JPH0513652U - Cooling structure of thin die - Google Patents

Cooling structure of thin die

Info

Publication number
JPH0513652U
JPH0513652U JP6832591U JP6832591U JPH0513652U JP H0513652 U JPH0513652 U JP H0513652U JP 6832591 U JP6832591 U JP 6832591U JP 6832591 U JP6832591 U JP 6832591U JP H0513652 U JPH0513652 U JP H0513652U
Authority
JP
Japan
Prior art keywords
cooling
cylinder
cooling water
inner cylinder
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6832591U
Other languages
Japanese (ja)
Inventor
康裕 小出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aichi Machine Industry Co Ltd
Original Assignee
Aichi Machine Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aichi Machine Industry Co Ltd filed Critical Aichi Machine Industry Co Ltd
Priority to JP6832591U priority Critical patent/JPH0513652U/en
Publication of JPH0513652U publication Critical patent/JPH0513652U/en
Pending legal-status Critical Current

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  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

(57)【要約】 【目的】金型における肉薄金型部の冷却機構により金型
のレイアウトが制限されないようにしかつ冷却効率を向
上させることを目的とする。 【構成】肉薄金型部(11)を冷却する熱伝導材(12)を金型
本体(15)側で冷却筒(13)内の冷却水により冷却する。該
冷却筒(13)は該熱伝導材(12)が挿入される内筒(13A) と
該内筒(13A) に上端部で連通する外筒(13B) とにより構
成し、下端部を外出させ、外出部分において内筒(13A)
に冷却水供給路(16A) 、外筒(13B) に冷却水排出路(16
B) を連絡する。
(57) [Abstract] [Purpose] The object is to prevent the layout of the mold from being restricted by the cooling mechanism of the thin mold part in the mold and to improve the cooling efficiency. [Structure] A heat conductive material (12) for cooling a thin mold part (11) is cooled by cooling water in a cooling cylinder (13) on the mold body (15) side. The cooling cylinder (13) is composed of an inner cylinder (13A) into which the heat conducting material (12) is inserted and an outer cylinder (13B) communicating with the inner cylinder (13A) at the upper end, and the lower end is exposed. The inner cylinder (13A)
To the cooling water supply channel (16A) and the outer tube (13B) to the cooling water discharge channel (16A).
Contact B).

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は例えば鋳造等に用いる金型における肉薄金型部の冷却構造に関するも のである。 The present invention relates to a cooling structure for a thin mold part in a mold used for casting, for example.

【0002】[0002]

【従来の技術】[Prior Art]

従来、図3に示すように金型本体であるホールデンブロック(5) の載置型(5A) から突出しているコアーピン、入子部等の肉薄金型部(1) を冷却するには、該ホ ールデンブロック(5) 側からサーモパイプ、銅棒等の熱伝導性の良い材料(熱伝 導材(2) )を該肉薄金型部(1) 内に挿入し、ホールデンブロック(5) 側において 該熱伝導材(2) を密栓(4) を施した水冷孔(3) 内に挿入し、該水冷孔(3) は該ホ ールデンブロック(5) を水平に横切る水導通孔(6) の中間に配置する構成が採用 されていた。 Conventionally, as shown in FIG. 3, in order to cool the thin mold part (1) such as the core pin and the insert part protruding from the mounting mold (5A) of the Holden block (5) which is the mold body, Insert a material with good thermal conductivity (heat transfer material (2)) such as a thermo pipe or copper rod from the Ruden block (5) side into the thin mold section (1), and insert it on the Holden block (5) side. Insert the heat conductive material (2) into the water cooling hole (3) with the stopper (4), and the water cooling hole (3) is located in the middle of the water conduction hole (6) that horizontally crosses the Holden block (5). The arrangement was adopted.

【0003】 上記構成においては、該水導通孔(6) に矢印に示すように冷却水を導通させる ことによって水冷孔(3) に該冷却水を供給更新させて該熱伝導材(2) をホールデ ンブロック(5) 側から冷却し、該熱伝導材(2) によって肉薄金型部(1) を冷却す る。In the above structure, cooling water is made to flow through the water conduction hole (6) as shown by an arrow to supply and renew the cooling water to the water cooling hole (3) so that the heat conducting material (2) is removed. The holder block (5) side is cooled, and the thin mold part (1) is cooled by the heat conducting material (2).

