JPH0511073B2 - - Google Patents
Info
- Publication number
- JPH0511073B2 JPH0511073B2 JP10981087A JP10981087A JPH0511073B2 JP H0511073 B2 JPH0511073 B2 JP H0511073B2 JP 10981087 A JP10981087 A JP 10981087A JP 10981087 A JP10981087 A JP 10981087A JP H0511073 B2 JPH0511073 B2 JP H0511073B2
- Authority
- JP
- Japan
- Prior art keywords
- wall
- crucible
- thickness
- pbn
- reaction chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 26
- 239000002994 raw material Substances 0.000 claims description 10
- 229910052582 BN Inorganic materials 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 9
- 239000013078 crystal Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- -1 boron halide Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004299 exfoliation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Crucibles And Fluidized-Bed Furnaces (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Description
〔産業上の利用分野〕
本発明は、使用寿命の改良された窒化ホウ素る
つぼ、特に分子ビームエピタキシー(MBE)や
液体封止チヨクラルスキー(LEC)法などで用
いる金属及び化合物溶融用の窒化ホウ素るつぼに
関する。
〔従来の技術〕
熱分解窒化ホウ素(PBN)は、高純度・高品
質の窒化ホウ素(BN)として化合物半導体や特
殊合金の製造などの巾広い分野で用いられている
材料である。特にGaAsなどの化合物半導体の製
造においては、PBNのすぐれた耐食性と高純度
が最大限有効に発揮されており、不純物が少なく
電気特性の優れた化合物半導体単結晶を育成する
上で不可欠な材料となつている。
たとえば、GaAs単結晶育成において、PBN
は、LEC法におけるるつぼとして、またHB法
(水平ブリツジマン法)におけるボートとしてそ
れぞれ用いられている。また、GaAs単結晶ウエ
ハー上にGa1-XAlXAsなどの混晶化合物半導体を
エピタキシヤル成長させる一方法である分子ビー
ム エピタキシー法における金属溶融用容器(る
つぼ)としてもPBNがほぼ独占的に用いられて
いる。
PBNは、たとえば米国特許第3152006号明細書
で開示されているように、三塩化ホウ素(BCl3)
のようなハロゲン化ホウ素とアンモニアを気体状
原料とし、温度1450℃〜2300℃、圧力50torr未満
の条件下で適当な基材表面上にBNを析出させる
いわゆる化学気相蒸着法(CVD法)により合成
される。基材材料とCVD条件を適切に選べば、
析出したPBN膜を基材から分離し、自立型PBN
物品を得ることができる。
このようにして得られるPBNは膜の成長方向
に対し垂直な方向に六方晶BNのC面が高度に配
向した構造をしており、このため、たとえば
LEC法におけるるつぼとして繰り返し、使用す
る場合、封止剤である酸化ホウ素(B2O3)を除
去する際に不均一な層剥離を起こしやすく、その
ため寿命が短かく、また一定の寿命をもつことが
保証され難いという欠点があつた。
このような欠点を解決する方法として、中間壁
を介在させつつある特定範囲の厚さからなる多数
の個別壁で構成された多重壁構造るつぼが提案さ
れている(特開昭61−285383号公報)。このよう
な多重壁構造るつぼは、たとえばLEC法による
結晶育成後にB2O3を除去する際に、常にるつぼ
の最内壁層で剥離が起こり、かつ剥離が深くなる
ことなく部分剥離層を除去できるので、るつぼの
寿命が従来のものよりも大巾に伸び、しかもるつ
ぼ間での寿命のバラツキが少ないという長所を有
している。さらには、このような多重壁構造るつ
ぼを製造するにあたつては、原料ガスのアンモニ
ア対ハロゲン化ホウ素配合モル比を異ならせ、交
互に繰り返しながら形成させていくので、膜形成
を一時的に中断する必要がなく、不必要に長時間
を要することなくるつぼが製造できるという利点
がある。
このような多重壁構造るつぼにおいては各個別
壁の厚みが薄いほど寿命が向上するわけである
が、特開昭61−285383号公報に記載された方法で
は、第1の壁の厚みを20μm未満とすると個々の
壁の間での区分が明確でなくなり、前記するよう
な多重壁構造の効果を十分に得られないという欠
点があつた。
〔発明が解決しようとする問題点〕
本発明者は、上記欠点を解決することを目的と
して種々検討した結果、CVD反応室における原
料ガスの流速を毎秒50m以上として製造したるつ
ぼは、その第1の壁の厚みを20μm未満としても
壁間の区分が明確になることを見い出し、本発明
を完成した。
〔問題点を解決するための手段〕
すなわち、本発明は、反応室における原料ガス
の流速を毎秒50m以上として化学気相蒸着法によ
り製造された窒化ホウ素るつぼであつて、1層の
厚みが1μm以上20μm未満である第1の壁と、厚
みが第1の壁の1/50〜1/2である第2の壁とが、
互いに結合をもつて交互に積層されてなつてお
り、かつ、全体の壁厚が0.5〜3mmであることを
特徴とする多重壁構造からなる窒化ホウ素るつぼ
である。
以下、さらに詳しく本発明について説明する。
本発明の多重壁構造るつぼは、第1の壁の厚み
が1μm以上20μm未満の範囲である。厚みが1μm
未満であると壁を構成するPBN膜の強度が十分
でないために、単結晶育成に用いた場合に寿命が
短かく、また20μm以上では従来の多重壁るつぼ
と同一の構造となり、寿命延長効果が十分でなく
なる。次に、第1の壁に隣接する第2の壁の厚み
は第1の壁の1/50〜1/2である。1/50より厚みが
薄いと層毎の剥離性が悪く、中間壁としての機能
が十分に得られなくなる。また、1/2より厚くな
ると第1の壁との間でラミネーシヨンを起こす傾
向があるので好ましくない。るつぼの全体壁厚と
しては0.5〜3mmである。壁厚が0.5mm未満ではる
つぼ全体の強度が不足し、また3mmをこえると内
部応力が増大し、自発的なラミネーシヨンの発生
を摺来することになるので好ましくない。本発明
のるつぼは従来のものに比べ、個々の壁の厚みが
薄いために概ね10〜100倍の多重壁とすることが
できる。
本発明においては、個々の壁を形成する際の
CVD反応室内の原料ガスの流速を毎秒50m以上
とすることが重要なことである。流速が毎秒50m
未満では、個々の壁の間での区分が明確でなくな
るために層毎の剥離性の良好なるつぼを得ること
ができない。流速を毎秒50m以上とすることによ
り壁間の区分が明確となる理由は、原料ガス条件
の切り換わリが迅速になるためと推定される。
次に、本発明の多重壁構造るつぼの製造法につ
いて説明すると、多重壁構造のPBNるつぼを形
成する個々の壁は、三塩化ホウ素などのハロゲン
化ホウ素ガスとアンモニアガスとを原料とする
CVD法により形成されるが、そのときの圧力は
5torr以下、温度は1850℃以上であればよい。圧
力が5torrをこえるとBNの微粒子が副生し、
PBN膜中に取り込まれて組織の均一性が損なわ
れる傾向にある。温度が1850℃未満では生成する
PBNの強度が低く、るつぼとしての実用強度が
不足する傾向にある。このような条件下で形成さ
れる壁同志を互いに弱く結合させるためには、第
1の壁とそれに隣接する第2の壁(中間壁)とを
