しない
ことが好ましい。よって、溶接を行う部分には予めマス
キングテープ等を貼った状態で離型材を塗布することが
好ましい。離型材塗布面には水分等が含まれているの
で、さらに離型材塗布面を乾燥し、300℃程度にまで
加熱することが好ましい。離型材の塗膜の厚みを0.1
mm以上にしたい場合には、塗布及び乾燥を繰り返せば
よい。In applying such a release material, it is preferable that the application surface of the metal foil is roughened beforehand with sandpaper or the like so that the release material is easily attached to the metal foil.
Further, it is preferable that the mold release material is applied to a portion in contact with the material to be treated and not applied to a portion to be welded to seal the capsule. Therefore, it is preferable to apply the release material to the portion to be welded with the masking tape or the like attached in advance. Since the release agent coating surface contains water and the like, it is preferable to further dry the release agent coating surface and heat it to about 300 ° C. The thickness of the coating film of the release material is 0.1
When it is desired to have a thickness of not less than mm, coating and drying may be repeated.
【0016】カプセルの形成に際して金属箔の縁部をシ
ールする方法としては、特に限定されず、例えば、YA
Gレーザ、エレクトロンビーム、シーム、TIGなど従
来公知の溶接方法によりシールすることができる。The method of sealing the edge of the metal foil in forming the capsule is not particularly limited, and may be, for example, YA.
It can be sealed by a conventionally known welding method such as G laser, electron beam, seam, and TIG.
【0017】本実施例では、真空脱気のための開口部分
17を残して箔13の縁部をシールし、真空脱気した
後、開口部分17を溶接して密封状態のカプセルを形成
したが、本発明はこの方法に限らない。例えば、密封状
態のカプセルを形成した後、真空脱気し、再び密封する
など、カプセルの密封及び真空脱気の順序は適宜に選択
できる。In this embodiment, the edge portion of the foil 13 is sealed while leaving the opening portion 17 for vacuum deaeration, and after vacuum deaeration, the opening portion 17 is welded to form a sealed capsule. However, the present invention is not limited to this method. For example, after forming a sealed capsule, vacuum degassing and then resealing can be performed, and the order of sealing the capsule and vacuum degassing can be appropriately selected.
【0018】HIP処理における温度・圧力の操作パタ
ーンは特に限定しないが、10kgf/cm2 以上のガ
ス圧力を付与した後、昇温する昇圧先行形の操作が好ま
しい。昇圧先行形の操作によれば、被処理材や離型材に
気化成分が含まれていても、気化成分によるカプセル内
部での圧力発生、ひいては箔の膨張や破損を防止でき
る。The operation pattern of temperature and pressure in the HIP process is not particularly limited, but a pressure-increasing precedent type operation of raising the temperature after applying a gas pressure of 10 kgf / cm 2 or more is preferable. According to the pressure-increasing operation, even if the material to be treated or the mold release material contains a vaporized component, it is possible to prevent pressure generation inside the capsule due to the vaporized component, and thus expansion and breakage of the foil.
【0019】HIP処理後、被処理材を取り出す方法と
しては、鋏で金属箔の一縁部を切断して箔を剥がすなど
適当な方法で取り出すことができる。As a method for taking out the material to be treated after the HIP treatment, it is possible to take out by a suitable method such as cutting one edge of the metal foil with scissors and peeling the foil.
【0020】なお、本発明の製造方法を用いて、被処理
材である同種の金属の拡散接合だけでなく、2種類以上
の金属シートを多層に重ねた接合部材を製造することも
できる。図2は2種類の金属シート20,21を交互に
重ね合わせて接合したものである。図2に示す構成にお
いて、金属シート同士の接合に限らず、金属シートとセ
ラミックシートとの接合も可能である。金属シートとセ
ラミックシートとの接合の場合、両者の熱膨張率の違い
が接合を阻害するので、これを緩和するために、インサ
ート材を介在して行ってもよい。バイメタル等はこの方
法により容易に製造できる。The manufacturing method of the present invention can be used to manufacture not only diffusion bonding of the same kind of metal as the material to be treated but also a bonding member in which two or more kinds of metal sheets are laminated in multiple layers. In FIG. 2, two types of metal sheets 20 and 21 are alternately stacked and joined. In the configuration shown in FIG. 2, not only the joining of metal sheets but also the joining of metal sheets and ceramic sheets is possible. In the case of joining the metal sheet and the ceramic sheet, the difference in the coefficient of thermal expansion between the two inhibits the joining. Therefore, an insert material may be interposed to alleviate this. Bimetal and the like can be easily manufactured by this method.
【0021】また、本発明の製造方法により、図3に示
すように、刃先形成材22のような高硬度で脆いセラミ
ック系の材料をスチール23,24,25で挟み込んで
接合したブレードを製造することもできる。Further, according to the manufacturing method of the present invention, as shown in FIG. 3, a blade in which a high hardness and brittle ceramic material such as the cutting edge forming material 22 is sandwiched between steels 23, 24 and 25 and bonded is manufactured. You can also
【0022】さらに、図4に示すような、2つのリング
状部材26,27が約0.1mm程度の薄い金属板28
で結合されたような機械部品も製造できる。図4におい
て、接合面は破線29で示されている。図4において、
金属板28の代わりに金網を用いることもできる。Further, as shown in FIG. 4, the two ring-shaped members 26 and 27 are thin metal plates 28 having a thickness of about 0.1 mm.
Machine parts such as those joined together can also be manufactured. In FIG. 4, the joint surface is indicated by a broken line 29. In FIG.
A wire mesh may be used instead of the metal plate 28.
【0023】さらにまた、図5は、2枚のSUS304
製の網30,31の間にタワシ状に成形した金属繊維3
2を挟み込んだフィルターである。かかる構成において
通気性を保持するするために、HIP処理条件は100
0℃で100〜1000kgf/cm2 程度が好まし
い。Furthermore, FIG. 5 shows two sheets of SUS304.
Metal fiber 3 shaped like a scissors between the nets 30 and 31 made of steel
It is a filter that sandwiches 2. In order to maintain air permeability in such a configuration, the HIP treatment condition is 100.
It is preferably 100 to 1000 kgf / cm 2 at 0 ° C.
【0024】〔具体的実施例〕 実施例1;被処理材としてSUS304製の窓枠部材及
び金網を用い、離型材として重量比がBN/Al2 O3
=3/2である窒化ホウ素とアルミナゾルとの混合物を
用いて、下記の接合条件にて、図1に示す方法に基づい
て接合した。 金属箔 SUS304製 温度 1100℃ 圧力 1000kgf/cm2 時間 1時間 得られた拡散接合部材の接合状態は良好であり、カプセ
ルの除去も容易であった。[Specific Example] Example 1; A window frame member made of SUS304 and a wire mesh were used as a material to be treated, and a weight ratio of BN / Al 2 O 3 was used as a release material.
= 3/2 mixture of boron nitride and alumina sol was used, and bonding was performed based on the method shown in FIG. 1 under the following bonding conditions. Metal foil made of SUS304 Temperature 1100 ° C. Pressure 1000 kgf / cm 2 hours 1 hour The bonding state of the obtained diffusion bonding member was good and the capsules were easily removed.
【0025】実施例2;被処理材としてSUS304製
のシート(厚さ0.1mm)と銅製のシート(厚さ0.
1mm)とを用い、20枚のシートを積層接合した図2
に示すような拡散接合部材を製造した。BN/SiO2
=1/1の離型材を用い、接合温度を850℃に変更し
た以外は実施例1と同様に行った。得られた拡散接合部
材の接合状態は良好であり、カプセルの除去も容易であ
った。Example 2 As a material to be treated, a SUS304 sheet (thickness 0.1 mm) and a copper sheet (thickness 0.
1 mm) and 20 sheets were laminated and joined together.
A diffusion bonding member as shown in was produced. BN / SiO 2
The same procedure as in Example 1 was performed, except that the release agent of 1/1 was used and the joining temperature was changed to 850 ° C. The obtained diffusion-bonded member had a good bonding state, and the capsules were easily removed.
【0026】実施例3;被処理材としてSUS304の
板材とY−PSZ(イットリウム部分安定化ジルコニ
ア)の刃先形成材とを用いて、図3に示すブレードを製
造した。接合温度を1300℃に変更した以外は実施例
1と同様に行った。得られた拡散接合部材の接合状態は
良好であり、カプセルの除去も容易であった。Example 3 A blade shown in FIG. 3 was manufactured by using a plate material of SUS304 and a cutting edge forming material of Y-PSZ (yttrium partially stabilized zirconia) as a material to be treated. The same procedure as in Example 1 was performed except that the joining temperature was changed to 1300 ° C. The obtained diffusion-bonded member had a good bonding state, and the capsules were easily removed.
