JPH0511423B2 - - Google Patents
Info
- Publication number
- JPH0511423B2 JPH0511423B2 JP60165179A JP16517985A JPH0511423B2 JP H0511423 B2 JPH0511423 B2 JP H0511423B2 JP 60165179 A JP60165179 A JP 60165179A JP 16517985 A JP16517985 A JP 16517985A JP H0511423 B2 JPH0511423 B2 JP H0511423B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- integrated circuit
- hybrid integrated
- holding substrate
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は混成集積回路装置に関し、特に搭載半
導体装置の交換が可能な混成集積回路装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which mounted semiconductor devices can be replaced.
現在、搭載部品の交換を可能にした混成集積回
路装置のOEMからの要求は殆んどなく、特しゅ
な用途にのみ使用されている。構造的には、回路
構成が施されたキバンの裏面に接続電極を設け、
部品固定用枠を接着剤で接着したものである。
Currently, there are almost no requests from OEMs for hybrid integrated circuit devices that allow the replacement of installed components, and they are used only for special purposes. Structurally, a connection electrode is provided on the back side of the circuit configuration,
This is a component fixing frame that is glued together with adhesive.
〔発明が解決しようとする問題点〕
前記構造の問題点としては、下記の問題点があ
る。[Problems to be Solved by the Invention] Problems with the above structure include the following problems.
(1) 実使用時には、部品をキバン上電極に挿えて
いる為、部品固定枠とキバンの接着部に常に力
が加わつており、熱衝撃や機械的衝撃に比較的
敏感であり弱い。（ハガレにつながる。）
(2) 部品交換時にカバーを開閉するが、その時に
加わる機械的衝撃に弱い。（ハガレにつなが
る。）
以上述べた様な欠点があると同時に、キバンと
部品固定用枠の接着作業も接着剤のみの強度で、
実使用に耐えなければならない為、細かい管理が
必要とされ量産向ではない。(1) During actual use, since the parts are inserted into the electrodes on the back plate, force is constantly applied to the bond between the component fixing frame and the back cover, making it relatively sensitive and weak to thermal shock and mechanical shock. (This may lead to peeling.) (2) The cover is opened and closed when replacing parts, but it is susceptible to mechanical shocks applied at that time. (This may lead to peeling.) At the same time as there are the drawbacks mentioned above, the bonding work between the parts and the frame for fixing the parts is only possible with the adhesive.
Since it must withstand actual use, detailed management is required and it is not suitable for mass production.
本発明によれば、一方の表面に電気的接点及び
それらの電気的接点間を接続する回路パターンが
形成され、その回路パターンに接続された金属リ
ードが対向する少くとも二つの側面から突出して
形成されている保持基板と、端子がそれぞれそれ
らの接点に接するようにその保持基板上に選択的
に搭載された半導体装置と、それらの半導体装置
を覆うように形成されそれらの半導体装置をその
保持基板上に圧着する保持枠とを備えた混成集積
回路装置において、それらの金属リードをその保
持基板とそれらの半導体装置との圧着面に垂直な
方向へ延ばして形成するとともに、その保持枠に
連結してそれらの金属リードと同一方向に延びる
補助金具を備えたことを特徴とする混成集積回路
装置を得る。
According to the present invention, electrical contacts and a circuit pattern connecting the electrical contacts are formed on one surface, and metal leads connected to the circuit pattern are formed to protrude from at least two opposing sides. a holding substrate which is formed to cover the semiconductor devices; a semiconductor device which is selectively mounted on the holding substrate so that the terminals are in contact with their contacts; In a hybrid integrated circuit device equipped with a holding frame that is crimped onto the holding frame, the metal leads are formed by extending in a direction perpendicular to the crimping surface between the holding substrate and the semiconductor device, and are connected to the holding frame. The present invention provides a hybrid integrated circuit device characterized in that it is provided with an auxiliary metal fitting extending in the same direction as those metal leads.
実施例を、図面を参照して説明する。 Examples will be described with reference to the drawings.
第１図は本発明の一実施例の断面図である。 FIG. 1 is a sectional view of one embodiment of the present invention.
