JPH0511111B2 - - Google Patents

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Publication number
JPH0511111B2
JPH0511111B2 JP60063426A JP6342685A JPH0511111B2 JP H0511111 B2 JPH0511111 B2 JP H0511111B2 JP 60063426 A JP60063426 A JP 60063426A JP 6342685 A JP6342685 A JP 6342685A JP H0511111 B2 JPH0511111 B2 JP H0511111B2
Authority
JP
Japan
Prior art keywords
aromatic
bonded
tetracarboxylic acid
group
aromatic hydrocarbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60063426A
Other languages
Japanese (ja)
Other versions
JPS61225164A (en
Inventor
Seiichi Hino
Shoichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP60063426A priority Critical patent/JPS61225164A/en
Publication of JPS61225164A publication Critical patent/JPS61225164A/en
Publication of JPH0511111B2 publication Critical patent/JPH0511111B2/ja
Granted legal-status Critical Current

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  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は、主鎖中に耐熱骨格であるイミド基
と、末端にアミノ基を有するイミド基含有芳香族
ポリアミン、及びその製造方法に関する。更にエ
ポキシ樹脂の耐熱性硬化剤として有用な、溶解性
の向上したイミド基含有芳香族ポリアミン及びそ
の製造方法に関する。 〔従来の技術〕 エポキシ樹脂の耐熱性向上の為、硬化剤として
芳香族ポリアミンを使用することは既に知られて
いる。一方高い耐熱性を示す複素環ポリマーの1
種であるポリイミド骨格をエポキシ樹脂に導入
し、耐熱性の向上を試みることが行われている。
しかしこれらイミド骨格を有するポリマー、オリ
ゴマーは一般的に融点が高く、又溶解性が悪い
為、成形性が低い。この成形性改良の為、ポリア
ミド類、ポリアミドエステル、テトラカルボン酸
のアルコール半エステル等の中間体を経由してポ
リイミドを形成する方法が知られているが、これ
ら中間体を使用してエポキシ樹脂の硬化を行うと
副反応が多く所望のイミド基の導入はおろか、耐
熱性硬化物を与える芳香族ポリアミン硬化も困難
である。 〔発明の目的〕 本発明は上記難点を改良した。エポキシ樹脂の
硬化剤として有用な、主鎖中に耐熱骨格であるイ
ミド基と、末端にエポキシ樹脂硬化物の耐熱性を
向上さす芳香族アミノ基を有する溶解性の優れた
イミド基含有芳香族ポリアミン及びその製造方法
を提供するものである。 即ち本発明の要旨は下記一般式 〔Xは芳香族炭化水素環を含む4価の芳香族テト
ラカルボン酸残基であり、同一の窒素原子に結合
する2個のカルボニル基は、夫々前記Xに含まれ
る芳香族炭化水素環の互いに隣接する炭素原子に
結合し、Y1
[Industrial Application Field] The present invention relates to an imide group-containing aromatic polyamine having an imide group as a heat-resistant skeleton in the main chain and an amino group at the end, and a method for producing the same. Furthermore, the present invention relates to an imide group-containing aromatic polyamine with improved solubility, which is useful as a heat-resistant curing agent for epoxy resins, and a method for producing the same. [Prior Art] It is already known that aromatic polyamines are used as curing agents to improve the heat resistance of epoxy resins. On the other hand, one of the heterocyclic polymers that exhibits high heat resistance.
Attempts are being made to improve heat resistance by introducing a polyimide skeleton into epoxy resins.
However, these imide skeleton-containing polymers and oligomers generally have a high melting point and poor solubility, resulting in poor moldability. In order to improve moldability, it is known to form polyimide via intermediates such as polyamides, polyamide esters, and alcohol half esters of tetracarboxylic acids. Curing causes many side reactions, and it is difficult not only to introduce the desired imide group, but also to cure the aromatic polyamine to give a heat-resistant cured product. [Object of the Invention] The present invention has improved the above-mentioned drawbacks. An aromatic polyamine containing an imide group with excellent solubility, useful as a curing agent for epoxy resin, having an imide group as a heat-resistant skeleton in the main chain and an aromatic amino group at the end that improves the heat resistance of the cured epoxy resin. The present invention provides a method for manufacturing the same. That is, the gist of the present invention is the following general formula [X is a tetravalent aromatic tetracarboxylic acid residue containing an aromatic hydrocarbon ring, and the two carbonyl groups bonded to the same nitrogen atom are bonded to each other of the aromatic hydrocarbon rings contained in said X. bonded to adjacent carbon atoms, Y 1 is