互いに異なつたアンモニア対ハロゲン化ホウ素の
配合モル比で蒸着すればよい。すなわち、第1の
壁を形成するときの前記モル比は2〜10、第2の
壁の前記モル比は1/3以上2未満とすればよい。
CVD反応室における原料ガスの流速を毎秒50m
以上に調節するには、導入ガス量とるつぼ型黒鉛
基材とCVD反応室壁の間の空間断面積、及び
CVD反応室の温度、圧力を調整することによつ
て行うことができる。
次に実施例と比較例をあげてさらに具体的に本
発明を説明する。
〔実施例 比較例〕
5cm巾×60cm長×1cm厚の黒鉛板8枚を使い、
直径20cmの黒鉛板(底板)の上面に8角形の断面
を有する反応室を形成した。底板の中央にはガス
導入のため直径5cmの孔をあけ、原料ガス導入管
として予めPBN被覆した黒鉛パイプ2本(外径
5cm及び2.5cm)を同軸になるよう接続し、反応
室上部から直径5cm、長さ6cmの黒鉛基材を吊り
下げた。この反応室全体を高温抵抗加熱真空炉内
に装入し、原料ガス導入管の黒鉛パイプの内外管
には各々BCl3、NH3ガスを供給できるよう、ス
テンレス製ガス配管を接続した。前記真空炉を
10-3torr台に排気しながら、1900℃にまで加熱し
た。
次に、1torrの圧力下、第1の壁はアンモニア
対三塩化ホウ素配合モル比を4とし、第2の壁は
配合モル比を1として表に示す条件で交互に蒸着
し、全体壁厚1mmのPBNるつぼを作製した。得
られたるつぼについて、LEC法による単結晶育
成を想定した寿命テストを次の方法により実施し
た。
すなわち、るつぼ内に50gのB2O3を入れ、N2
雰囲気中で1280℃に加熱してB2O3を溶融した後
室温まで冷却する。るつぼ内壁に付着したB2O3
は、るつぼ全体をメタノール中に浸し、20〜40分
間超音波洗浄することにより取り除かれるが、こ
の際、B2O3の冷却収縮時にB2O3に付着していた
PBNるつぼ内壁面の一部が剥がれる。これをる
つぼが破損するまで繰り返した。各々のるつぼの
破損までの回数は表に示した。
表から、本発明の実施例はいずれも40回以上の
寿命を示し、比較例よりも長寿命であることがわ
かる。
[Industrial Application Field] The present invention relates to a boron nitride crucible with improved service life, particularly for melting metals and compounds used in molecular beam epitaxy (MBE), liquid-enclosed Czochralski (LEC), etc. Regarding the crucible. [Prior Art] Pyrolytic boron nitride (PBN) is a high-purity, high-quality boron nitride (BN) material that is used in a wide range of fields such as the production of compound semiconductors and special alloys. In particular, in the production of compound semiconductors such as GaAs, PBN's excellent corrosion resistance and high purity are utilized to the maximum extent possible, making it an indispensable material for growing compound semiconductor single crystals with few impurities and excellent electrical properties. It's summery. For example, in GaAs single crystal growth, PBN
is used as a crucible in the LEC method and as a boat in the HB method (horizontal Bridgeman method). In addition, PBN is almost exclusively used as a container (crucible) for melting metal in molecular beam epitaxy, which is a method for epitaxially growing mixed crystal compound semiconductors such as Ga 1-X Al X As on GaAs single crystal wafers. It is used. PBN is boron trichloride (BCl 3 ), as disclosed for example in U.S. Pat. No. 3,152,006.
Using boron halide and ammonia as gaseous raw materials, BN is deposited on the surface of a suitable substrate at a temperature of 1450°C to 2300°C and a pressure of less than 50 torr using the so-called chemical vapor deposition method (CVD method). be synthesized. If you choose the base material and CVD conditions appropriately,
Separate the precipitated PBN film from the substrate and create free-standing PBN.
Goods can be obtained. The PBN obtained in this way has a structure in which the C-plane of hexagonal BN is highly oriented in the direction perpendicular to the film growth direction, and therefore, for example,
When repeatedly used as a crucible in the LEC method, uneven layer delamination tends to occur when the sealant boron oxide (B 2 O 3 ) is removed, resulting in a short lifespan and a fixed lifespan. The drawback was that it was difficult to guarantee that. As a method to solve these drawbacks, a multi-wall structure crucible is proposed, which is composed of a large number of individual walls with thicknesses in a specific range with an intervening intermediate wall (Japanese Patent Application Laid-Open No. 61-285383). ). With such a multi-wall structure crucible, for example, when removing B 2 O 3 after crystal growth using the LEC method, exfoliation always occurs at the innermost wall layer of the crucible, and