JPH05121908A - Microwave circuit - Google Patents

Microwave circuit

Info

Publication number
JPH05121908A
JPH05121908A JP3284552A JP28455291A JPH05121908A JP H05121908 A JPH05121908 A JP H05121908A JP 3284552 A JP3284552 A JP 3284552A JP 28455291 A JP28455291 A JP 28455291A JP H05121908 A JPH05121908 A JP H05121908A
Authority
JP
Japan
Prior art keywords
line
conductor
ground conductor
substrate
active element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3284552A
Other languages
Japanese (ja)
Other versions
JP3176667B2 (en
Inventor
Eiji Suematsu
英治 末松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP28455291A priority Critical patent/JP3176667B2/en
Publication of JPH05121908A publication Critical patent/JPH05121908A/en
Application granted granted Critical
Publication of JP3176667B2 publication Critical patent/JP3176667B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for

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  • Waveguides (AREA)
  • Waveguide Connection Structure (AREA)

Abstract

PURPOSE:To provide the microwave circuit connected to ground in an excellent ground even at a high frequency over 1GHz and to eliminate the effect of a parasitic line to an input and an output side of each lumped constant line and an active element forming the circuit. CONSTITUTION:Ground conductors 1a, 1b are extended in the vicinity of both sides of line conductors 6, 6,... interconnecting ground conductors 1a, 1b to each of lumped constant lines 4, 5 and an active element 10 from the surrounding part of a board 20. A strip shaped bridge conductor 11 is provided onto each line conductor 6 to connect ends of the ground conductors 1a, 1b toward the line conductor 6. Thus, a coplaner line 13 is formed to the input side and the output side of each of the lumped constant lines 4, 5 and the active element 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明はマイクロ波回路に関
し、より詳しくは、誘電体基板上にコプレーナ線路など
の分布定数線路、インダクタやキャパシタなどの集中定
数線路及びトランジスタなどの能動素子を設けて構成さ
れるマイクロ波回路に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit, and more specifically, it is constructed by providing a distributed constant line such as a coplanar line, a lumped constant line such as an inductor and a capacitor, and an active element such as a transistor on a dielectric substrate. Related to microwave circuits.

【0002】[0002]

【従来の技術】最近、誘電体基板(高比抵抗半導体基板)
上に、コプレーナ線路などの分布定数線路、インダクタ
やキャパシタなどの集中定数線路、トランジスタやダイ
オードなどの能動素子を混在させて構成したマイクロ波
回路が実用化されている。例えば、図4に示すように、
半導体基板120上に、コプレーナ線路103と、イン
ダクタ104およびキャパシタ105と、トランジスタ
110を設けたものがある。これらのコプレーナ線路1
03,インダクタ104およびキャパシタ105は入力
整合回路130、直列帰還回路140、および出力整合
回路150を構成している。基板表面の周辺部には接地
導体101が設けられている。この接地導体101は、
入力側,出力側のコプレーナ線路103,103の箇所で
2つの接地導体101a,101bに分割されている。コ
プレーナ線路103は、接地導体101a,101bと、
中心導体102と、この中心導体の上に設けられた帯状
のブリッジ導体111とで構成されている。また、イン
ダクタ104とキャパシタ105との接続部、インダク
タ104とインダクタ104との接続部、インダクタ1
04とトランジスタ110との接続部はそれぞれ直線状
の線路導体106によって接続されている。このマイク
ロ波回路は、安価で小型に構成でき、マイクロ波の増幅
等を行うことができる。
2. Description of the Related Art Recently, dielectric substrates (high resistivity semiconductor substrates)
A microwave circuit configured by mixing a distributed constant line such as a coplanar line, a lumped constant line such as an inductor and a capacitor, and an active element such as a transistor and a diode is put into practical use. For example, as shown in FIG.
There is one in which a coplanar line 103, an inductor 104, a capacitor 105, and a transistor 110 are provided on a semiconductor substrate 120. These coplanar lines 1
03, the inductor 104, and the capacitor 105 form an input matching circuit 130, a series feedback circuit 140, and an output matching circuit 150. A ground conductor 101 is provided on the periphery of the substrate surface. This ground conductor 101 is
It is divided into two ground conductors 101a and 101b at the input and output side coplanar lines 103 and 103. The coplanar line 103 includes the ground conductors 101a and 101b,
The center conductor 102 and the strip-shaped bridge conductor 111 provided on the center conductor 102 are included. In addition, a connection portion between the inductor 104 and the capacitor 105, a connection portion between the inductor 104 and the inductor 104, the inductor 1
04 and the transistor 110 are connected to each other by a linear line conductor 106. This microwave circuit can be constructed inexpensively and in a small size, and can perform microwave amplification and the like.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来のマイクロ波回路は、基板表面の接地導体101が、
接地導体101a,101bに二分割されている(三分割以
上となることもある)ため、1GHz以上の高周波では良
好な接地が困難であった。また、インダクタ104とキ
ャパシタ105との接続部、インダクタ104とインダ
クタ104との接続部、インダクタ104とトランジス
タ110との接続部がそれぞれ、単に直線状の線路導体
106によって接続されているため、浮遊した寄生線路
が付加されることになり、線路導体106の長さを無視
できないような周波数では良好な回路性能を得ることが
困難であった。
However, in the above-mentioned conventional microwave circuit, the ground conductor 101 on the substrate surface is
Since it is divided into two ground conductors 101a and 101b (may be divided into three or more), good grounding is difficult at a high frequency of 1 GHz or higher. In addition, since the connecting portion between the inductor 104 and the capacitor 105, the connecting portion between the inductor 104 and the inductor 104, and the connecting portion between the inductor 104 and the transistor 110 are simply connected by the linear line conductor 106, they float. Since a parasitic line is added, it is difficult to obtain good circuit performance at a frequency where the length of the line conductor 106 cannot be ignored.