〔発明の構成〕[Structure of the invention]

以下、本発明を詳細に説明する。 まず、本発明に係るイミド基含有芳香族ポリア
ミンはたとえば次のような方法によつて得られ
る。すなわち、芳香族テトラカルボン酸又はその
誘導体と少なくとも0−アルキル置換アニリン−
ホルムアルデヒド縮合物を含む過剰量の2種以上
の芳香族ジアミンとを反応させることにより製造
することができる。更に少量の0−アルキル置換
アニリン−ホルムアルデヒド縮合物と芳香族テト
ラカルボン酸又はその誘導体と反応させ、次いで
過剰量の他の芳香族ジアミンと反応させることに
より、エポキシ樹脂硬化物の耐熱性を向上させる
芳香族ジアミン成分を末端に有するイミド基含有
芳香族ポリアミンを製造することができる。 本発明の一成分である芳香族テトラカルボン酸
としてはピロメリツト酸、3,3′,4,4′−ベン
ゾフエノンテトラカルボン酸、3,3′、4,4′−
ジフエニルエーテルテトラカルボン酸、3,3′,
4,4′−ビフエニルテトラカルボン酸、2,3,
6,7−ナフタレンテトラカルボン酸、2,3,
4,5−チオフエンテトラカルボン酸、2,2−
ビス(3,4−ジカルボキシフエニル)プロパン
等及びこれらの異性体の1種又は2種以上が使用
される。これら芳香族テトラカルボン酸成分は低
級アルキルエステル、二無水物等の誘導体の形と
して使用することができるが、その反応性の観点
から、二無水物を使用することが好ましい。 本発明の一成分である2種以上の芳香族ジアミ
ンには少なくとも1種以上の0−アルキル置換ア
ニリン−ホルムアルデヒド縮合物が使用される。
このアルキル基としては炭酸数1〜4、好ましく
はエチル基が選ばれる。たとえば0−エチルアニ
リン−ホルムアルデヒド縮合物は、特開昭47−
31961号に記載されている如く、水媒体中、塩酸、
硫酸等の無機強酸の存在下60〜100℃で0−アル
キルアニリンとホルムアルデヒドとの反応によつ
て得られる。この反応により、ジアミン成分であ
る3,3′−ジエチル−4,4′−ジアミノジフエニ
ルメタンの他にトリアミン、テトラミン等が副生
する。これらを蒸溜によつて分離することにより
ジアミン成分を容易に得ることが出来るが、これ
ら副生物を分離することなく本発明に使用するこ
とも出来る。 しかし、トリアミン以上のポリアミンが多くな
るとイミド基含有芳香族ポリアミン製造時にゲル
化し易くなる為、ポリアミンは70重量%以下が好
ましい。又、0−エチルアニリンの縮合反応の
際、アニリンを添加することにより、3,3′−ジ
エチル−4,4′−ジアミノジフエニルメタン、3
−エチル−4,4′−ジアミノジフエニルメタン、
4,4′−ジアミノフエニルメタン3成分を主とす
る混合物が得られるが、これも本発明に有効に用
いられる。アニリンに替えて、0−トルイジン、
0−クロルアニリンイ等のp−位に置換基のない
アニリン誘導体を添加した0−エチルアニリンの
縮合物も使用出来る。 本発明の一成分である0−アルキル置換アニリ
ン−ホルムアルデヒド縮合物以外の芳香族ジアミ
ンとしては式H2N−R−NH2(ここでRは30個ま
での炭素原子を有する、2価の連結基として−
SO2−によつて結合された2価の芳香族基であ
る。)が使用される。これらの芳香族ジアミンの
1種又は2種以上が使用されるが、エポキシ樹脂
硬化物の耐熱生より、4,4′−ジアミノジフエニ
ルスルホン、3,3′−ジアミノジフエニルスルホ
ンが好ましい。 本発明のイミド基含有芳香族ポリアミンは前述
した芳香族テトラカルボン酸成分、0−アルキル
置換アニリン−ホルムアルデヒド縮合物、他の芳
香族ジアミンの3成分を溶媒中で反応させること
により製造することができる。溶媒としては、
N,N−ジメチルホルムアミド、N,N−ジメチ
ルアセトアミド、N−メチル−2−ピロリドン等
のアミド系の溶媒の他m−クレゾール等のフエノ
ール類、ジメチルスルホキシド等が用いられる。
これら溶媒中で所定量の3成分を加熱、又は必要
に応じて、3級アミン等のイミド化触媒の存在下
反応することにより容易にイミド基含有芳香族ポ
リアミンを製造することができる。 これら3成分の割合は目的に応じて適宜決定さ
れるが、芳香族ジアミンのモル数の総和が、芳香
族テトラカルボン酸のモル数よりも大きいことが
必要である。通常(芳香族ジアミンのモル数の
和)/(芳香族テトラカルボン酸のモル数)の比
は(n+1)/nと表わすことが出来るが、nの
値は1〜10の範囲が好ましい。又2種の芳香族ジ
アミンの割合も目的に応じて種々変更し得る。溶
解性をより向上さすには0−アルキル置換アニリ
ン−ホルムアルデヒト縮合物を多く用いることに
よりその目的を達成し得る。ここで重要なのは2
種の芳香族ジアミンの割合よりもむしろ反応順序
が重要である。芳香族アミンによるエポキシ樹脂
の硬化の場合、アミンの種類により、反応性、硬
化樹脂の耐熱性に差のあることが知られている。
そこで目的とするエポキシ樹脂の反応性、物性を
考慮して芳香族ジアミンを決定し、これが末端の
アミノ基を形成するように反応を行うべきであ
る。即ち、芳香族テトラカルボン酸と少量の0−
アルキル置換アニリン−ホルムアルデヒド縮合物
を反応させ、次いで過剰量のもう一方の芳香族ジ
アミンを反応させるべきである。当然のことなが
ら、目的によつては0−アルキル置換アニリン−
ホルムアルデヒド縮合物が末端に来ることもある
し、両者がランダムに末端に来ることもあり得
る。 本発明のイミド基含有芳香族ポリアミンは、製
造時に使用され得るアミド系溶媒の他にテトラヒ
ドロフラン、ジオキサン等のエーテル類に溶解
し、エポキシ化合物との混合が溶液中で容易に行
える。これら溶液には目的に応じて種々の添加
剤、補強剤、たとえば炭素粉末、各種金属、金属
酸化物、シリカ、アスベスト等の混入が容易であ
る。特にガラス繊維、アラミド繊維、カーボン繊
維、アルミナ繊維、シリコンカーバイド繊維等の
補強繊維への含浸が容易であり、用途として耐熱
性の良好な繊維強化複合材料の製造に好適であ
る。更に耐熱性の良好な、接着剤、被覆材、成形
物等にも利用可能である。 〔実施例〕 以下、実施例によつてイミド基含有芳香族ポリ
