JPH05124626A - Embossed part forming device - Google Patents

Abstract

PURPOSE:To improve the release properties of a sheet material by a method wherein a forming female die to manufacture the bottom material of a carriage body, on which a large number of embossed parts to contain electronic components are provided, is constituted of a female die main body and an embossed bottom part constituting member, which is movably provided in the female die main body. CONSTITUTION:For a forming device 15 to form a bottom material by forming multiple rows of embossed parts, a large number of which are provided in the carrying direction at a specified pitch, a female die main body 32a for a forming female die 32 is moved upward at the time of sheet material forming, and a sheet plate 51 is pressed to a forming male die 34. Then, stems 37 are pressed downward, and a bottom part supporting body 35, which is integrated with the stems 37, is lowered while resisting a spring 38. Under such condition, a protuberance supporting body 41 of the forming male die 34 is lowered by a driving mechanism, and embossed parts are formed on the sheet plate 51 by inserting embossing protuberances 42 in embossing grooves 36. After the forming, when the protuberance supporting body 41 is raised and the female die main body 32a is lowered, the bottom part supporting body 35 is raised by springs 38, and the sheet plate 51 is released from the dies.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossing apparatus used for manufacturing a bottom material for an electronic parts carrier for packaging and carrying electronic parts such as ICs.

[0002]

2. Description of the Related Art Conventionally, there has been known a synthetic resin electronic component carrier for packaging and transporting a large number of electronic components such as ICs.
This electronic component carrier is provided with a bottom member that accommodates electronic components such as ICs, and a flat lid member that covers the bottom member. Of these, the bottom material is composed of an embossed portion for housing electronic components and a flange portion at the upper end opening of the embossed portion, and the lid material is heat-sealed to this flange portion. A large number of embossed portions are continuously provided in a single row, and each embossed portion is connected by a flange portion at the upper end opening of the embossed portion.

In the electronic component carrier having such a structure, electronic components such as ICs are housed in the respective embossed portions of the bottom material, and then the flat lid material is heat-sealed to the flange portion of the bottom material to form the electronic component. Will be packaged.

[0004]

Generally, a bottom material is manufactured by heating a synthetic resin sheet plate in advance and then vacuum or pressure forming by an embossing apparatus to form an embossed portion. The embossing molding device is composed of a molding male mold having an embossing protrusion and a molding female mold having an embossing groove.After molding the embossed portion on the sheet plate, air blow is performed from the molding female mold side to form the sheet plate. The mold is released from the mold. However,
When air blowing is performed from the molding female die side, the sheet may be cooled by this air and the heat distribution may be different, so that uniform molding may not be possible. Further, it may not be possible to reliably release the mold by air blow.

The present invention has been made in consideration of the above points, and provides an embossing molding apparatus capable of reliably releasing a sheet plate from a molding female die without using air blow after molding. With the goal.

[0006]

DISCLOSURE OF THE INVENTION The present invention provides an embossing molding apparatus for molding an embossed portion on a synthetic resin sheet plate, which comprises a forming male die having an embossing protrusion and a forming female die having an embossing groove. The embossing female die has a female die body, and an embossing bottom portion forming member that is movably provided in the female die body toward the forming male die and constitutes a bottom portion of the embossing groove. It is a molding device.

[0007]

The male molding die and the female molding die approach each other to form the embossed portion on the sheet plate, and then the male molding die and the female molding die separate from each other. Next, the embossed bottom component member in the female mold body moves to the male mold side, and the embossed part is extruded from the embossed groove and released.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

First, the electronic component carrier will be briefly described with reference to FIGS. 3 and 4. In FIGS. 3 and 4, the electronic component carrier 70 includes a bottom material 71 that accommodates an electronic component 77 such as an IC, and a lid material 75 that covers the bottom material 71.

The bottom member 71 is composed of an embossed portion 72 for housing electronic parts and a flange portion 73 at the upper end opening of the embossed portion 72, and the lid member 75 is heat-sealed to the flange portion 73. The embossed portions 72 are continuously provided in a single row, and the embossed portions 72 are connected to each other by a flange portion 73 having an upper end opening.

Of these, the bottom material 71 is formed by vacuum or pressure forming a vinyl chloride or polystyrene sheet plate, for example, while the lid material is a synthetic resin laminated sheet. Further, a plurality of punch holes 74 are continuously provided in the flange portion 73 adjacent to the embossed portion 72. The punch holes 74 are for transferring the bottom material 71. Next, a bottom material manufacturing apparatus for an electronic parts carrier according to the present invention will be briefly described with reference to FIG.

In FIG. 2, a bottom material manufacturing apparatus 10 comprises a roll 11, a dancer roll 12, a preheating roll 13, and a heating device 1.
4, embossing molding device 15, cooling device 16, punch device 17, feeding unit 18, dancer roll 19, inspection device 20,
The slit device 21, the marking device 22, the pulling roll 24, and the winding body 23 are sequentially arranged.

Next, the embossing apparatus according to the present invention will be described in detail with reference to FIG.

As shown in FIG. 1, the embossing molding device 15
Is a molding female die 32 having an embossing groove 36, and a molding female die 3
2 and a male molding die having an embossing protrusion 42 which is arranged above the No. 2 and enters the embossing groove 36. Of these, the molding male mold 34 has a male mold body 34a and a protrusion support member 41 movably provided in the male mold 34a in the vertical direction. It is provided at the bottom. On the other hand, the molding female die 32 has a female die body 32a.
And a bottom support 35 provided in the female main body 32 so as to be vertically movable. Further, the bottom support member has a bottom component member 39 on its upper part. The embossed bottom portion constituting member 39 constitutes the bottom portion of the embossed groove 36 of the molding female die 32, and the side portion of the embossed groove 36 is constituted by the female die main body 32a.