【0004】そこで、この発明の目的は、1GHz以上
の高周波であっても良好な接地を行うことができ、しか
も各集中定数線路および能動素子の入力側,出力側で寄
生線路の影響を除去できるマイクロ波回路を提供するこ
とにある。
Therefore, an object of the present invention is to perform good grounding even at a high frequency of 1 GHz or higher, and to eliminate the influence of parasitic lines on the input side and output side of each lumped constant line and active element. It is to provide a microwave circuit.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、第1の発明は、誘電体基板の表面に直線状の線路導
体で接続された集中定数線路と能動素子とを有し、上記
集中定数線路および能動素子を一体として取り囲む接地
導体を上記基板表面の周辺部に設け、上記接地導体を分
割した隙間にコプレーナ線路を構成して回路全体の入
力,出力を行うようにしたマイクロ波回路において、上
記接地導体を基板周辺部から上記各線路導体の両側近傍
に延在させるとともに、上記各線路導体の上に帯状のブ
リッジ導体を設けて上記接地導体の線路導体側の端部を
互いに接続して、上記各集中定数線路および能動素子の
入力側,出力側にコプレーナ線路を構成したことを特徴
としている。
To achieve the above object, the first invention comprises a lumped constant line and an active element connected to the surface of a dielectric substrate by a linear line conductor, A microwave circuit in which a lumped constant line and a ground conductor integrally surrounding an active element are provided in the peripheral portion of the substrate surface, and a coplanar line is formed in the gap formed by dividing the ground conductor to perform input and output of the entire circuit. In, while extending the ground conductor from the peripheral portion of the substrate to the vicinity of both sides of each of the line conductors, a strip-shaped bridge conductor is provided on each of the line conductors to connect the end portions of the ground conductors on the line conductor side to each other. Then, a coplanar line is configured on the input side and the output side of each of the lumped constant lines and active elements.

【0006】また、第2の発明は、誘電体基板の表面に
直線状の線路導体で接続された集中定数線路と能動素子
とを有し、上記集中定数線路および能動素子を一体とし
て取り囲む接地導体を上記基板表面の周辺部に設け、上
記接地導体を分割した隙間にコプレーナ線路を構成して
回路全体の入力,出力を行うようにしたマイクロ波回路
において、上記基板の裏面側に接地導体を全面に設ける
とともに、この接地導体を上記基板を貫通するバイアホ
ールを通して上記基板表面側の接地導体と電気的に接続
して、上記線路導体と基板裏面側の接地導体とで上記各
集中定数線路および能動素子の入力側,出力側にストリ
ップ線路を構成したことを特徴としている。
A second aspect of the present invention is a ground conductor which has a lumped constant line and an active element connected to the surface of a dielectric substrate by a linear line conductor, and surrounds the lumped constant line and the active element as one body. In the microwave circuit in which a coplanar line is formed in a gap formed by dividing the ground conductor to perform input and output of the entire circuit, a ground conductor is entirely provided on the back side of the substrate. And electrically connecting this ground conductor to the ground conductor on the front surface side of the substrate through a via hole penetrating the board, and the lumped constant line and The feature is that strip lines are configured on the input side and the output side of the device.