アミド及びその製造方法を具体的に示すが、特許
請求の範囲を超えない限りこれに限定されるもの
ではない。 実施例 1 0−エチルアニリン−ホルムアルデヒド縮合物
(日本化薬社製“カヤハードA−A”)を減圧蒸溜
して得た3,3′−ジエチル−4,4′ジアミノジフ
エニルメタン(bp242℃/6mmHg)12.8gをN−
メチル−2−ピロリドン(以下NMPと略す)50
mlに溶解し、これを3,3′,4,4′−ベンゾフエ
ノンテトラカルボン酸二無水物(以下BTDAと
略す)32.5gのNMP100ml溶液に約30分間で滴下
した。次いで生成したアミド酸溶液を、4,4′−
ジアミノジフエニルスルホン(以下4,4′−DDS
と略す)25.0gのNMP100ml溶液に約30分で滴下
した。室温で3時間撹拌、一夜放置後200℃に昇
温し、生成する水をNMPと共に留去させながら
4時間イミド化反応を行つた。冷却後生成物均一
溶液を大量のメタノールにそそぎ、イミド基含有
芳香族ポリアミンを析出させた。別後メタノー
ルにて洗浄を行い100℃にて50時間真空乾燥を行
つた。収率は95%であつた。得られたイミド基含
有芳香族ポリアミンの赤外線吸収スペクトルを第
1図に示す。1級アミノ基に起因する3480、3380
cm-1、イミド基に起因する1780、720cm-1の吸収
があきらかである。又得られたイミド基含有芳香
族ポリアミンは、N,N′−ジメチルホルムアミ
ド(以下DMFと略す)に少なくとも30重量%の
濃度で溶解した。 実施例 2 3,3′−ジエチル−4,4′−ジアミノジフエニ
ルメタン30.0g、BTDA76.0g、4,4′−DDSに
替えて3,3′−ジアミノジフエニルスルホン(以
下3,3,′−DDSと略す)58.6gを使用し、実
施例1とほぼ同様の操作でイミド基含有芳香族ポ
リアミンを製造した。収率は94%であつた。得ら
れた生成物の赤外線吸収スペクトルを第2図に示
す。実施例1で得られた第1図と同様に1級アミ
ノ基、イミド基の存在が明らかである。又得られ
たイミド基含有芳香族ポリアミンはDMF、テト
ラヒドロフラン(以下THFと略す)に少なくと
も30重量%の濃度で溶解した。 比較例 1 BTDA5.2g、4,4′−DDS8.0gを使用し、実
施例1とほぼ同様の操作でイミド基含有芳香族ポ
リアミンを製造した。 両成分混合によるアミド酸の生成、加熱による
イミド基の生成が赤外線吸収スペクトルで確認で
きた。得られた生成物を30重量%の濃度でDMF
に溶解したところ微粉不溶分があり、均一溶液が
得られなかつた。 比較例 2 BTDA4.3g、3,3′−DDS6.6gを使用して実
施例1ほぼ同様の操作でイミド基含有芳香族ポリ
アミンを製造した。両成分混合によるアミド酸の
生成、加熱によるイミド基の生成が赤外線吸収ス
ペクトルで確認できた。得られた生成物を30重量
%の濃度でDMF、THFに溶解したところ、
DMFには完全に溶解し均一溶液が得られたが、
THFには溶解しなかつた。 参考例1、2 実施例1、2で得られたイミド基含有芳香族ポ
リアミン100重量部、アミンエポキシ化合物(チ
バガイギー社製アラルダイト”MY−720”)100
重量部をそれぞれDMF、THFに25重量%の濃度
に溶解し、炭素繊維(東レ社製“トレカ T−
400”)に含浸、乾燥してプリプレグを製造した。
得られたプリプレグを10枚積層して加圧下、180
℃4時間硬化反応を行い、更に220℃24時間後硬
化を行つた。得られた硬化物のガラス転移温度
(TMA法)はそれぞれ220℃、210℃であつた。
又200℃に於ける曲げ強度はそれぞれ140Kg/mm2
(Vf=63%)、150Kg/mm2(Vf=65%)であつた。 〔発明の効果〕 本発明により得られるイミド基含有芳香族ポリ
アミンは溶解性に優れ、エポキシ樹脂溶液の製造
が容易であり、種々の用途に使用し耐熱エポキシ
樹脂硬化物を得ることが出来る。又溶解性が向上
し、低沸点溶媒に溶解するものは、溶媒の除去が
簡単な操作で行われ、容易に樹脂本来の耐熱性を
発揮することが出来る。
The present invention will be explained in detail below. First, the imide group-containing aromatic polyamine according to the present invention can be obtained, for example, by the following method. That is, aromatic tetracarboxylic acid or its derivative and at least 0-alkyl substituted aniline-
It can be produced by reacting an excess amount of two or more aromatic diamines containing a formaldehyde condensate. Furthermore, the heat resistance of the cured epoxy resin product is improved by reacting a small amount of the 0-alkyl-substituted aniline-formaldehyde condensate with an aromatic tetracarboxylic acid or its derivative, and then reacting with an excess amount of other aromatic diamine. An imide group-containing aromatic polyamine having an aromatic diamine component at the end can be produced. Aromatic tetracarboxylic acids that are a component of the present invention include pyromellitic acid, 3,3',4,4'-benzophenonetetracarboxylic acid, 3,3',4,4'-