Below the bottom support 35, the spring 3
8 is provided, and the bottom support 35 is biased upward by this spring 38. Spring 3 shown in FIG.
In the urging position of 8, the upper surface of the embossed bottom forming member 39 and the upper surface of the female main body 32a are substantially aligned with each other. Further, on both sides of the bottom support 35, there are provided stems 37 that extend upward through the female main body 32a.

The projecting portion support member 41 of the male die 34 is adapted to move in the vertical direction by a drive mechanism (not shown).

Next, the operation of this embodiment having such a configuration will be described.

First, a vinyl chloride or polystyrene sheet plate 51 is continuously supplied from the winding body 11, passes through the dancer roll 12 and the preheating roll 13, and is heated by the heating device 14.
Be transferred to. The sheet plate 51 is sequentially heated by the first-stage heating device 14a, the second-stage heating device 14b, and the third-stage heating device 14c of the heating device 14, and a plurality of strip-shaped heating portions extending in the transport direction at predetermined intervals on the sheet plate 51. (Not shown) is formed.

Next, the sheet plate 51 is embossed by the embossing apparatus 1.
5, the embossed portion 72 is formed on the sheet plate 51.

That is, when the sheet plate 51 is transferred to the forming device 15, first, the female die main body 32a of the forming female die 32 moves upward to press the sheet plate 51 against the forming male die 34. In this case, the sheet plate 51 is the female die main body 32 of the female die 32.
It is sandwiched between the upper surface of a and the lower surface of the male mold body 34a of the molding male mold 34. At the same time, the stem 37 has a male main body 34a.
Is pushed downward by the lower surface of the bottom support 35, and the bottom support 35 is lowered against the force of the spring 38.

In this way, the embossed groove portion 36 is formed in the female die 32. In this case, the side portion of the embossed groove 36 is formed by the female main body 32a, and the bottom portion of the embossed groove 36 is formed by the embossed bottom portion constituting member 39.

Next, the projection support 41 of the molding male die 34 is moved downward by the drive mechanism, and the emboss projection 42 enters the emboss groove 36 accordingly. At the same time, compressed air is blown from the molding male mold 34 side, and the embossed portion 72 is molded on the sheet plate 51 by pressure molding.

Subsequently, the protrusion support 41 of the molding male mold 34 is moved upward by the drive mechanism, and the female mold body 32a of the molding female mold 32 is lowered. In this case, the bottom support 35 in the female main body 32a is raised by the spring 38, and the embossed portion 72 formed on the sheet plate 51 is extruded from the embossed groove 36 by the embossed bottom component 39.

According to the present embodiment, after the embossed portion 72 is formed on the sheet material 51, the embossed portion 72 is extruded from the embossed groove 36 by the embossed bottom component member 39.
The release work of the seat plate 51 can be reliably performed.
Further, since the air blow is not used for the releasing operation of the sheet plate 51, the uneven heat distribution of the sheet plate due to the air can be eliminated, and the embossed portion 72 can be uniformly formed.

A sheet plate 51 having an embossed portion 72 formed thereon.
Is then transferred to the cooling device 16 to be cooled, and then transferred to the punch device 17 to form a punch hole 74 in the sheet plate 51 between the lower punch die 41 and the upper punch die 45.

In this way, the bottom material 71 having, for example, four rows of embossed portions 72 and punch holes 74 corresponding to the embossed portions 72 is formed. Subsequently, the multi-row bottom material 71 is transferred from the feeding section 18 to the inspection device 20 via the dancer roll 19. Subsequently, the multi-row bottom material 71 is transferred to the slit device 21, and the flange portion 73 is cut in the transfer direction by the slit device 21 to be divided into each row and unnecessary portions on both sides are removed. Subsequently, the bottom material 71 divided into each row is marked with a predetermined defective portion by the marking device 22, and then wound on the winding body 23. In this way, the continuous single row of embossed portions 72, the flange portion 73 that connects the embossed portions 72 to each other, and the flange portion 7
3 has punch holes 74 provided corresponding to the embossed portions 72.
Bottom material 71 having and is manufactured (FIG. 3).

[0027]

As described above, according to the present invention,
After the embossed portion is formed on the sheet plate, the embossed bottom forming member in the female die body moves to the male die side and pushes out the embossed portion from the embossed groove. Therefore, the releasability of the sheet plate can be improved.

[Brief description of drawings]

1 is a side sectional view showing an embodiment of an embossing apparatus according to the present invention.

FIG. 2 is a schematic view showing a bottom material manufacturing apparatus for an electronic component carrier.

FIG. 3 is a partial perspective view of an electronic component carrier.

4 is a sectional view taken along line IV-IV in FIG.

[Explanation of symbols]

 15 Embossing Molding Device 32 Molding Female Mold 32a Female Mold Body 34 Molding Male Mold 34a Male Mold Body 35 Bottom Support 39 Embossing Bottom Constituent Member 41 Projection Supporting 42 Embossing Projection

Claims (1)

[Claims] 1. An embossing molding apparatus comprising a molding male die having an embossing projection and a molding female die having an embossing groove, wherein the embossing portion is molded on a synthetic resin sheet plate, wherein the molding female die is a female mold body. And an emboss bottom forming member that is movably provided in the female mold body toward the molding male mold and that constitutes the bottom of the embossing groove.