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら上記従来構成では、水導通孔(6) がホールデンブロック(5) 内を 水平に横切る構造となっているために金型のレイアウト上制限が多くなり、金型 レイアウトによっては肉薄金型部の冷却機構を設けることが不可能となり、また 熱伝導材(2) のみを冷却することが出来ず、肉薄金型部(1) の冷却効率が充分で ないと云う問題点があった。 However, in the above-mentioned conventional configuration, since the water conduction hole (6) horizontally traverses the Holden block (5), there are many restrictions on the layout of the mold, and depending on the mold layout, the thin mold part It was impossible to provide a cooling mechanism, and it was not possible to cool only the heat conductive material (2), and there was a problem that the cooling efficiency of the thin mold part (1) was not sufficient.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

本考案は上記従来の課題を解決するための手段として、肉薄金型部(11)内に金 型本体(15)から熱伝導材(12)を挿入し、該金型本体(15)側において該熱伝導材(1 2)を内筒(13A) と外筒(13B) とからなる冷却筒(13)の内筒(13A) 内に挿入し、該 内筒(13A) と外筒(13B) とは上端部において相互連絡し、下端部において該内筒 (13A) には冷却水供給路(16A) 、該外筒(13B) には冷却水排出路(16B) を金型本 体(15)の外側から直接連絡した肉薄金型部(11)の冷却構造を提供するものである 。 As a means for solving the above-mentioned conventional problems, the present invention inserts a heat conducting material (12) from a mold body (15) into a thin mold part (11), and at the mold body (15) side. Insert the heat conducting material (12) into the inner cylinder (13A) of the cooling cylinder (13) consisting of the inner cylinder (13A) and the outer cylinder (13B), and insert the inner cylinder (13A) and the outer cylinder (13B). ) With the cooling water supply passage (16A) in the inner cylinder (13A) and the cooling water discharge passage (16B) in the outer cylinder (13B) at the lower end. It provides a cooling structure for the thin mold part (11) directly connected from the outside of the (15).

【0005】[0005]

【作用】[Action]

冷却筒(13)の下端部において、内筒(13A) 内に冷却水供給路(16A) から冷却水 を供給する。該冷却水は該内筒(13A) 内を上昇し、上端部の連通孔(13C) から外 筒(13)内に流入し、該外筒(13B) 内を流下して下端部において冷却水排出路(16B ) から排出される。 Cooling water is supplied from the cooling water supply passage (16A) into the inner cylinder (13A) at the lower end of the cooling cylinder (13). The cooling water rises in the inner cylinder (13A), flows into the outer cylinder (13) from the communication hole (13C) at the upper end, flows down in the outer cylinder (13B), and cools at the lower end. It is discharged from the discharge channel (16B).

【0006】 このようにして冷却水は冷却筒(13)内に供給更新され、内筒(13A) 内に挿入さ れている熱伝導材(12)を金型本体(15)側から冷却し、該熱伝導材(12)は肉薄金型 部(11)を冷却する。 該冷却筒(13)の冷却水供給路(16A) と排出路(16B) とは金型本体(15)の外側か ら該冷却筒(13)下端部に直接連絡しているので、金型本体(15)は該供給路(16A) と排出路(16B) に接触せずかつ干渉されない。In this way, the cooling water is supplied and renewed in the cooling cylinder (13), and the heat conducting material (12) inserted in the inner cylinder (13A) is cooled from the mold body (15) side. The heat conducting material (12) cools the thin mold part (11). Since the cooling water supply path (16A) and the discharge path (16B) of the cooling cylinder (13) are directly connected to the lower end of the cooling cylinder (13) from the outside of the mold body (15), The main body (15) does not contact and is not interfered with by the supply passage (16A) and the discharge passage (16B).