Diphenyl ether tetracarboxylic acid, 3,3',
4,4'-biphenyltetracarboxylic acid, 2,3,
6,7-naphthalenetetracarboxylic acid, 2,3,
4,5-thiophenetetracarboxylic acid, 2,2-
Bis(3,4-dicarboxyphenyl)propane and the like and one or more of these isomers are used. These aromatic tetracarboxylic acid components can be used in the form of derivatives such as lower alkyl esters and dianhydrides, but from the viewpoint of reactivity, it is preferable to use dianhydrides. At least one type of 0-alkyl-substituted aniline-formaldehyde condensate is used as the two or more types of aromatic diamines that are one component of the present invention.
This alkyl group has 1 to 4 carbon atoms, preferably an ethyl group. For example, 0-ethylaniline-formaldehyde condensate is
31961, in an aqueous medium, hydrochloric acid,
It is obtained by the reaction of 0-alkylaniline and formaldehyde at 60 to 100°C in the presence of a strong inorganic acid such as sulfuric acid. This reaction produces by-products such as triamine and tetramine in addition to 3,3'-diethyl-4,4'-diaminodiphenylmethane, which is a diamine component. Although the diamine component can be easily obtained by separating these by distillation, it is also possible to use these by-products in the present invention without separating them. However, if the amount of polyamine greater than triamine increases, gelation tends to occur during production of the imide group-containing aromatic polyamine, so the polyamine is preferably 70% by weight or less. Also, by adding aniline during the condensation reaction of 0-ethylaniline, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3
-ethyl-4,4'-diaminodiphenylmethane,
A mixture consisting mainly of three components of 4,4'-diaminophenylmethane is obtained, which can also be effectively used in the present invention. 0-toluidine instead of aniline,
A condensate of 0-ethylaniline to which an aniline derivative without a substituent at the p-position, such as 0-chloroaniline, is added can also be used. Aromatic diamines other than the 0-alkyl-substituted aniline-formaldehyde condensate, which is a component of the present invention, have the formula H 2 N-R-NH 2 (where R is a divalent linkage having up to 30 carbon atoms). As a base-
It is a divalent aromatic group bonded by SO 2 -. ) is used. One or more of these aromatic diamines may be used, but 4,4'-diaminodiphenylsulfone and 3,3'-diaminodiphenylsulfone are preferred in view of the heat resistance of the cured epoxy resin. The imide group-containing aromatic polyamine of the present invention can be produced by reacting the above-mentioned aromatic tetracarboxylic acid component, 0-alkyl-substituted aniline-formaldehyde condensate, and other aromatic diamine in a solvent. . As a solvent,