部品固定用枠１とキバン２ａは接着剤３で接着
されている。さらに部品固定枠１に補助金具５が
取付けられている。 The component fixing frame 1 and the bracket 2a are bonded together with an adhesive 3. Further, an auxiliary metal fitting 5 is attached to the component fixing frame 1.
第２図は本発明による混成集積回路装置をプリ
ントボード７に搭載した一実施例の断面図であ
る。部品固定用枠１１に取付けされた補助金具５
はリード端子２６と同様にプリントボード７には
んだで固定されている。 FIG. 2 is a sectional view of an embodiment in which a hybrid integrated circuit device according to the present invention is mounted on a printed board 7. Auxiliary metal fittings 5 attached to the component fixing frame 11
are fixed to the printed board 7 with solder like the lead terminals 26.
〔発明の効果〕
以上説明したように、本発明は、部品固定用枠
１に補助金具５を取付ける事により、枠１とキバ
ン２ａの接着を完全にするものである。[Effects of the Invention] As explained above, in the present invention, by attaching the auxiliary metal fitting 5 to the component fixing frame 1, the adhesion between the frame 1 and the hinge 2a is completed.
これにより接着部に加わる機械的及び熱的衝撃
は緩和され、前記問題点は解決されるものであ
る。 As a result, the mechanical and thermal shocks applied to the bonded portion are alleviated, and the above-mentioned problems are solved.
第１図は本発明による混成集積回路装置の断面
図。第２図は本発明による混成集積回路装置をプ
リントボードへ搭載した断面図である。
１……部品固定用枠、２ａ……回路構成された
キバン、２ｂ……リード端子、３……接着剤、４
……搭載部品、５……補助金具、６……カバー、
７……プリントボード。
FIG. 1 is a sectional view of a hybrid integrated circuit device according to the present invention. FIG. 2 is a sectional view of the hybrid integrated circuit device according to the present invention mounted on a printed board. 1... Frame for fixing components, 2a... Circuit-configured band, 2b... Lead terminal, 3... Adhesive, 4
... Mounted parts, 5 ... Auxiliary fittings, 6 ... Cover,
7...Print board.
Claims (1)
間を接続する回路パターンが形成され、前記回路
パターンに接続された金属リードが対向する少く
とも二つの側面から突出して形成されている保持
基板と、端子がそれぞれ前記接点に接するように
前記保持基板上に選択的に搭載された半導体装置
と、前記半導体装置を覆うように形成され前記半
導体装置を前記保持基板上に圧着する保持枠とを
備えた混成集積回路装置において、前記金属リー
ドを前記保持基板と前記半導体装置との圧着面に
垂直な方向へ延ばして形成するとともに、前記保
持枠に連結して前記金属リードと同一方向に延び
る補助金具を備えたことを特徴とする混成集積回
路装置。1. A holding substrate having electrical contacts and a circuit pattern connecting the electrical contacts formed on one surface thereof, and metal leads connected to the circuit pattern protruding from at least two opposing sides. , comprising a semiconductor device selectively mounted on the holding substrate so that terminals are in contact with the contacts, and a holding frame formed to cover the semiconductor device and press-bonding the semiconductor device onto the holding substrate. In the hybrid integrated circuit device, the metal lead is formed by extending in a direction perpendicular to a crimping surface between the holding substrate and the semiconductor device, and an auxiliary fitting is connected to the holding frame and extends in the same direction as the metal lead. A hybrid integrated circuit device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60165179A JPS6225436A (en) | 1985-07-25 | 1985-07-25 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60165179A JPS6225436A (en) | 1985-07-25 | 1985-07-25 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6225436A JPS6225436A (en) | 1987-02-03 |
| JPH0511423B2 true JPH0511423B2 (en) | 1993-02-15 |
Family
ID=15807349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60165179A Granted JPS6225436A (en) | 1985-07-25 | 1985-07-25 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225436A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135962U (en) * | 1982-03-09 | 1983-09-13 | 松下電器産業株式会社 | Hybrid integrated circuit unit |
-
1985
- 1985-07-25 JP JP60165179A patent/JPS6225436A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225436A (en) | 1987-02-03 |
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