JPH0511183U - Plasma display device - Google Patents

Abstract

(57) [Summary] [Structure] Plasma display panel 5 with double-sided tape 4
It is characterized in that both ends of the frame 3 fixed by are folded back in a U shape, and the upper portion of the U shape and the row side driver 9 of the row side driver FPC board 7 are brought into plane contact. [Effect] The heat generated by the driver can be efficiently absorbed by the frame.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a plasma display device, and more particularly to a heat dissipation structure for a driver.

[0002]

[Prior Art]

 In recent years, plasma display devices using an FPC for connecting a panel and a driver substrate have come to be produced due to easiness of handling and improvement in reliability of connection technology. 3 and 4 are views showing an example using this FPC board. The plasma display panel 5 generally has a structure in which two glass plates are bonded together, and the electrode pad 10 formed by the thick film or thin film technology is present on the inner surface of each of the two glass plates. . As shown in FIG. 3, the column side driver FPC board 6 and the row side driver FPC board 7 are connected to the electrode pads 10 of each glass plate of this panel by thermocompression bonding or the like. After that, the frame is fixed to the panel, and the FPC boards 6 and 7 on the row and column sides are folded back inside the panel as shown in FIG. 4 and fixed by double-sided tape and screwing. At this time, the row side driver 9 is present on the panel side.

The reason for this is explained as follows. FIG. 5 shows a sectional view of the FPC board. In the FPC technology itself, it is possible to draw the conductive patterns 13 on both sides of the FPC base 14, but generally the conductive pattern 13 is provided on only one side for further cost reduction. For this reason, as shown in FIG. 3, since the row side driver 9 is attached to the upper side of the row side FPC board 7, when it is folded back, it becomes a shape facing the panel side.

[0004]

[Problems to be solved by the device]

 As described above, according to the conventional example, the component side of the row-side driver FPC board faces the panel side, but this causes the heat generated by the driver to stay in the device and hinder the heat radiation.

[0005]

[Means for Solving the Problems]

 The present invention is a plasma display having a panel, a row side driver FPC board for generating a drive voltage applied to the panel, a column side driver FPC board, a control board for controlling these, and a frame for fixing each board. The device is characterized in that the end on the row side or the column side of the frame is folded back inward in a U-shape, and the upper part of the U-shape and the driver package on the FPC board are in planar contact.

[0006]

【Example】

 Next, the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention. However, in FIG. 1, the column side driver FPC board and a part of the frame are omitted. The frame 3 is fixed to the panel 5 with double-sided tape 4. As shown in FIG. 2, the frame 3 has both ends folded back in a U-shape. As shown in FIG. 1, the row-side driver FPC board 7 is fixed to a M3 post 1 provided on a frame 3 with a nut 2. As a result, the upper surface of the row side driver 9 soldered to the FPC board 7 is pressed against the folded portion of the frame 3. Therefore, it is possible to solve the problem that the heat generated by the driver 9 is absorbed by the frame 3 and the heat is accumulated.

When the row-side driver 9 is a monolithic IC, the thermal resistance value is about the thermal resistance R _jc = 15 ° C./W between the driver chip and the case, and the thermal resistance R _ca = 85 ° C./W between the case and the atmosphere. is there. The power consumed by the row-side driver 9 depends on the drive waveform and voltage, but if the power consumption is 0.2 W per unit, the estimated temperature of the driver chip when the ambient temperature is 50 ° C is (15 + 85) × 0. 0.2 + 50 = 70 ° C.

On the other hand, the thermal resistance value (Rf) of the frame 3 itself according to the present invention is about 3 ° C./W when the aluminum plate is 450 cm ² though it depends on its material and area. When this value is added to the contact thermal resistance with the driver package (R _CF ) 5 ° C / W, and the incremental value of thermal resistance (R _I ) 50 ° C / W to be suppressed by the panel / each substrate is 58 ° C. / W.

The relationship between the above thermal resistances is as shown in FIG. 6, and the total thermal resistance value seen from the driver chip is (58 × 85) / (58 + 85) + 15 = 49 ° C./W. When the ambient temperature is 50 ° C. and the power consumption is 0.2 W, the estimated temperature of the driver chip is 49 × 0.2 + 50 = 60 ° C., which can be lowered by 10 ° C.

[0010]

[Effect of the device]

 As described above, according to the present invention, in the plasma display device, the end of the frame on the row side or the column side is folded back inwardly in a U shape, and the upper portion of the U shape and the driver package on the FPC board are flat. By bringing them into contact, the heat generated by the driver can be efficiently absorbed by the frame.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a perspective view of a frame used in the present invention.

FIG. 3 is a diagram showing how an FPC board is attached to a panel.

FIG. 4 is a diagram illustrating a structure of a plasma display device using an FPC board.

FIG. 5 is a diagram illustrating a structure of a single-sided FPC board.

FIG. 6 is a diagram showing a relationship of thermal resistance values.

[Explanation of symbols]

 1 M3 post 2 Nut 3 Frame 4 Double-sided tape 5 Plasma display panel 6 Row side driver FPC board 7 Row side driver FPC board 8 Row side driver 9 Row side driver 10 Electrode pad 11 Control board 12 Jumper lead 13 Conductive pattern 14 FPC base 15 Reinforcing plate 16 Conductive protective layer

Claims (1)

[Claims for utility model registration] 1. A panel, a row side driver FPC board for generating a driving voltage applied to the panel, and a column side driver F.
In a plasma display device having a PC board, a control board for controlling these, and a frame for fixing each board, the row-side or column-side end of the frame is folded back in a U-shape, A plasma display device characterized in that the upper part of the character and the driver package on the FPC board are in planar contact.