the partial exfoliation layer can be removed without deepening the exfoliation. Therefore, the lifespan of the crucible is greatly extended compared to conventional crucibles, and it has the advantage that there is little variation in the lifespan between crucibles. Furthermore, when manufacturing such a multi-walled crucible, the molar ratio of ammonia to boron halide in the raw material gas is varied and the formation is repeated alternately, which temporarily inhibits film formation. The advantage is that the crucible can be produced without any interruptions and without unnecessarily long periods of time. In such a multi-wall structure crucible, the thinner the individual walls, the longer the life will be. However, in the method described in Japanese Patent Application Laid-Open No. 61-285383, the thickness of the first wall is set to less than 20 μm. This has the disadvantage that the divisions between the individual walls are not clear and the effects of the multi-wall structure described above cannot be fully obtained. [Problems to be Solved by the Invention] As a result of various studies aimed at solving the above-mentioned drawbacks, the inventor of the present invention has found that a crucible manufactured by setting the flow rate of the raw material gas in the CVD reaction chamber to 50 m/s or higher is the first of its kind. It was discovered that the division between the walls becomes clear even when the wall thickness is less than 20 μm, and the present invention was completed. [Means for Solving the Problems] That is, the present invention provides a boron nitride crucible manufactured by a chemical vapor deposition method with a flow rate of raw material gas in a reaction chamber of 50 m/s or more, in which the thickness of one layer is 1 μm. A first wall having a thickness of at least 20 μm and a second wall having a thickness of 1/50 to 1/2 of the first wall,
This boron nitride crucible has a multi-wall structure in which the layers are alternately bonded to each other and have a total wall thickness of 0.5 to 3 mm. The present invention will be explained in more detail below. In the multi-wall structure crucible of the present invention, the thickness of the first wall is in the range of 1 μm or more and less than 20 μm. Thickness is 1μm
If it is less than 20 μm, the PBN film that makes up the wall will not have sufficient strength, so the life will be short when used for single crystal growth, and if it is more than 20 μm, the structure will be the same as a conventional multi-walled crucible, and the life extension effect will be reduced. It won't be enough. Next, the thickness of the second wall adjacent to the first wall is 1/50 to 1/2 that of the first wall. If the thickness is thinner than 1/50, the peelability of each layer will be poor, and the function as an intermediate wall will not be obtained sufficiently. Moreover, if it is thicker than 1/2, it is not preferable because it tends to cause lamination with the first wall. The total wall thickness of the crucible is 0.5 to 3 mm. If the wall thickness is less than 0.5 mm, the strength of the entire crucible will be insufficient, and if it exceeds 3 mm, internal stress will increase, resulting in spontaneous lamination, which is not preferable. The crucible of the present invention can have approximately 10 to 100 times more multi-walls than conventional crucibles because the individual walls are thinner. In the present invention, when forming individual walls,
It is important that the flow rate of the raw material gas in the CVD reaction chamber be 50 m/s or more. Flow velocity is 50m/s