In addition to amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone, phenols such as m-cresol, dimethyl sulfoxide, and the like are used.
An imide group-containing aromatic polyamine can be easily produced by heating predetermined amounts of the three components in these solvents or, if necessary, reacting them in the presence of an imidization catalyst such as a tertiary amine. Although the ratio of these three components is appropriately determined depending on the purpose, it is necessary that the total number of moles of aromatic diamine is larger than the number of moles of aromatic tetracarboxylic acid. Usually, the ratio (sum of moles of aromatic diamine)/(number of moles of aromatic tetracarboxylic acid) can be expressed as (n+1)/n, and the value of n is preferably in the range of 1 to 10. Furthermore, the ratio of the two types of aromatic diamines can be varied depending on the purpose. In order to further improve the solubility, this objective can be achieved by using a large amount of the 0-alkyl-substituted aniline-formaldehyde condensate. The important thing here is 2
The reaction order rather than the proportion of aromatic diamines in the species is important. When curing epoxy resins with aromatic amines, it is known that there are differences in reactivity and heat resistance of the cured resin depending on the type of amine.
Therefore, the aromatic diamine should be determined in consideration of the reactivity and physical properties of the target epoxy resin, and the reaction should be conducted so that the aromatic diamine forms the terminal amino group. That is, an aromatic tetracarboxylic acid and a small amount of 0-
The alkyl-substituted aniline-formaldehyde condensate should be reacted, followed by an excess of the other aromatic diamine. Naturally, depending on the purpose, 0-alkyl-substituted aniline-
The formaldehyde condensate may come to the end, or both may come to the end randomly. The imide group-containing aromatic polyamine of the present invention is dissolved in ethers such as tetrahydrofuran and dioxane in addition to amide solvents that can be used during production, and can be easily mixed with an epoxy compound in solution. Various additives and reinforcing agents such as carbon powder, various metals, metal oxides, silica, asbestos, etc. can be easily mixed into these solutions depending on the purpose. In particular, it is easy to impregnate reinforcing fibers such as glass fibers, aramid fibers, carbon fibers, alumina