JPH0512904U - Plate material processing machine using heat energy - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a plate material processing machine utilizing heat energy that can shorten the processing time. The laser processing machine 1 includes a laser head 15, work holders 12 and 13, a work holder moving unit 28 that moves the work holders 12 and 13 in the X and Y directions, and a laser head 15 in the Z direction. The laser head 15 and the work holder 1 are moved before the work holders 12, 13 and the laser head 15 are moved by the laser head elevating part 30, the work holder moving part 28, and the laser head elevating part 30.
The control unit 20 determines whether or not there is interference with the second and the third control units.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a plate material processing machine, and more particularly, to a plate material processing machine using heat energy for processing a plate material by using heat energy.

[0002]

[Prior Art]

 For example, a plate material processing machine for processing a plate material using thermal energy of a laser or the like is put into practical use. For example, a laser processing machine includes a laser head that performs laser processing on a plate material, an elevating mechanism that elevates and lowers a laser head, a work holder that holds a plate material placed on a work table, and a work holder that moves back and forth on the work table. It is mainly composed of a moving mechanism for moving in the left-right direction and a control means for controlling the driving of the moving mechanism.

During processing, while the plate material is held by the work holder, the work mechanism moves the work holder back and forth and left and right to position the plate material processing position at the laser head position.

From this state, the laser head is lowered by the elevating mechanism to perform the laser processing on the plate material. Prior to the lowering of the laser head, the control means checks the presence / absence of interference between the laser head and the work holder. If it is determined that the laser head and the work holder do not interfere with each other, the laser head is lowered and laser processing is performed.

[0005]

[Problems to be solved by the device]

 In the conventional configuration, as described above, the work holder is first moved in the front-back and left-right directions, and then the presence or absence of interference between the laser head and the work holder is checked. For this reason, there is a problem in that the machining time is extra due to the movement time of the work holder in the front-back and left-right directions.

An object of the present invention is to provide a plate material processing machine that utilizes heat energy and can reduce the processing time.

[0007]

[Means for Solving the Problems]

 A plate material processing machine utilizing heat energy according to the present invention includes a processing head, a gripping unit, a moving unit, and a determining unit. The processing head is for processing a plate material using thermal energy. The grip part grips a plate material. The moving means is means for relatively moving the processing head in the horizontal direction and the vertical direction with respect to the plate material held by the holding portion. The above-mentioned judging means is means for judging whether or not there is interference between the processing head and the gripping portion before the moving means moves in the horizontal and vertical directions.

[0008]

[Action]

 According to the present invention, first, the determining means determines whether or not there is interference between the processing head and the grip portion before the relative movement of the processing head in the horizontal and vertical directions by the moving means. Then, the moving means relatively moves the processing head in the horizontal direction and the vertical direction with respect to the plate material held by the holding portion. Next, the processing head processes the plate material.

In this case, the determination means determines the presence or absence of interference prior to the movement by the movement means, and the movement means relatively moves the processing head in the horizontal direction and the vertical direction, so that the movement time of the processing head with respect to the plate material is increased. The processing time can be shortened.

[0010]

【Example】

 FIG. 1 shows a laser beam machine according to an embodiment of the present invention. The laser beam machine 1 is mainly composed of a lower frame 2, an upper frame 3 arranged above the lower frame 2, and a throat section 4 supporting the upper frame 3 at the rear side.

A fixed table 6 and left and right moving tables 7 and 8 are provided on the lower frame 2 as work tables on which the work 5 is placed. The moving tables 7 and 8 are fixed to the carriage 9, and can move along with the carriage 9 along the guide rail 10 in the Y-axis direction. Although not shown, the moving mechanism of the carriage 9 is provided below the moving table 8. This moving mechanism has a ball screw arranged in the Y-axis direction, a ball nut screwed onto the ball screw and fixed to the lower surface of the moving table 8, and a servomotor for rotationally driving the ball screw. There is.

A cross slide 11 is provided on the carriage 9 so as to be movable in the X-axis direction. The moving mechanism of the cross slide 11 is provided in the carriage 9 and is composed of a ball screw arranged in the X-axis direction and a servo motor for rotationally driving the ball screw. Work holders 12, 13 for holding the work 5 are attached to the cross slide 11.

A laser head 15 is provided in the upper frame 3 so as to be movable up and down (movable in the Z-axis direction). Although not shown, a laser oscillator and a reflecting mirror for guiding the laser light from the laser oscillator to the laser head 15 are provided in the upper frame 3 and the throat portion 4. Below the fixed table 6, a carry-out mechanism (not shown) for carrying out the plate material pieces cut from the work 5 is provided.

The laser processing machine 10 described above has a control unit 20 as shown in FIG. The control unit 20 includes a microcomputer including a CPU 21, a ROM 22, a RAM 23 and the like. The I / O port 24 should be introduced into the keyboard 25, the tape reader 26, the grips 27 of the work holders 12 and 13, the work holder moving unit 28 including the cross slide moving mechanism, and the laser head 15. A laser output unit 29 that outputs laser light, a laser head elevating unit 30, and other input / output units are connected.

The laser beam machine 1 described above is controlled by the control unit 20 and operates as described below. 3 and 4 are control flowcharts thereof.

When a main switch (not shown) of the laser processing machine 1 is turned on, the X and Y positions of the work holders 12 and 13 and the Z position of the laser head 15 are set to initial positions in step S1. The initial settings for are made. Next, in step S2, a work start command is awaited.

When a work start command is input from the keyboard 25, the process proceeds to step S3. In step S3, the NC program is read from the tape reader 26. Next, in step S4, the first command step of the NC program is read.

