JPH051208A - Liquid epoxy resin molding material - Google Patents

Abstract

PURPOSE:To obtain a liquid epoxy resin molding material excellent in sealing workability and in the property of not causing substrate warpage, by incorporating silica fillers each having a specific particle diameter into a liquid epoxy resin composition. CONSTITUTION:The objective material comprises a liquid epoxy resin composition (consisting of, e.g. a liquid epoxy resin, a hardener, a curing accelerator, a modifier, etc.) and silica fillers having particle diameters of 0.5-3mum, 4-7mum, 10-20mum, and 22-30mum, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to electric parts, electronic parts,
The present invention relates to a liquid epoxy resin molding material for sealing semiconductor chips and the like.

[0002]

2. Description of the Related Art In recent years, functionalization of electric equipment and electronic equipment,
Along with the miniaturization and weight reduction, semiconductor devices have also become multi-pin and highly integrated. In particular, a COB package in which a bare chip is directly mounted on a substrate may encapsulate a very large chip or a plurality of chips at once, and the encapsulation area tends to increase. However, the mounting board is thinner because of its thinness and cost reduction. Moreover, with the expansion of surface mounting, it is exposed to severe heat treatment such as solder reflow. For this reason, there is a drawback that the substrate warps frequently, and as a countermeasure, if the amount of the filler is increased, the viscosity becomes high and the sealing workability is deteriorated.

[0003]

As described in the prior art, the conventional liquid epoxy resin molding material cannot achieve both sealing workability and substrate warpage. The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a liquid epoxy resin molding material having excellent sealing workability and substrate warpage.

[0004]

The present invention has a particle size of 0.5 to 3
Micron, 4-7 microns, 10-20 microns, 22
Since the liquid epoxy resin molding material is characterized by containing ˜30 μm silica, the above object can be achieved, and the present invention will be described in detail below.

The epoxy resin used in the present invention is 1
If it is a curable epoxy resin having two or more epoxy groups in the molecule, bisphenol A type epoxy resin, novolac type epoxy resin, flexible epoxy resin,
It may be any of halogenated epoxy resin, glycidyl ester type epoxy resin, polymer type epoxy resin and the like, and is not particularly limited. As the cross-linking agent, a phenol resin, a melamine resin, an acrylic resin, a urea resin, an isocyanate or the like is used, and it is not particularly limited. As the curing agent, an aliphatic polyamine, a polyamide resin, an amine-based curing agent such as an aromatic diamine, an acid anhydride curing agent, a Lewis acid complex compound and the like are used and are not particularly limited. As the curing accelerator, imidazole-based, phosphorus-based, tertiary amine-based curing accelerators and the like can be used and are not particularly limited.
As a modifier, silicone oil, reactive silicone gel,
Reactive diluents, defoamers, colorants and the like are used. The epoxy resin, the cross-linking agent, the curing agent, the curing accelerator, and the modifier may be liquid or solid, but a mixture of these is required to be liquid. Talc as a filler,
Inorganic powder fillers such as clay, silica, calcium carbonate and aluminum hydroxide, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers are used alone or in combination, but at least particles Diameter 0.5-3 microns, 4-7 microns, 10-20
It is necessary to include micron, 22-30 micron silica. That is, by setting the silica particle size within the above range, the closest packing property can be obtained while maintaining the sealing workability, and a high filler can be achieved. If necessary, the surface of the filler can be surface-treated with a coupling agent. Thus, the above materials are mixed and kneaded,
Further, if necessary, defoaming is performed to obtain a liquid epoxy resin molding material. For molding the molding material, casting,
Injection, dipping, coating, etc. are used.

The present invention will be described below based on examples.

[0007]

Examples 1 to 3 and Comparative Examples 1 and 2 Materials were blended, mixed, kneaded and defoamed based on the blending table in Table 1 to obtain liquid epoxy resin molding materials. Spherical silica is used as silica, and silica having a particle size of 1 indicates silica having a particle size of 1 micron. Next, the liquid epoxy resin molding material was used to seal-mold a COB chip at 160 ° C. for 120 minutes. The epoxy resin was a bisphenol type epoxy resin having a viscosity of 5000 CPS, the acid anhydride curing agent was methylhexahydrophthalic anhydride, the curing accelerator was imidazole, the silicone oil was a viscosity of 190 CPS, and the organopolysiloxane having an epoxy equivalent of 600 was used.

The performances of the liquid epoxy resin molding materials of Examples 1 to 3 and Comparative Examples 1 and 2 are shown in Table 2. The viscosity is at 25 ° C., the thixotropy is the ratio of the 5 rpm viscosity and the 50 rpm viscosity of the B type rotational viscometer at 25 ° C., and the warpage amount is 10 × 30 × 1 mm on a glass epoxy substrate having a thickness of 0.5 mm. The amount of substrate warp after resin sealing and heat curing. Void generation is a void generated when the seal is cured. PC
T is a 2 × 3 mm chip with aluminum wiring having a line width of 5 μm, CO on a 0.5 mm thick glass epoxy substrate.
Time until the defect occurs at 121 ° C and 100% humidity after mounting B. For TCT, the same mounted product as PCT was treated at -65 ° C. for 30 minutes and then at 150 ° C. for 30 minutes as one cycle, and the number of cycles until the occurrence of defects was examined.

[0009]

[0010]

The present invention is constructed as described above.
The liquid epoxy resin molding material having the structure described in the claims has the effect of improving the substrate warp and sealing workability.

Claims (1)

Claims: 1. A liquid epoxy resin molding material containing silica having a particle size of 0.5 to 3 microns, 4 to 7 microns, 10 to 20 microns, and 22 to 30 microns. .