fibers, and silicon carbide fibers, and is suitable for use in producing fiber-reinforced composite materials with good heat resistance. Furthermore, it can be used for adhesives, coating materials, molded products, etc., which have good heat resistance. [Example] Hereinafter, an imide group-containing aromatic polyamide and a method for producing the same will be specifically shown in Examples, but the invention is not limited thereto unless it exceeds the scope of the claims. Example 1 3,3'-diethyl-4,4'diaminodiphenylmethane (bp242℃/ 6mmHg) 12.8g to N-
Methyl-2-pyrrolidone (hereinafter abbreviated as NMP) 50
This was added dropwise over about 30 minutes to a solution of 32.5 g of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (hereinafter abbreviated as BTDA) in 100 ml of NMP. Next, the generated amic acid solution was converted into 4,4′-
Diaminodiphenylsulfone (hereinafter referred to as 4,4'-DDS)
) was added dropwise to a 100 ml solution of 25.0 g of NMP over about 30 minutes. The mixture was stirred at room temperature for 3 hours, left overnight, and then heated to 200°C, and the imidization reaction was carried out for 4 hours while distilling off the produced water together with NMP. After cooling, the product homogeneous solution was poured into a large amount of methanol to precipitate an imide group-containing aromatic polyamine. After separation, it was washed with methanol and vacuum dried at 100°C for 50 hours. The yield was 95%. The infrared absorption spectrum of the obtained imide group-containing aromatic polyamine is shown in FIG. 3480, 3380 due to primary amino group
cm -1 , absorptions at 1780 and 720 cm -1 due to imide groups are obvious. Further, the obtained imide group-containing aromatic polyamine was dissolved in N,N'-dimethylformamide (hereinafter abbreviated as DMF) at a concentration of at least 30% by weight. Example 2 30.0 g of 3,3'-diethyl-4,4'-diaminodiphenylmethane, 76.0 g of BTDA, and 3,3'-diaminodiphenyl sulfone (hereinafter referred to as 3,3, An imide group-containing aromatic polyamine was produced in substantially the same manner as in Example 1 using 58.6 g of the compound (abbreviated as '-DDS). The yield was 94%. The infrared absorption spectrum of the obtained product is shown in FIG. Similar to FIG. 1 obtained in Example 1, the presence of primary amino groups and imide groups is clear. Further, the obtained imide group-containing aromatic polyamine was dissolved in DMF and tetrahydrofuran (hereinafter abbreviated as THF) at a concentration of at least 30% by weight. Comparative Example 1 An imide group-containing aromatic polyamine was produced in substantially the same manner as in Example 1 using 5.2 g of BTDA and 8.0 g of 4,4'-DDS. The formation of amic acid by mixing both components and the formation of imide groups by heating were confirmed in the infrared absorption spectrum. The resulting product was added to DMF at a concentration of 30% by weight.