【0007】[0007]

【実施例】【Example】

本考案を図1および図2に示す一実施例によって説明すれば、(15)は金型本体 であるホールデンブロックであり、該ホールデンブロック(15)の載置型(15A) か らはコアーピン、入子部等の肉薄金型部(11)が突出しており、該肉薄金型部(11) 内にはホールデンブロック(15)側からサーモパイプ、銅棒等の熱伝導材(12)が挿 入され、該熱伝導材(12)はホールデンブロック(15)側において内筒(13A) と外筒 (13B) とからなる冷却筒(13)の内筒(13A) 内に挿入されている。 The present invention will be described with reference to an embodiment shown in FIGS. 1 and 2. (15) is a Holden block which is a mold body, and the holding mold (15A) of the Holden block (15A) has a core pin, The thin mold part (11) such as a child part is projected, and the heat conductive material (12) such as a thermo pipe or a copper rod is inserted into the thin mold part (11) from the Holden block (15) side. The heat conducting material (12) is inserted into the inner cylinder (13A) of the cooling cylinder (13) including the inner cylinder (13A) and the outer cylinder (13B) on the Holden block (15) side.

【0008】 該内筒(13A) と該外筒(13B) とは上端部において連通孔(13C) によって相互連 通し、下端部において該内筒(13A) にはコネクタ(16C) を介して冷却水供給路(1 6A) が連絡し、該外筒(13B) にはコネクタ(16D) を介して冷却水排出路(16B) が 連絡している。そして冷却筒(13)上端にはOリング(13D) を有するキャップ(13E ) が被着されて冷却水の外側への漏洩を防止している。The inner cylinder (13A) and the outer cylinder (13B) communicate with each other through a communication hole (13C) at the upper end, and the inner cylinder (13A) cools at the lower end through a connector (16C). The water supply passage (16A) communicates with the outer cylinder (13B), and the cooling water discharge passage (16B) communicates with the outer cylinder (13B) through the connector (16D). A cap (13E) having an O-ring (13D) is attached to the upper end of the cooling cylinder (13) to prevent the cooling water from leaking to the outside.

【0009】 なお、該冷却筒(13)の下端はホールデンブロック(15)の下面から形成されてい る溝(15B) 内に外出しており、Oリング(17A) でシールされている取付金具(17) によって支持されており、該冷却筒(13)の下端外出部にはホールデンブロック(1 5)の外部から冷却水供給路(16A) と冷却水排出路(16B) とが直接冷却筒(13)に連 絡し、ホールデンブロック(15)の他の部分が該冷却水供給路(16A) と冷却水排出 路(16B) によって冷却されないようにされており、また冷却筒(13)とホールデン ブロック(15)との間にも若干の間隙Sが設けられ、冷却筒(13)の周りのホールデ ンブロック(15)部分がなるべく冷却されないようにされている。The lower end of the cooling cylinder (13) goes out into a groove (15B) formed from the lower surface of the holden block (15), and a mounting metal fitting (sealed with an O-ring (17A) ( The cooling water supply passage (16A) and the cooling water discharge passage (16B) are directly connected to the outside of the lower end of the cooling cylinder (13) from the outside of the Holden block (15). 13) so that the other parts of the Holden block (15) are not cooled by the cooling water supply passage (16A) and the cooling water discharge passage (16B), and the cooling cylinder (13) and the Holden block A small gap S is also provided between the block (15) and the holder block (15) around the cooling cylinder (13) so that it is not cooled as much as possible.

【0010】 上記構成において、冷却筒(13)の下端部において、図2矢印に示すように冷却 水供給路(16A) から内筒(13A) 内に冷却水を供給し、該冷却水は該内筒(13A) 内 を上昇し、上端部において連通孔(13C) から外筒(13B) 内に流入し、該外筒(13B ) 内を流下して下端部において排出路(16B) から排出される。 このようにして冷却水は冷却筒(13)内に供給更新され、内筒(13A) 内に挿入さ れている熱伝導材(12)をホールデンブロック(15)側から冷却し、該熱伝導材(12) は肉薄金型部(11)を冷却する。In the above structure, at the lower end of the cooling cylinder (13), cooling water is supplied from the cooling water supply passage (16A) into the inner cylinder (13A) as shown by the arrow in FIG. It rises in the inner cylinder (13A), flows into the outer cylinder (13B) from the communication hole (13C) at the upper end, flows down in the outer cylinder (13B), and is discharged from the discharge passage (16B) at the lower end. To be done. In this way, the cooling water is supplied to the cooling cylinder (13) and renewed, and the heat conducting material (12) inserted in the inner cylinder (13A) is cooled from the Holden block (15) side to The material (12) cools the thin mold part (11).