If the thickness is less than 1, it is impossible to obtain a crucible with good peelability from layer to layer because the divisions between individual walls become unclear. The reason why the separation between the walls becomes clearer when the flow velocity is set to 50 m/s or more is presumed to be that the source gas conditions can be changed more quickly. Next, to explain the method for manufacturing the multi-wall structure crucible of the present invention, each wall forming the multi-wall structure PBN crucible is made of boron halide gas such as boron trichloride and ammonia gas as raw materials.
It is formed by CVD method, but the pressure at that time is
It is sufficient that the temperature is 5 torr or less and the temperature is 1850°C or higher. When the pressure exceeds 5 torr, fine particles of BN are produced as a by-product.
It tends to be incorporated into the PBN film and impair the uniformity of the tissue. Forms when the temperature is below 1850℃
PBN has low strength and tends to lack practical strength as a crucible. In order to weakly bond the walls formed under such conditions to each other, the first wall and the adjacent second wall (intermediate wall) may be mixed at different molar ratios of ammonia to boron halide. It can be vapor-deposited. That is, the molar ratio when forming the first wall may be 2 to 10, and the molar ratio of the second wall may be 1/3 or more and less than 2.
The flow rate of the raw material gas in the CVD reaction chamber is 50 m/s.
In order to adjust the amount above, the amount of introduced gas, the cross-sectional area of the space between the crucible graphite substrate and the CVD reaction chamber wall, and
This can be done by adjusting the temperature and pressure of the CVD reaction chamber. Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples. [Example Comparative Example] Using 8 graphite plates 5 cm wide x 60 cm long x 1 cm thick,
A reaction chamber having an octagonal cross section was formed on the top surface of a graphite plate (bottom plate) with a diameter of 20 cm. A hole with a diameter of 5 cm was made in the center of the bottom plate for gas introduction, and two graphite pipes (outer diameter 5 cm and 2.5 cm) coated with PBN were connected coaxially as raw material gas introduction pipes. A graphite substrate measuring 5 cm and 6 cm in length was suspended. The entire reaction chamber was placed in a high-temperature resistance heating vacuum furnace, and stainless steel gas piping was connected to the inner and outer graphite pipes of the raw material gas introduction pipe so that BCl 3 and NH 3 gas could be supplied, respectively. The vacuum furnace
It was heated to 1900°C while evacuating to a level of 10 -3 torr. Next, under a pressure of 1 torr, the first wall was deposited with a molar ratio of ammonia to boron trichloride of 4, and the second wall was deposited with a molar ratio of 1 under the conditions shown in the table, and the total wall thickness was 1 mm. A PBN crucible was fabricated. A life test on the obtained crucible assuming single crystal growth by the LEC method was conducted using the following method. That is, put 50g of B 2 O 3 in the crucible and add N 2
It is heated to 1280° C. in an atmosphere to melt B 2 O 3 and then cooled to room temperature. B 2 O 3 attached to the inner wall of the crucible
is removed by immersing the entire crucible in methanol and ultrasonic cleaning for 20 to 40 minutes, but at this time, the B 2 O 3 that was attached to the B 2 O 3 during cooling contraction was removed.