When the solution was dissolved in the solution, a homogeneous solution could not be obtained due to the presence of fine insoluble matter. Comparative Example 2 An imide group-containing aromatic polyamine was produced in substantially the same manner as in Example 1 using 4.3 g of BTDA and 6.6 g of 3,3'-DDS. The formation of amic acid by mixing both components and the formation of imide groups by heating were confirmed in the infrared absorption spectrum. When the obtained product was dissolved in DMF and THF at a concentration of 30% by weight,
Although it was completely dissolved in DMF and a homogeneous solution was obtained,
It did not dissolve in THF. Reference Examples 1 and 2 100 parts by weight of the imide group-containing aromatic polyamine obtained in Examples 1 and 2, 100 parts by weight of amine epoxy compound (Araldite "MY-720" manufactured by Ciba Geigy)
The weight parts were dissolved in DMF and THF to a concentration of 25% by weight, respectively, and carbon fibers (Toray Industries, Inc. "Trading Card T-
400”) and dried to produce prepreg.
10 sheets of the obtained prepreg were laminated and heated under pressure at 180°C.
A curing reaction was carried out at 4 hours at 220° C., followed by post-curing at 220° C. for 24 hours. The glass transition temperatures (TMA method) of the obtained cured products were 220°C and 210°C, respectively.
Also, the bending strength at 200℃ is 140Kg/mm 2
(Vf=63%) and 150Kg/mm 2 (Vf=65%). [Effects of the Invention] The imide group-containing aromatic polyamine obtained by the present invention has excellent solubility, and epoxy resin solutions can be easily produced, and can be used for various purposes to obtain heat-resistant epoxy resin cured products. In addition, when the solubility is improved and the resin is soluble in a low boiling point solvent, the solvent can be removed by a simple operation, and the inherent heat resistance of the resin can be easily exhibited.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は、それぞれ実施例1及び2
で得られたイミド基含有芳香族ポリアミンの赤外
線吸収スペクトルを示す。1級アミノ基に起因す
る3480、3380cm-1及びイミドに起因する1780、
720cm-1の吸収が明らかである。
Figures 1 and 2 show Examples 1 and 2, respectively.
The infrared absorption spectrum of the imide group-containing aromatic polyamine obtained in the above is shown. 3480, 3380cm -1 due to primary amino group and 1780 due to imide,
Absorption of 720 cm -1 is obvious.