In step S5, it is determined whether or not the read command step is a plate material movement command. If not, the process proceeds to step S6, and it is determined whether the command step is a machining command. In step S7, it is determined whether or not the command step is an instruction to perform another process. Then, in step S8, it is determined whether or not all the command steps of the NC program have been processed. If the command step remains, the process returns to step S4 to read the next command step.

If it is determined in step S5 that a plate material movement command has been issued, the process proceeds to step S9 and the subroutine shown in FIG. 4 is executed.

In step S 10 in FIG. 4, it is determined whether the laser head 15 interferes with the work holder 12 or 13 by the movement of the work holders 12 and 13 in the X and Y directions and the movement of the laser head 15 in the Z direction. .. When it is determined that the laser head 15 interferes with the work holders 12 and 13, the process proceeds to step S11. In step S11, the work holders 12 and 13 are moved in the X direction to perform the holding operation of the plate member 5.

If it is determined in step S10 that the laser head 15 does not interfere with the work holders 12 and 13, the process proceeds to step S12. In step S12, the work holder moving unit 28 (FIG. 2) and the laser head elevating unit 30 are driven to move the work 5 held by the work holders 12 and 13 in the X and Y directions and the laser head 15 in the Z direction, respectively. Let

Next, in step S13, it is determined whether the work 5 has reached a desired X coordinate position. When the work 5 reaches the desired X coordinate position, the process proceeds to step S14. In step S14, the movement of the work holder moving unit 28 in the X direction is stopped. After the processing in step S14, the process proceeds to step S15. If it is determined in step S13 that the desired X coordinate position of the work 5 has not been reached, the process proceeds to step S15. In step S15, it is determined whether the work 5 has reached the desired Y coordinate position. When the work 5 reaches the desired Y coordinate position, the process proceeds to step S16. In step S16, the movement of the work holder moving unit 28 in the Y direction is stopped. After the processing in step S16, the process proceeds to step S17. If it is determined in step S15 that the desired Y coordinate position has not been reached, the process proceeds to step S17. In step S17, it is determined whether the laser head 15 has reached the desired Z coordinate position. When the laser head 15 reaches the desired Z coordinate position, the process proceeds to step S18. In step S18, the driving of the laser head elevating / lowering unit is stopped and the movement of the laser head 15 in the Z direction is stopped. After the processing in step S18, the process proceeds to step S19. If it is determined in step S17 that the laser head 15 has not reached the desired Z coordinate position, the process proceeds to step S19.

In step S 19, it is determined whether the movements of the work holders 12 and 13 in the X and Y directions and the movement of the laser head 15 in the Z direction are both stopped. If any of the work holders 12, 13 or the laser head 15 has moved, the program returns from step S19 to step S13 and repeats the processing of steps S13 to S18. That is, the processes of steps S13 to S18 are repeated until the work holders 12 and 13 and the laser head 15 all stop moving. If it is determined in step S19 that both the work holders 12, 13 and the laser head 15 have stopped, the program returns to the main routine of FIG.

If it is determined in step S6 that a machining command has been issued, the process proceeds to step S20 to perform machining processing. That is, the laser output unit 29 (FIG. 2) is driven to guide the laser light from the laser output unit 29 to the laser head 15 to perform laser processing on the work 5.

If the command step read in step S4 is a step for commanding other processing, the process proceeds from step S7 to step S21. In step S21, the process according to the command is performed, and after the process, the process returns to step S8. When the reading of all the steps is completed, the determination in step S8 becomes Yes, and the operation of the laser processing machine 1 ends.

In this embodiment, the presence / absence of the interference between the laser head 15 and the work holders 12, 13 is determined by the movement of the work holders 12, 13 in the X and Y directions and the movement of the laser head 15 in the Z direction. Performed before, and after this judgment, the work holders 12 and 13 and the laser head 15 are simultaneously moved to move the laser head 15 to the processing position of the work 5, so that the movement time of the work 5 and the laser head 15 is shortened, and the processing time is reduced. Is shortened.

[Other Embodiments] In the above embodiments, the plate member 5 is moved in the X and Y directions by the work holder moving unit 28. However, the application of the present invention is not limited to this, and the laser head is not limited thereto. 15 may be configured to be movable not only in the Z direction but also in the X and Y directions.

[0028]

EFFECT OF THE INVENTION In the plate material processing machine utilizing heat energy according to the present invention, a moving means for moving the processing head relative to the plate material in the horizontal direction and the vertical direction, and a horizontal and vertical movement by the moving means. Since the determination means for determining the presence / absence of the interference between the processing head and the gripping portion is provided before, the processing time of the plate material can be shortened.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a laser processing machine according to an embodiment of the present invention.

FIG. 2 is a schematic block diagram of a control unit thereof.

FIG. 3 is a control flowchart thereof.

FIG. 4 is a control flowchart thereof.

[Explanation of symbols]

 1 Laser Processing Machine 12, 13 Work Holder 15 Laser Head 20 Control Section 28 Work Holder Moving Section 30 Laser Head Lifting Section

Claims (1)

[Scope of utility model registration request] 1. A processing head for processing a plate material by utilizing thermal energy, a gripping part for gripping the plate material, and the processing head relative to the plate material gripped by the gripping part in the horizontal and vertical directions. A plate material processing machine using heat energy, comprising: a moving unit that moves the moving unit; and a determining unit that determines whether or not the processing head interferes with the gripping unit before the moving unit moves in the horizontal and vertical directions.