【0007】[0007]

【作用】第1の発明のマイクロ波回路では、各集中定数
線路および能動素子の入力側,出力側にコプレーナ線路
が設けられ、各線路導体の両側に存する接地導体の端部
はブリッジ導体で互いに接続されている。したがって、
各線路導体の両側近傍で接地導体の電位が等しくなっ
て、IGHz以上の高周波であっても接地が良好に行わ
れる。しかも、上記コプレーナ線路によって、各集中定
数線路および能動素子の入力側,出力側の線路導体の特
性インピーダンスが定まって、寄生線路の影響が除去さ
れる。
In the microwave circuit of the first invention, coplanar lines are provided on the input side and the output side of each lumped constant line and active element, and the ends of the ground conductors existing on both sides of each line conductor are bridge conductors. It is connected. Therefore,
The potentials of the grounding conductors become equal in the vicinity of both sides of each line conductor, and good grounding is achieved even at high frequencies above IGHz. Moreover, the coplanar line determines the characteristic impedances of the lumped constant lines and the line conductors on the input side and the output side of the active element, thereby eliminating the influence of the parasitic line.

【0008】第2の発明のマイクロ波回路では、基板裏
面側に接地導体が全面に設けられ、この接地導体と各線
路導体とでストリップ線路が構成されている。したがっ
て、各線路導体および集中定数線路の伝搬モードはスト
リップ線路のモードとなって、IGHz以上の高周波で
あっても接地が良好に行われる。しかも、上記ストリッ
プ線路によって、各集中定数回路および能動素子の入力
側,出力側の線路導体の特性インピーダンスが定まっ
て、寄生線路の影響が除去される。
In the microwave circuit of the second invention, the ground conductor is provided on the entire back surface of the substrate, and the ground conductor and each line conductor constitute a strip line. Therefore, the propagation mode of each line conductor and the lumped constant line becomes a strip line mode, and grounding is performed well even at a high frequency of IGHz or higher. Moreover, the stripline determines the characteristic impedances of the lumped constant circuits and the line conductors on the input side and the output side of the active element, thereby eliminating the influence of the parasitic line.

【0009】[0009]

【実施例】以下、この発明のマイクロ回路を実施例によ
り詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The microcircuit of the present invention will be described in detail below with reference to embodiments.