Claims (1)

【特許請求の範囲】 1 一般式 〔Xは芳香族炭化水素環を含む4価の芳香族テト
ラカルボン酸残基であり、同一の窒素原子に結合
する2個のカルボニル基は、夫々前記Xに含まれ
る芳香族炭化水素環の互いに隣接する炭素原子に
結合し、Y1は 【式】(R1,R2は水素原 子またはアルキル基であり、少なくとも一方がア
ルキル基)で表わされる芳香族ジアミン残基であ
り、 Y2は30個までの炭素原子を有し且つ2個の連
結基として−SO2−によつて結合された2個の芳
香族炭化水素環を含む2価の芳香族ジアミン残基
であり、mは1以上の整数を表す。〕 で示されるイミド基含有芳香族ポリアミン。 2 芳香族テトラカルボン酸又はその誘導体と、
これと過剰量の芳香族ジアミンとを反応させてイ
ミド基含有芳香族ポリアミンを製造する方法にお
いて、まず芳香族テトラカルボン酸又はその誘導
体とこれと等モル未満のH2N−Y1−NH2 〔Y1は【式】R2は 水素原子またはアルキル基であり、少なくとも一
方がアルキル基)〕で表される芳香族ジアミンと
を反応させ、 次いで、これにH2N−Y2−NH2(Y2は30個ま
での炭素原子を有し且つ2価の連結基として−
SO2−によつて結合された2個の芳香族炭化水素
環を含む2価の芳香族炭化水素基である)で表さ
れる芳香族ジアミンを反応させること、及び、上
記芳香族ジアミンのモル数の総和を芳香族テトラ
カルボン酸又はその誘導体のモル数を越える量と
することを特徴とする、下記の一般式で表される
イミド基含有芳香族ポリアミンの製造方法。 〔Xは芳香族炭化水素環を含む4価の芳香族テト
ラカルボン酸残基であり、同一の窒素原子に結合
する2個のカルボニル基は、夫々前記Xに含まれ
る芳香族炭化水素環の互いに隣接する炭素原子に
結合し、Y1は 【式】(R1,R2は水素原 子またはアルキル基であり、少なくとも一方がア
ルキル基)で表わされる芳香族ジアミン残基であ
り、 Y2は30個までの炭素原子を有し且つ2個の連
結基として−SO2−によつて結合された2個の芳
香族炭化水素環を含む2価の芳香族ジアミン残基
であり、mは1以上の整数を表す。〕
[Claims] 1. General formula [X is a tetravalent aromatic tetracarboxylic acid residue containing an aromatic hydrocarbon ring, and the two carbonyl groups bonded to the same nitrogen atom are bonded to each other of the aromatic hydrocarbon rings contained in said X. Bonded to adjacent carbon atoms, Y 1 is an aromatic diamine residue represented by the formula (R 1 and R 2 are hydrogen atoms or alkyl groups, and at least one is an alkyl group), and Y 2 is 30 is a divalent aromatic diamine residue containing up to 1 carbon atoms and two aromatic hydrocarbon rings bonded by -SO 2 - as two linking groups, and m is 1 or more. represents an integer. ] An imide group-containing aromatic polyamine represented by: 2 aromatic tetracarboxylic acid or its derivative;
In a method for producing an imide group-containing aromatic polyamine by reacting this with an excess amount of aromatic diamine, first, an aromatic tetracarboxylic acid or a derivative thereof and less than the equimolar amount of H 2 N-Y 1 -NH 2 [Y 1 is [Formula] R 2 is a hydrogen atom or an alkyl group, and at least one of them is an alkyl group)] is reacted with an aromatic diamine, and then this is reacted with H 2 N−Y 2 −NH 2 (Y 2 has up to 30 carbon atoms and as a divalent linking group -
reacting an aromatic diamine represented by (which is a divalent aromatic hydrocarbon group containing two aromatic hydrocarbon rings bonded by SO 2 -), and A method for producing an imide group-containing aromatic polyamine represented by the following general formula, characterized in that the sum of the numbers exceeds the number of moles of the aromatic tetracarboxylic acid or its derivative. [X is a tetravalent aromatic tetracarboxylic acid residue containing an aromatic hydrocarbon ring, and the two carbonyl groups bonded to the same nitrogen atom are bonded to each other of the aromatic hydrocarbon rings contained in said X. Bonded to adjacent carbon atoms, Y 1 is an aromatic diamine residue represented by the formula (R 1 and R 2 are hydrogen atoms or alkyl groups, and at least one is an alkyl group), and Y 2 is 30 is a divalent aromatic diamine residue containing up to 1 carbon atoms and two aromatic hydrocarbon rings bonded by -SO 2 - as two linking groups, and m is 1 or more. represents an integer. ]
JP60063426A 1985-03-29 1985-03-29 Imide group-containing aromatic polyamine and its production Granted JPS61225164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60063426A JPS61225164A (en) 1985-03-29 1985-03-29 Imide group-containing aromatic polyamine and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60063426A JPS61225164A (en) 1985-03-29 1985-03-29 Imide group-containing aromatic polyamine and its production

Publications (2)

Publication Number Publication Date
JPS61225164A JPS61225164A (en) 1986-10-06
JPH0511111B2 true JPH0511111B2 (en) 1993-02-12

Family

ID=13228946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60063426A Granted JPS61225164A (en) 1985-03-29 1985-03-29 Imide group-containing aromatic polyamine and its production

Country Status (1)

Country Link
JP (1) JPS61225164A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032821A (en) * 1983-08-04 1985-02-20 Agency Of Ind Science & Technol Curable resin composition

Also Published As

Publication number Publication date
JPS61225164A (en) 1986-10-06

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