JPH051077Y2 - - Google Patents

Description

[Detailed explanation of the invention] [Industrial application field] This invention is a TAB (tape) for semiconductor components.
This equipment applies resist lacquer to device holes in (Automatic Bonding) film, and more specifically, it relates to resist coating equipment that prevents air bubbles from getting into the lacquer during coating and partially applies lacquer only to device holes. be.

[Prior art] Conventionally, a device for applying resist lacquer to device holes in a TAB film involves bringing a squeegee-type nozzle close to a certain distance from the running TAB film and supplying the lacquer to this nozzle. In particular, an apparatus is known that continuously applies a lacquer to a film including device holes. As shown in FIG. 3, a typical device for this purpose is to provide a slit-shaped discharge port 22 at the tip of a squeegee nozzle 21, and supply a lacquer 23 onto the slope of the nozzle 21.
It was a mechanism that continuously coated the TAB film 12 in a strip including the device holes 13.

[Problems to be solved by the invention] With conventional coating equipment, the lacquer is applied continuously to areas other than unnecessary device holes, which increases the cost of the lacquer and reduces the amount of stripping liquid used after etching. There is also a problem. Furthermore, when infrared rays are used in the resist drying process, a temperature gradient occurs in the device hole and its surroundings, and the lacquer is fixed while flowing outside the device hole, resulting in unevenness in the film thickness and the strength of the film. There is a problem of causing a decline. Furthermore, when the squeegee nozzle 21 passes through the step of the device hole 13, air bubbles are drawn into the lacquer, causing corrosion of the copper foil when etching the TAB film after drying.

The present invention was developed in view of these problems with conventional technology, and its purpose is to prevent air bubbles from entering the lacquer, and to make the film thickness of the lacquer uniform. The purpose of the present invention is to provide a coating device that measures the amount of water used and reduces its usage and other aspects.

[Means for Solving the Problems] In order to achieve the above object, the resist coating device of the present invention includes a coating nozzle with a cylindrical tip having a reservoir for resist lacquer, and an opening of the coating nozzle. It consists of a drive mechanism that brings droplets of lacquer into spot contact with the device hole of the TAB film by moving it up and down, and a mechanism that limits the speed of this drive, so that the inside of the device hole is coated using the wettability of the lacquer itself. It is.

[Function] In the resist coating device configured as described above, when the resist lacquer supplied in an appropriate amount to the opening of the coating nozzle forms droplets at the lower end of the discharge port, the droplets block the opening and the lacquer is removed. An amount of lattice molecules that balances the surface tension of the particles accumulates in the opening. Therefore, when the opening of the coating nozzle is lowered and the droplets at the opening come into contact with the device hole, the lacquer in the opening flows out and is diffused due to its wettability, spreading and coating only inside the device hole. Therefore, unlike the conventional nozzle position which is fixed, when the nozzle passes through the step of the device hole, it is possible to prevent air bubbles from getting caught inside the lacquer. In addition, the flowing lacquer is collected only on the inside of the step (device hole), preventing it from flowing out to the outside, and reducing unevenness in film thickness.

[Example] In Figs. 1 and 2, 1 is a coating nozzle whose discharge port 2 has a cylindrical cross section, and the lower side has a smaller diameter than the upper side in order to form a reservoir for the resist lacquer. ing. The opening of the discharge port 2 and the lacquer supply port 3 are connected by a groove 4. This coating nozzle 1 is fixed to a fixed plate 5 and connected to a push plate 6 by a fulcrum shaft 7. Both ends of the push plate 6 are pushed up alternately on the left and right sides by air cylinders 8a and 8b constituting a drive mechanism, making it possible to rotate around the shaft 7. However, the amount of rotation is limited by the vertical position of the bolt 9, and the rotation speed is limited by the speed controller attached to the air cylinder 8a.
0 and the shock absorber 11. Note that 12 is a TAB film, and the film 12 is moved one pitch at a time while detecting device holes (not shown) using, for example, a laser photoelectric switch or the like.

The resist coating device configured as described above is
The lacquers supplied to the resist lacquer supply port 3 pass through the groove 4 and reach the discharge port 2. These lacquers form droplets at the lower end of the ejection port 2, which block the ejection port 2, and an amount of lacquer that is balanced by the surface tension of the lacquer can accumulate in the ejection port 2.

Therefore, when the right air cylinder 8a constituting the drive mechanism is pushed up, the left end of the coating nozzle 1 descends, and the droplets from the discharge port 2 reach the TAB film 12.
The lacquer in the discharge port 2 flows out. This leaked lacquer is diffused due to its wettability and spreads only within the device hole. After that, the left air cylinder 8b is pushed up, and the discharge port 2 is pushed up.

In this case, if the nozzle is fixed as in the conventional technology, air bubbles will be trapped inside the lattice when the nozzle passes through the step of the device hole, but as in the present invention, the nozzle is not fixed at the step. Since there is no contact, entrainment of air bubbles is prevented. Also,
During the drying process, since no lacquer exists outside the device hole, the flow of lacquer is confined only to the inside of the step, preventing it from flowing outside.
Film thickness unevenness can be reduced. However, depending on the speed at which the lacquer droplet formed at the tip of the discharge port 2 contacts the device hole, air bubbles may be mixed into the lacquer upon contact.
It is preferable to install a speed controller 15 and a shock absorber 16 in the drive system so that the contact speed can be limited to 10 mm/s or less.

Using this equipment, we coated 60,000 pieces of TAB film with resist over a period of one month.
In the conventional method, erosion (chipping) of the copper foil occurred in the 14 pieces due to the inclusion of air bubbles, but in the present invention, there was no corrosion. Further, the amount of resist used per 5000 pieces was 180 c.c. in the conventional method, and 85 c.c. in the present invention.
Furthermore, variations in resist film thickness can also be adjusted to the target film thickness.
50 μm, the conventional method had a thickness of 13 to 88 μm, whereas the present invention had a thickness of 45 to 55 μm.

[Effects of the Invention] As explained above, in the present invention, droplets of lacquer are brought into contact only with the inside of the device hole, and coating is performed by the wettability of the droplets, so that entrainment of air bubbles can be completely prevented. Furthermore, since the lacquer does not flow out of the device hole, the film thickness of the lacquer can be made uniform. In addition, there are effects such as the ability to significantly reduce the amount of lacquer used.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of a device hole resist coating apparatus according to this invention, FIG. 2 is a sectional view of a coating nozzle, and FIG. 3 is a sectional view of a conventional coating apparatus. 1... Application nozzle, 2... Discharge port, 3... Lacquer supply port, 4... Groove, 5... Fixed plate,
6... Push plate, 7... Fulcrum shaft, 8a, 8b
... Air cylinder, 9 ... Bolt, 10 ... Speed controller, 11 ... Shock absorber, 12 ... TAB film, 13 ... Device hole, 21 ... Squeegee nozzle, 22 ... Discharge port, 23 ... Racker class (resist).

Claims (1)

[Scope of utility model registration request] A coating nozzle with a cylindrical tip having a reservoir for resist lacquer; a drive mechanism that moves the coating nozzle opening up and down to bring droplets of lacquer into spot contact with the device hole of the TAB film; A resist coating device for device holes in TAB film that has a speed-limiting mechanism and uses the wettability of the lacquer itself to coat the inside of the device hole.