【0010】図1は、第1の発明の一実施例のマイクロ
波回路の要部のレイアウトを示している。このマイクロ
波回路は、誘電体基板(高比抵抗半導体基板)20の表面
に、入力整合回路30と、能動素子としてのトランジス
タ10と、直列帰還回路40と、出力整合回路(または
段間整合回路。以下同様。)50を備えている。上記入
力整合回路30,直列帰還回路40,出力整合回路50
は、従来と同様に、集中定数線路としてのスパイラル状
のインダクタ4およびキャパシタ5と、分布定数線路と
してのコプレーナ線路3によって構成されている。イン
ダクタ4とキャパシタ5との接続部、インダクタ4とイ
ンダクタ4との接続部、インダクタ4とトランジスタ1
0との接続部には、それぞれ直線状の線路導体6が設け
られている。また、基板表面の周辺部には接地導体1が
設けられている。この接地導体1は、入力側,出力側の
コプレーナ線路3,3の箇所で2つの接地導体1a,1bに
分割されている。コプレーナ線路3は、接地導体1a,1
bと、中心導体2と、この中心導体2の上に設けられた
帯状のブリッジ導体11とで構成されている。接地導体
1a,1bは、基板周辺部から上記各線路導体6の両側近
傍に延在している。各線路導体6の上に帯状のブリッジ
導体11が設けられ、このブリッジ導体11によって、
上記接地導体1a,1bの線路導体6側の端部が互いに接
続されている。これにより、各素子4,5,10の入力
側,出力側の接続部にコプレーナ線路13が構成されて
いる。したがって、各線路導体6の両側近傍で接地導体
1a,1bの電位が等しくなって、IGHz以上の高周波で
あっても良好な接地を行うことができる。しかも、この
コプレーナ線路13によって、各素子4,5,10の入力
側,出力側の線路導体6の特性インピーダンスを定める
ことができ、寄生線路の影響を除去することができる。
したがって、所望とする性能の回路を容易に設計するこ
とができる。
FIG. 1 shows a layout of a main part of a microwave circuit according to an embodiment of the first invention. This microwave circuit has an input matching circuit 30, a transistor 10 as an active element, a series feedback circuit 40, an output matching circuit (or an interstage matching circuit) on the surface of a dielectric substrate (high specific resistance semiconductor substrate) 20. The same shall apply hereinafter.) 50. Input matching circuit 30, series feedback circuit 40, output matching circuit 50
Is composed of a spiral inductor 4 and a capacitor 5 as a lumped constant line, and a coplanar line 3 as a distributed constant line, as in the conventional case. Connection between the inductor 4 and the capacitor 5, connection between the inductor 4 and the inductor 4, inductor 4 and the transistor 1
Straight line conductors 6 are provided at the connecting portions with 0, respectively. Further, the ground conductor 1 is provided in the peripheral portion of the substrate surface. The ground conductor 1 is divided into two ground conductors 1a and 1b at the input side and output side coplanar lines 3 and 3, respectively. The coplanar line 3 includes the ground conductors 1a and 1
b, the central conductor 2, and a strip-shaped bridge conductor 11 provided on the central conductor 2. The ground conductors 1a and 1b extend from the periphery of the board to the vicinity of both sides of each of the line conductors 6. A strip-shaped bridge conductor 11 is provided on each line conductor 6, and by this bridge conductor 11,
The ends of the ground conductors 1a and 1b on the line conductor 6 side are connected to each other. As a result, the coplanar line 13 is formed at the connection part on the input side and the output side of each element 4, 5, 10. Therefore, the potentials of the ground conductors 1a and 1b are equal near both sides of each line conductor 6, and good grounding can be performed even at a high frequency of IGHz or higher. Moreover, the coplanar line 13 can determine the characteristic impedance of the line conductors 6 on the input side and the output side of each of the elements 4, 5, 10 and can eliminate the influence of the parasitic line.
Therefore, it is possible to easily design a circuit having desired performance.

【0011】この第1の発明のマイクロ波回路の特性を
調べるために、実際に、GaAs半導体基板20上に図1
に示した回路を2段レイアウトし、トランジスタ10と
してイオン注入型の電界効果トランジスタ(12GHzで
NFmin(最小雑音指数)が1.3dB、最小雑音時の利得
が9dBのもの)を用いて、周波数帯域11〜13GHz
用の2段低雑音増幅器を作製した。そして、入出力のV
SWR(定在波比)特性,利得特性,雑音特性を測定したと
ころ、図3に示すように、上記周波数帯域11〜13G
Hzで入力VSWR2.5以下,出力VSWR2.0以下,
利得16dB以上,雑音指数2.5dB以下という低雑音・
高利得の特性を得ることができた。
In order to investigate the characteristics of the microwave circuit according to the first aspect of the present invention, FIG.
The circuit shown in Figure 2 is laid out in two stages, and as the transistor 10, an ion implantation type field effect transistor (having an NFmin (minimum noise figure) of 1.3 dB at 12 GHz and a gain of 9 dB at minimum noise) is used. 11-13 GHz
A two-stage low noise amplifier was manufactured. And input / output V
When the SWR (standing wave ratio) characteristic, the gain characteristic, and the noise characteristic were measured, as shown in FIG.
Input VSWR 2.5 or less, output VSWR 2.0 or less at Hz,
Low noise with gain above 16dB and noise figure below 2.5dB
We were able to obtain high gain characteristics.