Part of the inner wall of the PBN crucible peels off. This was repeated until the crucible was damaged. The number of times until failure of each crucible is shown in the table. From the table, it can be seen that all of the examples of the present invention have a lifespan of 40 times or more, and have a longer lifespan than the comparative examples.
本発明の多重壁構造からなる窒化ホウ素るつぼ
は、MBE法やLEC法において、その使用寿命を
著しく延長させることができるので、化合物半導
体の製造コストを低減できる。
The boron nitride crucible having a multi-wall structure according to the present invention can significantly extend the service life in the MBE method and LEC method, thereby reducing the manufacturing cost of compound semiconductors.
Claims (1)
上として化学気相蒸着法により製造された窒化ホ
ウ素るつぼであつて、1層の厚みが1μm以上
30μm未満である第1の壁と、厚みが第1の壁の
1/50〜1/2である第2の壁とが互いに結合をもつ
て交互に積層されてなつており、かつ、全体の壁
厚が0.5〜3mmであることを特徴とする多重壁構
造からなる窒化ホウ素るつぼ。1 A boron nitride crucible manufactured by chemical vapor deposition with a flow rate of raw material gas in the reaction chamber of 50 m/s or more, and one layer of which has a thickness of 1 μm or more.
A first wall having a thickness of less than 30 μm and a second wall having a thickness of 1/50 to 1/2 of the first wall are bonded to each other and alternately stacked, and A boron nitride crucible having a multi-wall structure characterized by a wall thickness of 0.5 to 3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10981087A JPS63277590A (en) | 1987-05-07 | 1987-05-07 | Boron nitride crucible |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10981087A JPS63277590A (en) | 1987-05-07 | 1987-05-07 | Boron nitride crucible |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63277590A JPS63277590A (en) | 1988-11-15 |
| JPH0511073B2 true JPH0511073B2 (en) | 1993-02-12 |
Family
ID=14519778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10981087A Granted JPS63277590A (en) | 1987-05-07 | 1987-05-07 | Boron nitride crucible |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63277590A (en) |
-
1987
- 1987-05-07 JP JP10981087A patent/JPS63277590A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63277590A (en) | 1988-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5993770A (en) | Silicon carbide fabrication | |
| US4773852A (en) | Pyrolytic boron nitride crucible and method for producing the same | |
| JP2004137142A (en) | Single crystal aluminum nitride membrane and forming method thereof, underlying substrate for group iii nitride membrane, luminescent element, as well as surface elastic wave device | |
| US20260035312A1 (en) | Substrate comprising tantalum coating | |
| JPH0456765B2 (en) | ||
| CA2041427C (en) | Boron nitride boat and process for producing it | |
| JPH0511073B2 (en) | ||
| US5674317A (en) | Vessel made from pyrolytic boron nitride | |
| US5182149A (en) | Boron nitride boat and process for producing it | |
| JPH06122504A (en) | Pyrolysis boron nitride container | |
| JP2507739B2 (en) | Pyrolytic boron nitride container | |
| JPH0456766B2 (en) | ||
| JP2588540B2 (en) | Pyrolytic boron nitride container | |
| JP3579344B2 (en) | Method and apparatus for manufacturing group IIIV nitride film | |
| JPS61236672A (en) | Pyrolytic boron nitride coated products and manufacture | |
| JPH0455160B2 (en) | ||
| JPH0798708B2 (en) | Method for producing pyrolytic boron nitride coated article | |
| JPH0455159B2 (en) | ||
| JPS62132798A (en) | Crucible for growing compound semiconductor and production thereof | |
| JPH0784357B2 (en) | Boron nitride coated crucible | |
| JP4386663B2 (en) | Carbon composite material | |
| JPH03131507A (en) | Formed body of pyrolytic boron nitride and production thereof | |
| JPH053410B2 (en) | ||
| JPH044967B2 (en) | ||
| JPS61236685A (en) | Crucible for growing compound semiconductor |