【0027】実施例4;被処理材としてSUS304製
のリング部材及び板材を用いて、図4に示す拡散接合部
材を製造した。BN/Al2 O3=1/2の離型材を用
い、接合圧力を100kgf/cm2 に変更した以外は
実施例1と同様に行った。得られた拡散接合部材の接合
状態は良好であり、カプセルの除去も容易であった。Example 4 A diffusion bonding member shown in FIG. 4 was manufactured by using a ring member and a plate member made of SUS304 as a material to be treated. The same procedure as in Example 1 was carried out except that a mold release material of BN / Al 2 O 3 = 1/2 was used and the joining pressure was changed to 100 kgf / cm 2 . The obtained diffusion-bonded member had a good bonding state, and the capsules were easily removed.
【0028】実施例5;被処理材としてSUS304製
の金網及びスポンジを用いて、図5に示すフィルターを
製造した。BN/SiO2 =1/2の離型材を用い、接
合温度を1000℃、圧力を100kgf/cm2 に変
更した以外は実施例1と同様に行った。得られた拡散接
合部材の接合状態は良好であり、カプセルの除去も容易
であった。Example 5: A filter shown in FIG. 5 was manufactured using a wire mesh and a sponge made of SUS304 as the material to be treated. The same procedure as in Example 1 was carried out except that a mold releasing material of BN / SiO 2 = 1/2 was used, the joining temperature was changed to 1000 ° C., and the pressure was changed to 100 kgf / cm 2 . The obtained diffusion-bonded member had a good bonding state, and the capsules were easily removed.
【0029】比較例1;離型材としてセラミックフェル
トを使用した以外は実施例1と同様にして拡散接合部材
を製造した。接合後にカプセルから拡散接合部材を取り
出そうとしたところ、接合部材にセラミックフェルトが
固着して、箔の除去が困難であった。Comparative Example 1 A diffusion bonding member was manufactured in the same manner as in Example 1 except that ceramic felt was used as a release material. When the diffusion bonding member was taken out from the capsule after bonding, the ceramic felt was fixed to the bonding member, and it was difficult to remove the foil.
【0030】比較例2;離型材における混合比をBN/
Al2 O3 =1/3に変更した以外は実施例1と同様に
して拡散接合部材を製造した。離型材自体が焼結して金
網に離型材に固着していた。Comparative Example 2; Mixing ratio of the release agent is BN /
A diffusion bonding member was manufactured in the same manner as in Example 1 except that Al 2 O 3 was changed to 1/3. The release material itself was sintered and adhered to the release wire on the wire mesh.
【0031】比較例3;BN/Al2 O3 =2/1であ
る離型材を金属箔に塗布し、乾燥後、カプセル形成のた
めに箔の縁部を溶接しようとしたところ、離型材が箔か
ら剥がれてしまった。実施例1〜5及び比較例1〜3に
おける接合条件及び結果を、まとめて表1に示す。Comparative Example 3 A mold release material of BN / Al 2 O 3 = 2/1 was applied to a metal foil, and after drying, an attempt was made to weld the edges of the foil to form capsules. It has come off from the foil. Table 1 collectively shows the joining conditions and results in Examples 1 to 5 and Comparative Examples 1 to 3.
【0032】[0032]
【表1】 [Table 1]
【0033】[0033]
【発明の効果】以上のように、本発明の製造方法によれ
ば、従来困難であった複雑な部品であっても面接合でき
るので、特に気密性を必要とする真空機器の部品あるい
はフィルター等の製造に優れている。しかも、本発明の
製造方法はHIP法により拡散接合するので、HIP装
置の利用により拡散接合部材の生産性に優れている。ま
た、離型材として、窒化ホウ素とコロイダルシリカ又は
アルミナゾルとの混合割合がBN/Al2 O3 又はBN
/SiO2 として1/2〜3/2である離型材を用いれ
ば、箔への塗布作業が簡単であり、しかも接合後のカプ
セルの除去も容易である。As described above, according to the manufacturing method of the present invention, even complex parts, which have been difficult in the past, can be surface-bonded. Therefore, parts of vacuum equipment or filters, etc., which require airtightness, in particular. Is excellent in manufacturing. Moreover, since the manufacturing method of the present invention is diffusion bonded by the HIP method, the productivity of the diffusion bonding member is excellent by using the HIP device. Further, as a release material, the mixing ratio of boron nitride and colloidal silica or alumina sol is BN / Al 2 O 3 or BN.
