JPH05136325A - Semiconductor surface-mounting component - Google Patents
Semiconductor surface-mounting componentInfo
- Publication number
- JPH05136325A JPH05136325A JP29943591A JP29943591A JPH05136325A JP H05136325 A JPH05136325 A JP H05136325A JP 29943591 A JP29943591 A JP 29943591A JP 29943591 A JP29943591 A JP 29943591A JP H05136325 A JPH05136325 A JP H05136325A
- Authority
- JP
- Japan
- Prior art keywords
- pins
- package
- semiconductor surface
- shape
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体表面実装部品に関
し、特に能動素子が２方向のリード付きのプラスチック
パッケージタイプであるＳＯＰ部品につき形状改良を行
った半導体表面実装部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor surface mount device, and more particularly to a semiconductor surface mount device having an improved SOP component which is a plastic package type in which an active element has bidirectional leads.
【０００２】[0002]
【従来の技術】従来、この種のＳＯＰ（Ｓｍａｌｌ Ｏ
ｕｔｌｉｎｅ Ｐａｃｋａｇｅ）部品は、図２に示すよ
うに、半導体等をプラスチックパッケージしたパッケー
ジ本体２１と、左右２方向にリードとして突き出してい
る左側のピン２２−１〜２２−８、右側のピ２２−９〜
２２−１６とを有しているが、この左側のピン２２−１
〜２２−８と右側のピ２２−９〜２２−１６の数が同数
で対称形となっているので、基板上への取り付け際に極
性の判定等で左右違わぬように慎重に取り付けを行って
いた。2. Description of the Related Art Conventionally, this type of SOP (Small O
As shown in FIG. 2, the utline package part includes a package body 21 in which a semiconductor or the like is packaged in a plastic, a left side pin 22-1 to 22-8, and a right side pin 22-9 protruding as leads in the left and right directions. ~
22-16 and the left side pin 22-1
~ 22-8 and right side pins 22-9 to 22-16 have the same number and are symmetrical, so when installing them on the board, carefully attach them so that they do not differ from each other when determining polarity. Was there.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のＳＯＰ
部品の形状は、左右対称であったので、スティックに収
められたＳＯＰ部品、又は実装後のＳＯＰ部品の極性の
相違を発見しにくいという欠点がある。DISCLOSURE OF THE INVENTION The conventional SOP described above
Since the shapes of the parts are bilaterally symmetric, there is a drawback that it is difficult to find a difference in polarity between the SOP parts housed in the stick or the SOP parts after mounting.
【０００４】[0004]
【課題を解決するための手段】本発明の半導体表面実装
部品は能動素子がプラスチックパッケージされ２方向に
複数個のリードとしてピンが突き出しているＳＯＰ部品
等の半導体表面実装部品において、前記プラスチックパ
ッケージの一方に突き出しているピン数と、他方向に突
き出しているピン数とを相違させ、かつパッケージの形
状も左右非対称の形状に成形している。The semiconductor surface mount component of the present invention is a semiconductor surface mount component such as an SOP component in which an active element is plastic packaged and pins are projected as a plurality of leads in two directions. The number of pins protruding in one direction and the number of pins protruding in the other direction are made different, and the shape of the package is also asymmetrical.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例の平面外観図である。な
お、本実施例では従来例と同じ合計ピン数１６本の場合
を例示している。図１の実施例は半導体等をプラスチッ
クパッケージしたパッケージ本体１８と、２方向の一方
の左側リードとしてピン１９−１〜１９−７を配列し、
右側リードとしてピン１９−８〜１９−１６を配置して
いる。また、パッケージの形状も左右非対称に成形して
いる。したがって左右のピ数を非対称に配分し、かつ形
状も変えているので、スティック収納時の極性の判定お
よび作業者が取り付け工事における間違い等を排除する
ことができる。The present invention will be described below with reference to the drawings. FIG. 1 is a plan external view of an embodiment of the present invention. In this embodiment, the case where the total number of pins is 16 which is the same as the conventional example is illustrated. In the embodiment of FIG. 1, a package body 18 in which a semiconductor or the like is packaged in plastic is arranged, and pins 19-1 to 19-7 are arranged as one left lead in two directions,
Pins 19-8 to 19-16 are arranged as the right lead. In addition, the shape of the package is also asymmetrical. Therefore, since the left and right pin numbers are asymmetrically distributed and the shape is also changed, it is possible to determine the polarity when the stick is stored and the operator can eliminate mistakes in the installation work.