【0012】図2は、第2の発明の一実施例のマイクロ
波回路の要部のレイアウトを示している。このマイクロ
波回路は、誘電体基板(高比抵抗半導体基板)20の表面
に、図1に示したものと同様に、入力整合回路30と、
能動素子としてのトランジスタ10と、直列帰還回路4
0と、出力整合回路(または段間整合回路。以下同様。)
50を備えている。上記入力整合回路30,直列帰還回
路40,出力整合回路50は、従来と同様に、集中定数
線路としてのスパイラル状のインダクタ4およびキャパ
シタ5と、分布定数線路としてのコプレーナ線路3によ
って構成されている。インダクタ4とキャパシタ5との
接続部、インダクタ4とインダクタ4との接続部、イン
ダクタ4とトランジスタ10との接続部には、それぞれ
直線状の線路導体6が設けられている。また、基板表面
の周辺部には接地導体1が設けられている。この接地導
体1は、入力側,出力側のコプレーナ線路3,3の箇所で
2つの接地導体1a,1bに分割されている。コプレーナ
線路3は、接地導体1a,1bと、中心導体2と、この中
心導体2の上に設けられた帯状のブリッジ導体11とで
構成されている。さらに、この例では、基板20の裏面
側に接地導体100が全面に設けられている。さらに、
半導体基板20の周辺部に形成したバイアホール12,
12,…を通して、裏面側の接地導体100と基板表面
側の接地導体1a,1bとが電気的に接続されている。こ
れにより、基板表面の各線路導体6と基板裏面の接地導
体100とで、各素子3,4,5,10の入力側,出力側に
マイクロストリップ線路16が構成されている。したが
って、インダクタ4,キャパシタ5および線路導体6の
伝搬モードがマイクロストリップ線路のモードとなっ
て、高周波であっても接地が良好に行われる。しかも、
線路導体6の特性インピーダンスが定まって、寄生線路
の影響が除去される。
FIG. 2 shows a layout of a main part of a microwave circuit according to an embodiment of the second invention. In this microwave circuit, an input matching circuit 30 and an input matching circuit 30 are provided on the surface of a dielectric substrate (high specific resistance semiconductor substrate) 20 as in the case shown in FIG.
Transistor 10 as an active element and series feedback circuit 4
0 and output matching circuit (or interstage matching circuit. The same applies below)
Equipped with 50. The input matching circuit 30, the series feedback circuit 40, and the output matching circuit 50 are composed of a spiral inductor 4 and a capacitor 5 as a lumped constant line, and a coplanar line 3 as a distributed constant line, as in the conventional case. .. Straight line conductors 6 are provided at the connection between the inductor 4 and the capacitor 5, at the connection between the inductor 4 and the inductor 4, and at the connection between the inductor 4 and the transistor 10. Further, the ground conductor 1 is provided in the peripheral portion of the substrate surface. The ground conductor 1 is divided into two ground conductors 1a and 1b at the input side and output side coplanar lines 3 and 3. The coplanar line 3 includes ground conductors 1a and 1b, a center conductor 2, and a strip-shaped bridge conductor 11 provided on the center conductor 2. Further, in this example, the ground conductor 100 is provided on the entire back surface of the substrate 20. further,
Via holes 12 formed in the periphery of the semiconductor substrate 20,
The ground conductor 100 on the rear surface side and the ground conductors 1a, 1b on the front surface side of the substrate are electrically connected through 12, ... As a result, the line conductors 6 on the front surface of the substrate and the ground conductor 100 on the rear surface of the substrate form the microstrip lines 16 on the input side and the output side of the elements 3, 4, 5, and 10. Therefore, the propagation mode of the inductor 4, the capacitor 5, and the line conductor 6 becomes the mode of the microstrip line, and the grounding is performed well even at a high frequency. Moreover,
The characteristic impedance of the line conductor 6 is determined, and the influence of the parasitic line is removed.

【0013】このマイクロ波回路の特性は、図3に示し
た前記マイクロ波回路の特性と略同等であり、GaAs半
導体基板20上に形成した周波数帯域11〜13GHz
用の2段低雑音増幅器を構成した場合も略同等な特性が
得られる。
The characteristics of the microwave circuit are substantially the same as those of the microwave circuit shown in FIG. 3, and the frequency bands 11 to 13 GHz formed on the GaAs semiconductor substrate 20 are used.
Even when a two-stage low noise amplifier for use in the system is constructed, substantially the same characteristics can be obtained.

【0014】なお、この例(第2の発明)では、インダク
タ4,キャパシタ5の集中定数線路の伝搬モードは、マ
イクロストリップ線路のモードが付加される結果、基板
裏面に接地導体100を設けないときの伝搬モードに対
して変化する。しかし、この特性の変化はわずかであ
る。但し、より正確な設計をするためには、基板裏面に
接地導体100を施した集中定数線路のTEG(テスト
・エレメント・グループ)を予め作成・評価しておき、
上記TEGの高周波特性を設計に用いる。
In this example (second invention), the propagation mode of the lumped constant line of the inductor 4 and the capacitor 5 is the mode of the microstrip line, and as a result, when the ground conductor 100 is not provided on the back surface of the substrate. Changes with respect to the propagation mode of. However, the change in this property is slight. However, in order to make a more accurate design, a TEG (test element group) of a lumped constant line in which the ground conductor 100 is provided on the back surface of the substrate is created and evaluated in advance,
The high frequency characteristics of the TEG are used for design.

【0015】[0015]

【発明の効果】以上より明らかなように、第1の発明の
マイクロ波回路は、基板表面の周辺部に存する接地導体
を、各素子をつなぐ線路導体の両側近傍に延在させると
ともに、上記接地導体の線路導体側の端部をブリッジ導
体によって互いに接続して、各素子の入力側,出力側に
コプレーナ線路を構成しているので、1GHz以上の高
周波であっても良好な接地を行うことができる。しか
も、上記コプレーナ線路によって、各素子の入力側,出
力側の線路導体の特性インピーダンスを定めて、寄生線
路の影響を除去することができる。したがって、回路設
計を容易にでき、高周波特性を向上させることができ
る。
As is apparent from the above, in the microwave circuit of the first invention, the ground conductor existing in the peripheral portion of the substrate surface is extended near both sides of the line conductor connecting the respective elements, and the above-mentioned ground is provided. Since the ends of the conductors on the line conductor side are connected to each other by a bridge conductor to form a coplanar line on the input side and output side of each element, good grounding can be performed even at high frequencies of 1 GHz or higher. it can. Moreover, the coplanar line can determine the characteristic impedance of the line conductors on the input side and the output side of each element to eliminate the influence of the parasitic line. Therefore, the circuit design can be facilitated and the high frequency characteristics can be improved.

【0016】また、第2の発明のマイクロ波回路は、基
板裏面側に接地導体を設け、この接地導体をバイアホー
ルを通して基板表面側の接地導体と接続して、各素子を
つなぐ線路導体と基板裏面側の接地導体とでストリップ
線路を構成しているので、1GHz以上の高周波であっ
ても良好な接地を行うことができる。しかも、上記スト
リップ線路によって、各素子の入力側,出力側の線路導
体の特性インピーダンスを定めて、寄生線路の影響を除
去することができる。したがって、回路設計を容易にで
き、高周波特性を向上させることができる。
Further, in the microwave circuit of the second invention, a ground conductor is provided on the back surface side of the substrate, and the ground conductor is connected to the ground conductor on the front surface side of the substrate through the via hole to connect the line conductor and the substrate. Since the strip line is configured with the ground conductor on the back surface side, good grounding can be performed even at a high frequency of 1 GHz or higher. Moreover, the stripline can determine the characteristic impedance of the line conductors on the input side and the output side of each element to eliminate the influence of the parasitic line. Therefore, the circuit design can be facilitated and the high frequency characteristics can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】 第1の発明の一実施例のマイクロ波回路の構
造を示す図である。
FIG. 1 is a diagram showing a structure of a microwave circuit according to an embodiment of the first invention.

【図2】 第2の発明の一実施例のマイクロ波回路の構
造を示す図である。
FIG. 2 is a diagram showing a structure of a microwave circuit according to an embodiment of the second invention.

【図3】 第1の発明のマイクロ波回路によって構成し
た2段低雑音増幅器の特性を示す図である。
FIG. 3 is a diagram showing characteristics of a two-stage low noise amplifier configured by the microwave circuit of the first invention.

【図4】 従来のマイクロ波回路の構造を示す図であ
る。
FIG. 4 is a diagram showing a structure of a conventional microwave circuit.