If a release material having a ratio of / SiO 2 of 1/2 to 3/2 is used, the work of applying it to the foil is simple, and the capsules can be easily removed after joining.
【図1】本発明一実施例の拡散接合部材の製造方法の工
程を示す図である。FIG. 1 is a diagram showing steps of a method for manufacturing a diffusion bonding member according to an embodiment of the present invention.
【図2】本発明の製造方法により製造される拡散接合部
材の一実施例である。FIG. 2 is an example of a diffusion bonding member manufactured by the manufacturing method of the present invention.
【図3】本発明の製造方法により製造される拡散接合部
材の他の実施例である。FIG. 3 is another embodiment of the diffusion bonding member manufactured by the manufacturing method of the present invention.
【図4】本発明の製造方法により製造される拡散接合部
材の他の実施例である。FIG. 4 is another embodiment of the diffusion bonding member manufactured by the manufacturing method of the present invention.
【図5】本発明の製造方法により製造される拡散接合部
材の他の実施例である。FIG. 5 is another embodiment of the diffusion bonding member manufactured by the manufacturing method of the present invention.
【図6】従来の拡散部材の製造方法の工程を示す図であ
る。FIG. 6 is a diagram showing steps of a conventional method for manufacturing a diffusion member.
【図7】従来の拡散部材の製造方法の工程を示す図であ
る。FIG. 7 is a diagram showing steps of a conventional method for manufacturing a diffusion member.
10 被処理材 10’ 拡散接合部材 11 窓枠部材 12 金網 13 金属箔 14 離型材の塗膜 15 カプセル 16 溶接部 10 Processing Material 10 'Diffusion Bonding Member 11 Window Frame Member 12 Wire Mesh 13 Metal Foil 14 Coating Film of Release Material 15 Capsule 16 Welding Part
Claims (2)
ミナゾルを混合した離型材を塗布した2枚の金属箔で被
処理材を挟持し、 前記金属箔の縁部をシールして形成されるカプセルの内
部を真空脱気することにより、前記被処理材を前記カプ
セル内に密封し、 次いで、カプセル全体を熱間等方加圧処理して、前記被
処理材を拡散接合した後、前記カプセルを除去すること
を特徴とする板状拡散接合部材の製造方法。1. An inside of a capsule formed by sandwiching a material to be treated with two metal foils obtained by applying a release material in which boron nitride is mixed with colloidal silica or alumina sol and sealing the edge of the metal foil. Vacuum degassing to seal the material to be treated in the capsule, and then subject the entire capsule to hot isostatic pressing to diffuse-bond the material to be treated, and then remove the capsule. A method for manufacturing a plate-shaped diffusion bonding member, comprising:
ホウ素/シリカ=1/2〜3/2、又は窒化ホウ素/ア
ルミナ=1/2〜3/2である離型材を用いることを特
徴とする請求項1に記載の板状拡散接合部材の製造方
法。2. A mold release material having a content weight ratio of boron nitride / silica = 1/2 to 3/2 or boron nitride / alumina = 1/2 to 3/2 is used as the mold release material. The method for manufacturing a plate-shaped diffusion bonding member according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262255A JP2803927B2 (en) | 1991-10-09 | 1991-10-09 | Method for manufacturing plate-shaped diffusion bonding member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262255A JP2803927B2 (en) | 1991-10-09 | 1991-10-09 | Method for manufacturing plate-shaped diffusion bonding member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05104258A true JPH05104258A (en) | 1993-04-27 |
| JP2803927B2 JP2803927B2 (en) | 1998-09-24 |
Family
ID=17373240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3262255A Expired - Fee Related JP2803927B2 (en) | 1991-10-09 | 1991-10-09 | Method for manufacturing plate-shaped diffusion bonding member |
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| Country | Link |
|---|---|
| JP (1) | JP2803927B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023002318A (en) * | 2021-06-22 | 2023-01-10 | フロイント産業株式会社 | Perforated plate for fluidized bed apparatus and fluidized bed apparatus |
-
1991
- 1991-10-09 JP JP3262255A patent/JP2803927B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023002318A (en) * | 2021-06-22 | 2023-01-10 | フロイント産業株式会社 | Perforated plate for fluidized bed apparatus and fluidized bed apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2803927B2 (en) | 1998-09-24 |
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