【0011】[0011]

【考案の効果】[Effect of the device]

したがって本考案においては冷却水供給路と排出路が金型本体外部から直接冷 却筒に連絡しているから、熱伝導材のみを冷却することが出来冷却効率が向上し かつ金型の他の部分へ冷却が及ぼされない。そして金型本体は該冷却水供給路と 排出路とによって干渉されないから金型レイアウト上の制限が解消される。 Therefore, in the present invention, since the cooling water supply passage and the discharge passage are directly connected to the cooling tube from the outside of the die main body, only the heat conductive material can be cooled, the cooling efficiency is improved, and the other die No cooling is applied to the part. Since the mold body is not interfered with by the cooling water supply passage and the discharge passage, restrictions on the layout of the mold are eliminated.

【0012】[0012]

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例の側断面図FIG. 1 is a side sectional view of an embodiment of the present invention.

【図2】肉薄金型部分の拡大側断面図FIG. 2 is an enlarged side sectional view of a thin mold portion.

【図3】従来例の側断面図FIG. 3 is a side sectional view of a conventional example.

【符号の説明】[Explanation of symbols]

11 肉薄金型部 12 熱伝導材 13 冷却筒 13A 内筒 13B 外筒 13C 連通孔 15 ホールデンブロック 16A 冷却水供給路 16B 冷却水排出路 11 Thin mold part 12 Thermal conductive material 13 Cooling tube 13A Inner tube 13B Outer tube 13C Communication hole 15 Holden block 16A Cooling water supply path 16B Cooling water discharge path

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】肉薄金型部内に金型本体から熱伝導材を挿
入し、該金型本体側において該熱伝導材を内筒と外筒と
からなる冷却筒の内筒内に挿入し、該内筒と外筒とは上
端部において相互連絡し、下端部において該内筒には冷
却水供給路、該外筒には冷却水排出路を金型本体の外側
から直接連絡したことを特徴とする肉薄金型部の冷却構
1. A heat conductive material is inserted from a mold body into a thin mold part, and the heat conductive material is inserted into an inner cylinder of a cooling cylinder composed of an inner cylinder and an outer cylinder on the mold body side. The inner cylinder and the outer cylinder are interconnected at the upper end, and at the lower end, a cooling water supply passage is connected to the inner cylinder and a cooling water discharge passage is directly connected to the outer cylinder from the outside of the mold body. Cooling structure for thin die
JP6832591U 1991-07-31 1991-07-31 Cooling structure of thin die Pending JPH0513652U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6832591U JPH0513652U (en) 1991-07-31 1991-07-31 Cooling structure of thin die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6832591U JPH0513652U (en) 1991-07-31 1991-07-31 Cooling structure of thin die

Publications (1)

Publication Number Publication Date
JPH0513652U true JPH0513652U (en) 1993-02-23

Family

ID=13370563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6832591U Pending JPH0513652U (en) 1991-07-31 1991-07-31 Cooling structure of thin die

Country Status (1)

Country Link
JP (1) JPH0513652U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140004738A (en) * 2011-01-25 2014-01-13 레고 에이/에스 A method for the manufacture of a mould part with channel for temperature regulation and a mould part made by the method
CN119704587A (en) * 2023-09-28 2025-03-28 上海庆良电子有限公司 Cooling structure for injection mold and injection mold convenient for cooling internal product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199741A (en) * 1984-10-20 1986-05-17 Mitsubishi Heavy Ind Ltd Differential gear
JPH0338102A (en) * 1989-07-05 1991-02-19 Mitsubishi Electric Corp Microstrip antenna

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199741A (en) * 1984-10-20 1986-05-17 Mitsubishi Heavy Ind Ltd Differential gear
JPH0338102A (en) * 1989-07-05 1991-02-19 Mitsubishi Electric Corp Microstrip antenna

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140004738A (en) * 2011-01-25 2014-01-13 레고 에이/에스 A method for the manufacture of a mould part with channel for temperature regulation and a mould part made by the method
JP2014509960A (en) * 2011-01-25 2014-04-24 レゴ エー/エス Method of manufacturing mold part having channel for temperature control, and mold part manufactured by the method
CN119704587A (en) * 2023-09-28 2025-03-28 上海庆良电子有限公司 Cooling structure for injection mold and injection mold convenient for cooling internal product

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