【符号の説明】[Explanation of symbols]

1,1a,1b,100 接地導体 2 中心導体 3,13 コプレーナ線路 4 スパイラル状のインダクタ 5 キャパシタ 6 線路導体 10 トランジスタ 11 ブリッジ導体 12 バイアホール 16 マイクロストリップ線路 20 誘電体基板 30 入力整合回路 40 直列帰還回路 50 出力整合回路(または段間整合回路) 1, 1a, 1b, 100 Ground conductor 2 Center conductor 3,13 Coplanar line 4 Spiral inductor 5 Capacitor 6 Line conductor 10 Transistor 11 Bridge conductor 12 Via hole 16 Microstrip line 20 Dielectric substrate 30 Input matching circuit 40 Series feedback Circuit 50 Output matching circuit (or interstage matching circuit)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 誘電体基板の表面に直線状の線路導体で
接続された集中定数線路と能動素子とを有し、上記集中
定数線路および能動素子を一体として取り囲む接地導体
を上記基板表面の周辺部に設け、上記接地導体を分割し
た隙間にコプレーナ線路を構成して回路全体の入力,出
力を行うようにしたマイクロ波回路において、 上記接地導体を基板周辺部から上記各線路導体の両側近
傍に延在させるとともに、上記各線路導体の上に帯状の
ブリッジ導体を設けて上記接地導体の線路導体側の端部
を互いに接続して、上記各集中定数線路および能動素子
の入力側,出力側にコプレーナ線路を構成したことを特
徴とするマイクロ波回路。
1. A ground conductor, which has a lumped constant line connected to a surface of a dielectric substrate by a linear line conductor and an active element, and surrounds the lumped constant line and the active element as one body around the substrate surface. In a microwave circuit in which a coplanar line is formed in a gap formed by dividing the ground conductor to perform input and output of the entire circuit, the ground conductor is provided from the peripheral portion of the substrate to the vicinity of both sides of each line conductor. Along with extending it, a strip-shaped bridge conductor is provided on each line conductor to connect the end portions of the ground conductor on the line conductor side to each other, and to the input side and output side of each lumped constant line and active element. A microwave circuit characterized by forming a coplanar line.
【請求項2】 誘電体基板の表面に直線状の線路導体で
接続された集中定数線路と能動素子とを有し、上記集中
定数線路および能動素子を一体として取り囲む接地導体
を上記基板表面の周辺部に設け、上記接地導体を分割し
た隙間にコプレーナ線路を構成して回路全体の入力,出
力を行うようにしたマイクロ波回路において、 上記基板の裏面側に接地導体を全面に設けるとともに、
この接地導体を上記基板を貫通するバイアホールを通し
て上記基板表面側の接地導体と電気的に接続して、上記
線路導体と基板裏面側の接地導体とで上記各集中定数線
路および能動素子の入力側,出力側にストリップ線路を
構成したことを特徴とするマイクロ波回路。
2. A ground conductor, which has a lumped constant line and an active element connected to a surface of a dielectric substrate by a linear line conductor, and surrounds the lumped constant line and the active element integrally around the substrate surface. In a microwave circuit in which a coplanar line is formed in a space where the ground conductor is divided to perform input and output of the entire circuit, a ground conductor is provided on the entire back surface of the substrate, and
The ground conductor is electrically connected to the ground conductor on the front surface side of the substrate through a via hole penetrating the board, and the line conductor and the ground conductor on the back surface side of the substrate connect the lumped constant lines and the input side of the active element. A microwave circuit having a strip line on the output side.
JP28455291A 1991-10-30 1991-10-30 Microwave circuit Expired - Fee Related JP3176667B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28455291A JP3176667B2 (en) 1991-10-30 1991-10-30 Microwave circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28455291A JP3176667B2 (en) 1991-10-30 1991-10-30 Microwave circuit

Publications (2)

Publication Number Publication Date
JPH05121908A true JPH05121908A (en) 1993-05-18
JP3176667B2 JP3176667B2 (en) 2001-06-18

Family

ID=17679933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28455291A Expired - Fee Related JP3176667B2 (en) 1991-10-30 1991-10-30 Microwave circuit

Country Status (1)

Country Link
JP (1) JP3176667B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050283A (en) * 2008-08-21 2010-03-04 Oki Semiconductor Co Ltd Method of testing insulation property of wafer-level csp, and teg pattern used in the method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2506339A (en) 2012-08-07 2014-04-02 Andrew Alexander Jewson A mobile phone with writing means demountably retained in a conventional (e.g. earphone) socket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050283A (en) * 2008-08-21 2010-03-04 Oki Semiconductor Co Ltd Method of testing insulation property of wafer-level csp, and teg pattern used in the method

Also Published As

Publication number Publication date
JP3176667B2 (en) 2001-06-18

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