JPH051236U - Wire bonding equipment - Google Patents

Abstract

(57) [Summary] [Objective] In a wire bonding apparatus, a stable wire height is obtained by detecting a wire height and an abnormal wire loop shape. [Structure] At the carry-out position of the bonded pellets and the lead frame 7, the rising height of the wire 8 with respect to the pellet 11 is set to the projection laser unit 6 and the reception laser unit 5.
Then, the control unit 9 controls the bonding head 3 and the XY-axis drive tables 1 and 2 based on the detection signal to set the bonding conditions to appropriate ones.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a wire bonding apparatus.

[0002]

[Prior Art]

 In the conventional wire bonding apparatus, as shown in FIG. 5, a control unit 12 that controls the wire bonding head unit 3 and the capillary 4 determines the position of a semiconductor element (hereinafter, referred to as pellet) 11 as a pellet position detection unit 13. The image obtained from is calculated, the correction value, that is, the amount of movement of the XY drive table is determined, and a movement pulse is sent to the XY drive tables 1 and 2. As a result, the capillary 4 performs wire bonding using the gold wire 8 at the bonding position on the pellet 11 and at the designated position on the lead frame 7.

When wire bonding is completed, the feed unit 10 feeds the bonded pellets, the next pellet 11 moves below the pellet position detection unit 13, and recognition is performed again. In this way, wire bonding is continuously performed. In the figure, 15 is an unloader magazine and 16 is a loader magazine.

[0004]

[Problems to be solved by the device]

 In this conventional wire bonding apparatus, since the pellet position detection unit 13 recognizes only the positions of the pellet 11 and the lead frame 7, the bonding state, that is, the wire bonded to the pellet 11 and the lead frame 7 is wire-bonded. The rising height with respect to the surface of the pellet 11 of No. 8 was determined only by the upper and lower strokes of the capillary 4. Therefore, it is impossible to detect the degree to which the rising height 14 of the gold wire with respect to the pellet is too high or too low, and the capillary 4 comes into contact with the gold wire 8 so that the rising portion of the gold wire 8 can be detected. It was not possible to detect even if was fallen.

Further, in order to control the rising height of the gold wire 8 with respect to the pellet, the operator must grasp the rising degree of the gold wire 8 with respect to the pellet unless the operator actually changes the parameters and performs bonding. There was a problem that I could not do it.

[0006] An object of the present invention is to provide a wire bonding device that can obtain a stable wire rising height.

[0007]

[Means for Solving the Problems]

 In order to achieve the above object, a wire bonding apparatus according to the present invention is a wire bonding apparatus for wire bonding a lead frame and a semiconductor element mounted on the lead frame using a wire, At the position where the semiconductor element and the lead frame are carried out from the bonding area, a set of a light emitting laser unit and a light receiving laser unit for detecting the bonding state of the wire is provided.

[0008]

[Action]

 In the present invention, by detecting the rising height of the wire and the loop shape abnormality of the wire stretched between the pellet and the lead frame, and controlling the wire bonding operation based on the detection signal, stable operation is achieved. It is designed to obtain the wire height.

[0009]

【Example】

 The present invention will be described with reference to the drawings.

(Embodiment 1) Referring to the drawing, in the wire bonding apparatus according to the present invention, the pellet 11 and the lead frame 7 which have been bonded by the feeding unit 10 are carried out from the bonding area where the wire bonding is performed by the capillary 4 of the bonding head part 3. The light projecting laser unit 6 and the light receiving laser unit 5 are provided at these positions. The height of the light projecting laser unit 6 and the light receiving laser unit 5 is set so that the laser light goes straight between the light projecting laser unit 6 and the light receiving laser unit 5 at the preset rising height 14 of the wire 8 with respect to the pellet 11. Is set.

Further, the light reception signals of the light projecting / receiving laser units 6 and 5 are sent to the control unit 9 to be subjected to arithmetic processing, and based on the arithmetic processing result, the control unit 9 makes the bonding head units 3 orthogonal to each other. The X-axis table 1 and the Y-axis table 2 which are moved in the two axis directions and the bonding head section 3 which controls the wire bonding operation by the capillary 4 are driven and controlled. In the figure, 13 is a pellet detection unit, 15 is an unloader magazine, and 16 is a loader magazine.

In the embodiment, when bonding is completed between the pellet 11 and the lead frame 7 on which the pellet 11 is mounted using the wire (gold wire) 8 by the capillary 4 of the bonding head unit 3, the bonding is completed. The pellet 11 and the lead frame 7 are carried out from the wire bonding area by the feeding unit 10. At the carry-out position, the light emitting laser unit 6 and the light receiving laser unit 5 are used to detect the presence or absence of wire, and also to detect whether the rising height 14 of the bonded wire 8 is higher or lower than a set value. I do.

Detection signals from the light projecting laser unit 6 and the light receiving laser unit 5 are sent to the control unit 9 and are subjected to arithmetic processing.

When the rising height 14 of the wire 8 is lower than the set value, the control section 9 sends a command to the bonding head section 3 and the XY-axis tables 1 and 2 in order to increase the rising height of the wire 8. Control is performed such that the bonding pitch interval is narrowed, or conversely, the bonding pitch interval is widened to lower the rising height of the wire 8 so that bonding is performed at the set height 8 of the wire 8. .

Further, when the rising height 14 of the wire 8 is abnormally low or high several times in succession, the control unit 9 outputs a device stop signal to stop the wire bonding operation.

As described above, according to this embodiment, since the rising height of the wire is monitored and the state is fed back to the wire bonding operation, it is possible to obtain a stable rising height of the wire.

(Second Embodiment) FIG. 4 is a view showing a second embodiment of the present invention.

The present embodiment is a mechanism for detecting the state of a specific wire by using a fine beam of laser light. That is, the projecting laser unit 6 and the receiving laser unit 5 described above are particularly controlled to fix the rising height 14 of the wire 8 at a position where the beam hits the wire for which the rising height 14 of the wire 8 is detected, and the rising height 14 of the wire 8 is detected. Then, this detection signal is sent to the control unit 9. This is an embodiment used when the height is controlled by a representative wire without detecting all the wires.

[0019]

[Effect of the device]

 As described above, in the present invention, the laser unit that detects the rising height of the wire has a mechanism for automatically feeding back and correcting the rising height of the wire. There is an effect that it can be obtained.

Further, the wire height can be freely changed by arbitrarily changing the set wire height.

Further, when abnormally high wires or abnormally low wires continuously occur, the device can be stopped as an abnormal condition.

[Brief description of drawings]

FIG. 1 is a side view showing a wire bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view showing the embodiment shown in FIG.

FIG. 3 is an enlarged view showing a wire detection mechanism in the first embodiment.

FIG. 4 is a diagram showing a second embodiment of the present invention.

FIG. 5 is a diagram showing a conventional example.

[Explanation of symbols]

 1 X-axis drive table of wire bonding apparatus 2 Y-axis drive table of wire bonding apparatus 3 Bonding head section 4 Capillary 5 Light receiving laser unit 6 Projecting laser unit 7 Lead frame 8 Gold wire (wire) 9 Control section 10 Feed unit 11 Pellet 13 Pellet positioning detection unit 14 Height of rising wire from pellet surface 15 Unloader magazine 16 Loader magazine

Claims (1)

Claims for utility model registration 1. A wire bonding apparatus for wire-bonding a lead frame and a semiconductor element mounted on the lead frame using a wire, wherein the bonded semiconductor element and lead are bonded. A wire bonding apparatus having a set of a light emitting laser unit and a light receiving laser unit for detecting a bonding state of a wire at a position where a frame is carried out from a bonding area.