【０００６】[0006]
【発明の効果】以上説明したように本発明は、ＳＯＰ部
品の形状を左右非対称にすることにより、スティックに
収められたＳＯＰ部品の極性の相違、又は作業者が実装
後のＳＯＰ部品の極性の相違を直ちに発見することがで
き、後工程に極性相違のまま流れることがないという効
果がある。As described above, according to the present invention, by making the shape of the SOP component asymmetrical, the polarity of the SOP component accommodated in the stick is different, or the polarity of the SOP component after mounting by the operator is different. The difference can be found immediately, and there is an effect that the polarity difference does not flow in the subsequent process.
【図１】本発明の一実施例の平面外観図である。FIG. 1 is a plan external view of an embodiment of the present invention.
【図２】従来の半導体表面実装部品の平面外観図であ
る。FIG. 2 is a plan external view of a conventional semiconductor surface mount component.
１８，２１ パッケージ本体 １９−１〜１９−１６，２１−１〜２１−１６ ピン 18,21 Package body 19-1 to 19-16, 21-1 to 21-16 pins
Claims (1)
２方向に複数個のリードとしてピンが突き出しているＳ
ＯＰ部品等の半導体表面実装部品において、前記プラス
チックパッケージの一方に突き出しているピン数と、他
方向に突き出しているピン数とを相違させ、かつパッケ
ージの形状も左右非対称の形状に成形していることを特
徴とする半導体表面実装部品。1. An active element is packaged in plastic, and pins are projected as a plurality of leads in two directions.
In a semiconductor surface mount component such as an OP component, the number of pins projecting on one side of the plastic package is different from the number of pins projecting in the other direction, and the package shape is also formed in an asymmetrical shape. A semiconductor surface mount component characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29943591A JPH05136325A (en) | 1991-11-15 | 1991-11-15 | Semiconductor surface-mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29943591A JPH05136325A (en) | 1991-11-15 | 1991-11-15 | Semiconductor surface-mounting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05136325A true JPH05136325A (en) | 1993-06-01 |
Family
ID=17872540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29943591A Withdrawn JPH05136325A (en) | 1991-11-15 | 1991-11-15 | Semiconductor surface-mounting component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05136325A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014166369A (en) * | 2014-03-14 | 2014-09-11 | Daito Giken:Kk | Game machine |
| JP2015110176A (en) * | 2015-03-26 | 2015-06-18 | 株式会社大都技研 | Game machine |
| JP2015116507A (en) * | 2015-03-20 | 2015-06-25 | 株式会社大都技研 | Game machine |
| JP2015134208A (en) * | 2015-03-23 | 2015-07-27 | 株式会社大都技研 | Game machine |
| JP2015163278A (en) * | 2015-06-15 | 2015-09-10 | 株式会社大都技研 | game machine |
| JP2016032640A (en) * | 2015-09-24 | 2016-03-10 | 株式会社大都技研 | Game board |
| JP2016137303A (en) * | 2016-03-31 | 2016-08-04 | 株式会社大都技研 | Amusement stand |
-
1991
- 1991-11-15 JP JP29943591A patent/JPH05136325A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014166369A (en) * | 2014-03-14 | 2014-09-11 | Daito Giken:Kk | Game machine |
| JP2015116507A (en) * | 2015-03-20 | 2015-06-25 | 株式会社大都技研 | Game machine |
| JP2015134208A (en) * | 2015-03-23 | 2015-07-27 | 株式会社大都技研 | Game machine |
| JP2015110176A (en) * | 2015-03-26 | 2015-06-18 | 株式会社大都技研 | Game machine |
| JP2015163278A (en) * | 2015-06-15 | 2015-09-10 | 株式会社大都技研 | game machine |
| JP2016032640A (en) * | 2015-09-24 | 2016-03-10 | 株式会社大都技研 | Game board |
| JP2016137303A (en) * | 2016-03-31 | 2016-08-04 | 株式会社大都技研 | Amusement stand |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |