JPH0514018A - Directional coupler - Google Patents
Directional couplerInfo
- Publication number
- JPH0514018A JPH0514018A JP15701791A JP15701791A JPH0514018A JP H0514018 A JPH0514018 A JP H0514018A JP 15701791 A JP15701791 A JP 15701791A JP 15701791 A JP15701791 A JP 15701791A JP H0514018 A JPH0514018 A JP H0514018A
- Authority
- JP
- Japan
- Prior art keywords
- transmission line
- dielectric substrate
- coupling
- main transmission
- port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】 （修正有）
【構成】主伝送路１とカップリング伝送路２を誘電体基
板上に成膜する。主伝送路１とカップリング伝送路２の
入、出射ポートＰ１，Ｐ２とカップリング伝送路に接続
された引出端子Ｐ３，Ｐ４を誘電体の基底の一辺に設
け、主伝送路とカップリング伝送路をオーバーコート
７，８，９で電磁遮蔽する。また、主伝送路を成膜する
誘電体基板とカップリング伝送路を成膜する誘電体基板
を相互に背面実装する。
【効果】プリント基板に佇立して実装可能とし、スペー
スファクタの改善、外部回路からの妨害信号の防止を図
る。また、背面実装により反射波カップリング伝送路を
追加できる。
(57) [Summary] (Correction) [Structure] The main transmission line 1 and the coupling transmission line 2 are formed on a dielectric substrate. The main transmission line 1 and the coupling transmission line 2 are connected to the input / output ports P 1 and P 2 and the lead-out terminals P 3 and P 4 connected to the coupling transmission line are provided at one side of the base of the dielectric to connect with the main transmission line. The coupling transmission line is electromagnetically shielded by the overcoats 7, 8 and 9. Further, the dielectric substrate on which the main transmission line is formed and the dielectric substrate on which the coupling transmission line is formed are mutually mounted on the back side. [Effect] It can be mounted upright on a printed circuit board to improve the space factor and prevent interference signals from external circuits. In addition, a reflected wave coupling transmission line can be added by mounting on the back surface.
Description
【０００１】[0001]
【産業上の利用分野】本発明は方向性結合器に係わり、
特に佇立した誘電体基板の基底の一辺に主伝送路及びカ
ップリング伝送路の入、出射ポート及びカップリング側
ボートが接続された引出端子を設けた方向性結合器に関
する。FIELD OF THE INVENTION The present invention relates to a directional coupler,
In particular, the present invention relates to a directional coupler having a standing dielectric substrate on one side of which a main transmission line and a coupling transmission line are connected to an input / output port and a lead-out terminal to which a coupling-side boat is connected.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】一般に
自動車電話、携帯電話等に用いる方向性結合器は誘電体
基板上に主伝送路と、主伝送路に平行したカップリング
伝送路を成膜する。主伝送路の入、出射ポート及びカッ
プリング側ポートは誘電体基板上の一方並びに他方の辺
に設けられた引出端子に接続され、この引出端子を経由
してマイクロ波を出力する。主伝送路の一方の入射ポー
トから入力されるマイクロ波の電力をＰｉ、他方の出射
ポートから出力される電力をＰｏとすれば、ＰｉとＰｏ
の電力比は挿入損（insertion loss）となる。また、カ
ップリング伝送路の一方の側から出力される進行波をＰ
ｆ、他方の側へ出力される反射波をＰｒとすればＰｉと
Ｐｆの電力比は結合度（coupling）、ＰｆとＰｒの電力
比は方向性（directivity）となる。誘電体基板上に設
けられた分布定数回路要素で方向性結合器を形成する
と、取扱うマイクロ波が９００ＭＨＺのときの完成品の
面積は５mm×４.５mm、プリント基板に対する高さは０.
６mm程度となる。なお、この場合の主伝送路とカップリ
ング伝送路はマイクロストリップ線路で形成された４端
子網と見做されるので入、出射ポート及びカップリング
側ポートに接続される引出端子は誘電体基板上の対応し
た辺にそれぞれ実装される。このため、プリント基板に
対するスペースファクタは回路パタ−ンを成膜する誘電
体基板の厚みに関係なく基板の面積により決定される。
この基板の面積は上述したように略々５mm×５mm程度前
後であるから従来技術による場合はプリント基板上のス
ペースファクタは上記面積以下に改善でない難点があ
る。2. Description of the Related Art Generally, a directional coupler used for a car phone, a mobile phone, etc. is formed by forming a main transmission line and a coupling transmission line parallel to the main transmission line on a dielectric substrate. To do. The input and output ports and the coupling-side port of the main transmission line are connected to extraction terminals provided on one side and the other side of the dielectric substrate, and microwaves are output via these extraction terminals. If the power of the microwave input from one of the entrance ports of the main transmission path is Pi and the power of the other output port is Po, then Pi and Po
The power ratio of is the insertion loss. In addition, the traveling wave output from one side of the coupling transmission line is
f, where Pr is the reflected wave output to the other side, the power ratio between Pi and Pf is coupling, and the power ratio between Pf and Pr is directivity. When a directional coupler is formed with distributed constant circuit elements provided on a dielectric substrate, the area of the finished product is 5 mm x 4.5 mm when the microwave to be handled is 900 MHZ, and the height to the printed circuit board is 0.
It will be about 6 mm. Since the main transmission line and the coupling transmission line in this case are regarded as a four-terminal network formed of microstrip lines, the lead-out terminals connected to the input and output ports and the coupling-side port are on the dielectric substrate. It is implemented on each side corresponding to. Therefore, the space factor for the printed circuit board is determined by the area of the substrate regardless of the thickness of the dielectric substrate on which the circuit pattern is formed.
Since the area of this board is about 5 mm × 5 mm as described above, there is a problem that the space factor on the printed board is not improved below the above area in the case of the prior art.
【０００３】[0003]
【発明の目的】本発明は上述した点に鑑みなされたもの
で、主伝送路とカップリング伝送路の入、出射ポート及
びカップリング側ポートが接続される引出端子を誘電体
基板の基底の一辺に設けることにより、プリント基板は
佇立して実装可能とし、スペースファクタの改善、外部
回路からの妨害信号の防止が図れる方向性結合器を提供
することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned points, and the lead-out terminal for connecting the input / output ports of the main transmission line and the coupling transmission line and the coupling-side port to one side of the base of the dielectric substrate. It is an object of the present invention to provide a directional coupler in which the printed circuit board can be mounted upright and the space factor can be improved and an interference signal from an external circuit can be prevented.
【０００４】[0004]
【課題を解決するための手段】本発明による方向性結合
器は、マイクロ波の４分の１波長に対応した長さで誘電
体基板上に成膜された入射ポ−トと出射ポ−トを有する
主伝送路と、主伝送路に平行して設けられ入射ポ−ト並
びに出射ポ−トに対応したカップリング側ポ−トを有す
るカップリング伝送路と、佇立した誘電体基板の基底の
−辺に設けられた引出端子と、入射ポ−ト、出射ポ−ト
及びカップリング側ポ−トが引出端子に接続された主伝
送路並びにカップリング伝送路を電磁遮蔽する電磁遮蔽
用オ−バコ−トとで構成する。SUMMARY OF THE INVENTION A directional coupler according to the present invention comprises an entrance port and an exit port formed on a dielectric substrate with a length corresponding to a quarter wavelength of a microwave. And a coupling transmission line provided in parallel with the main transmission line and having a coupling side port corresponding to an incident port and an emission port, and a base of the standing dielectric substrate. -An electromagnetic shield for electromagnetically shielding the lead-out terminal provided on the side and the main transmission line and the coupling transmission line in which the entrance port, the exit port, and the coupling-side port are connected to the lead-out terminal. It consists of a bacoat.
【０００５】また、本発明による方向性結合器の誘電体
基板は、主伝送路が成膜された第１の誘電体基板と、カ
ップリング伝送路が成膜され、かつ、第１の誘電体基板
の背面に設けらた第２の誘電体基板とで構成する。The dielectric substrate of the directional coupler according to the present invention includes a first dielectric substrate having a main transmission line formed thereon and a coupling transmission line having a first transmission line formed thereon. It is composed of a second dielectric substrate provided on the back surface of the substrate.
【０００６】[0006]
【作用】主伝送路とカップリング伝送路を誘電体基板上
に成膜する。主伝送路とカップリング伝送路の入、出射
ポートとカップリング側ポートに接続された引出端子を
誘電体基板の基底の一辺に設け、主伝送路とカップリン
グ伝送路をオーバーコートで電磁遮蔽する。Function: The main transmission line and the coupling transmission line are formed on the dielectric substrate. The output terminals connected to the input and output ports of the main transmission line and the coupling transmission line and the coupling side port are provided on one side of the base of the dielectric substrate, and the main transmission line and the coupling transmission line are electromagnetically shielded by an overcoat. .
【０００７】また、主伝送路を成膜する誘電体基板とカ
ップリング伝送路を成膜する誘電体基板を相互に背面実
装する。Further, the dielectric substrate on which the main transmission line is formed and the dielectric substrate on which the coupling transmission line is formed are back-mounted on each other.
【０００８】[0008]
【実施例】以下、本発明による方向性結合器の一実施例
を図１、図８に従って詳述する。図１において、１は主
伝送路である。主伝送路１は高さＬＹが２.５mm、幅Ｌ
Ｘが４.９９mm、奥行ＬＺが０.６３５mmの誘電体基板上
に成膜する。また、主伝送路１の入射ポートをピン
Ｐ1、出射ポートをピンＰ2と接続する。また、主伝送路
１に平行してカップリング側伝送路２を成膜し、カップ
リング伝送路３の＃１分配出力をピンＰ3と、＃２分配
出力を終端抵抗４を介してピンＰ4と接続する。主伝送
路１とカップリング伝送路２の回路パターン幅Ｗ1とＷ3
は０.６mm、パターン相互の幅Ｗ2は０.３mmである。主
伝送路１とカップリング伝送路２を図２、図３に示すよ
うに絶縁オーバーコート７で絶縁した上に電磁遮蔽オー
バーコート８で包み、最後に外装オーバーコート９を塗
って完成品とする。絶縁オーバーコート７はガラスペー
スト、電磁遮蔽オーバーコート８はフェノール系銅ペー
スト、外装オーバーコートはエポキシ系樹脂ペーストを
使用する。また、誘電体基板は誘電率εが９.７のアル
ミナ、回路パターンは金９０％、ガラス１０％のペース
トを使用する。また、ピンＰ1〜Ｐ2は銀８７％、パラジ
ュム１３％ペーストを用いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the directional coupler according to the present invention will be described in detail below with reference to FIGS. In FIG. 1, reference numeral 1 is a main transmission line. The main transmission line 1 has a height LY of 2.5 mm and a width L.
A film is formed on a dielectric substrate having X of 4.99 mm and depth LZ of 0.635 mm. Further, the entrance port of the main transmission line 1 is connected to the pin P 1 and the exit port thereof is connected to the pin P 2 . Further, the coupling side transmission line 2 is formed in parallel with the main transmission line 1, and the # 1 distribution output of the coupling transmission line 3 and the # 2 distribution output of the coupling transmission line 3 through the terminal resistor 4 and the pin P, respectively. Connect with 4 . Circuit pattern widths W 1 and W 3 of the main transmission line 1 and the coupling transmission line 2
Is 0.6 mm, and the mutual width W 2 of the patterns is 0.3 mm. As shown in FIGS. 2 and 3, the main transmission line 1 and the coupling transmission line 2 are insulated by the insulating overcoat 7, wrapped with the electromagnetic shielding overcoat 8, and finally the outer overcoat 9 is applied to complete the product. . The insulating overcoat 7 is a glass paste, the electromagnetic shielding overcoat 8 is a phenolic copper paste, and the exterior overcoat is an epoxy resin paste. Further, the dielectric substrate is made of alumina having a dielectric constant ε of 9.7, and the circuit pattern is made of paste of 90% gold and 10% glass. For the pins P 1 and P 2 , a paste containing 87% silver and 13% palladium is used.
【０００９】図４と図５に主伝送路１を成膜した誘電体
基板と、カップリング伝送路を成膜した誘電体基板で相
互に背面実装した例を示す。背面実装した回路パターン
の引出端子相当位置にダミーピンＰＤを設ける。図６、
図７、図８に反射波カップリング伝送路３を背面に設け
た例を示す。反射波カップリング伝送路３は図８に示す
ように、＃３分配出力となるＰ5と＃４分配出力となる
Ｐ6を設け、かつ、両側にダミーピンＰＤ、ＰＤを設け
る。対応する主伝送路１と進行波側となるカップリング
伝送路２を成膜した図６に示す誘電体基板の各部寸法は
図１の場合と同じである。FIG. 4 and FIG. 5 show examples in which the dielectric substrate on which the main transmission line 1 is formed and the dielectric substrate on which the coupling transmission line is formed are mutually back-mounted. Dummy pins PD are provided at positions corresponding to the lead-out terminals of the circuit pattern mounted on the back surface. 6,
7 and 8 show an example in which the reflected wave coupling transmission line 3 is provided on the back surface. As shown in FIG. 8, the reflected wave coupling transmission line 3 is provided with P 5 serving as # 3 distribution output and P 6 serving as # 4 distribution output, and dummy pins PD and PD on both sides. The dimensions of each part of the dielectric substrate shown in FIG. 6 on which the corresponding main transmission line 1 and the coupling transmission line 2 on the traveling wave side are formed are the same as those in FIG.
【００１０】上記構成の方向性結合器で０.９ＧＨＺの
マイクロ波を入射すると、挿入損失−０.３ｄＢ、結合
度−２０ｄＢ、電圧定在波比（ＶＳＷＲ）が１.３とな
り、周辺回路から入射される電磁波から影響は測定でき
ない程度に少ない。また、実装スペースは従来に比べて
半分以下となりスペースファクタが改善されている。ピ
ンＰ1〜Ｐ6及びダミーピンＰＤの構造は上記実施例に限
定せず、プリント基板に差込める構造としてもよい。When a 0.9 GHz microwave is incident on the directional coupler having the above-mentioned structure, the insertion loss becomes -0.3 dB, the coupling degree becomes -20 dB, and the voltage standing wave ratio (VSWR) becomes 1.3, so that the peripheral circuit can detect it. The effect of incident electromagnetic waves is so small that it cannot be measured. In addition, the mounting space is less than half that of conventional products, improving the space factor. The structure of the pins P 1 to P 6 and the dummy pin PD is not limited to the above-mentioned embodiment, and may be a structure that can be inserted into the printed board.
【００１１】[0011]
【発明の効果】本発明による方向性結合器は、マイクロ
波の４分の１波長の長さで誘電体基板上に成膜された入
射ポ−トと出射ポ−トを有する主伝送路と、主伝送路に
平行して設けられ入射ポ−ト並びに出射ポ−トに対応し
たカップリング側ポ−トを有するカップリング伝送路
と、佇立した誘電体基板の基底の−辺に設けられた引出
端子と、入射ポ−ト、出射ポ−ト及びカップリング側ポ
−トが引出端子に接続された主伝送路並びにカップリン
グ伝送路を電磁遮蔽する電磁遮蔽用オ−バコ−トとで構
成されているのでプリント基板に佇立して実装可能と
し、スペースファクタの改善、外部回路からの妨害信号
の防止が図れる効果がある。The directional coupler according to the present invention comprises a main transmission line having an entrance port and an exit port formed on a dielectric substrate with a length of a quarter wavelength of a microwave. , A coupling transmission line provided in parallel with the main transmission line and having a coupling-side port corresponding to an entrance port and an exit port, and a base-side of a standing dielectric substrate. Consists of a lead-out terminal and an electromagnetic shielding overcoat that electromagnetically shields the main transmission line and the coupling transmission line in which the entrance port, the exit port, and the coupling-side port are connected to the lead-out terminal. Therefore, it can be mounted upright on the printed circuit board, and the space factor can be improved and the interference signal from the external circuit can be prevented.
【００１２】また、本発明による方向性結合器の誘電体
基板は、主伝送路が成膜された第１の誘電体基板と、カ
ップリング伝送路が成膜され、かつ、第１の誘電体基板
の背面に設けらた第２の誘電体基板とで構成すればプリ
ント基板に佇立して実装可能であるほか、反射波カップ
リング伝送路を実装できる効果がある。The dielectric substrate of the directional coupler according to the present invention includes a first dielectric substrate on which a main transmission line is formed and a coupling transmission line on which a first dielectric substrate is formed. If the second dielectric substrate is provided on the back surface of the substrate, it can be mounted upright on the printed circuit board, and the reflected wave coupling transmission line can be mounted.
【図１】本発明による方向性結合器の一実施例を示す斜
視図FIG. 1 is a perspective view showing an embodiment of a directional coupler according to the present invention.
【図２】本発明による方向性結合器のオーバーコートの
一実施例を示す一部破断した正面図FIG. 2 is a partially cutaway front view showing an embodiment of an overcoat of a directional coupler according to the present invention.
【図３】本発明による方向性結合器のオーバーコートの
一実施例を示す一部破断した側面図FIG. 3 is a partially cutaway side view showing an embodiment of an overcoat of a directional coupler according to the present invention.
【図４】本発明による方向性結合器の他の実施例を示す
正面図FIG. 4 is a front view showing another embodiment of the directional coupler according to the present invention.
【図５】本発明による方向性結合器の他の実施例を示す
背面図FIG. 5 is a rear view showing another embodiment of the directional coupler according to the present invention.
【図６】本発明による方向性結合器の反射波カップリン
グ伝送路を設けた実施例を示す正面図FIG. 6 is a front view showing an embodiment in which a reflected wave coupling transmission line of a directional coupler according to the present invention is provided.
【図７】本発明による方向性結合器の反射波カップリン
グ伝送路を設けた一実施例を示す側面図FIG. 7 is a side view showing an embodiment in which a reflected wave coupling transmission line of the directional coupler according to the present invention is provided.
【図８】本発明による方向性結合器の反射波カップリン
グ伝送路を設けた一実施例を示す背面図FIG. 8 is a rear view showing an embodiment in which a reflected wave coupling transmission line of the directional coupler according to the present invention is provided.
１・・・・・・主伝送路 ２・・・・・・カップリング伝送路 ３・・・・・・反射波カップリング伝送路 Ｐ1・・・・・・ピン（入射ポート用引出端子） Ｐ2・・・・・・ピン（出射ポート用引出端子） Ｐ3・・・・・・ピン（＃１分配出力用引出端子） Ｐ4・・・・・・ピン（＃２分配出力用引出端子） Ｐ5・・・・・・ピン（＃３分配出力用引出端子） Ｐ6・・・・・・ピン（＃４分配出力用引出端子）1-Main transmission line 2--Coupling transmission line 3--Reflected wave coupling transmission line P 1- Pin (Injection port lead-out terminal) P 2 ··· Pin (extractor port for output port) P 3 ··· Pin (# 1 output terminal for distribution output) P 4 ··· Pin (# 2 output pin for distribution output) Terminal) P 5 --- pin (# 3 distribution output lead-out terminal) P 6 --- pin (# 4 distribution output lead-out terminal)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 富田康則 埼玉県秩父郡吉田町大字下吉田6972 株式 会社タイセー内 (72)発明者 安藤幸浩 埼玉県秩父郡吉田町大字下吉田6972 株式 会社タイセー内 (72)発明者 掘田 充 埼玉県秩父郡吉田町大字下吉田6972 株式 会社タイセー内 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Yasunori Tomita 6972 Shimoyoshida, Yoshida-cho, Chichibu-gun, Saitama Company Taisei (72) Inventor Yukihiro Ando 6972 Shimoyoshida, Yoshida-cho, Chichibu-gun, Saitama Company Taisei (72) Inventor Mitsuru Horita 6972 Shimoyoshida, Yoshida-cho, Chichibu-gun, Saitama Company Taisei
Claims (2)
で誘電体基板上に成膜された入射ポ−トと出射ポ−トを
有する主伝送路と、前記主伝送路に平行して設けられ前
記入射ポ−ト並びに出射ポ−トに対応したカップリング
側ポ−トを有するカップリング伝送路と、佇立した前記
誘電体基板の基底の−辺に設けられた引出端子と、前記
入射ポ−ト、前記出射ポ−ト及び前記カップリング側ポ
−トが前記引出端子に接続された前記主伝送路並びに前
記カップリング伝送路を電磁遮蔽する電磁遮蔽用オ−バ
コ−トとを備えたことを特徴とする方向性結合器。1. A main transmission line having an entrance port and an exit port formed on a dielectric substrate in a length corresponding to a quarter wavelength of a microwave, and parallel to the main transmission line. A coupling transmission line having a coupling-side port corresponding to the entrance port and the exit port, and a lead terminal provided on the negative side of the base of the standing dielectric substrate, An electromagnetic shielding overcoat for electromagnetically shielding the main transmission line and the coupling transmission line in which the entrance port, the exit port, and the coupling-side port are connected to the lead-out terminal. A directional coupler characterized by comprising.
板と、前記カップリング伝送路が成膜され、かつ、前記
第１の誘電体基板の背面に設けらた第２の誘電体基板と
を備えたことを特徴とする請求項１記載の方向性結合
器。2. A first dielectric substrate on which the main transmission line is formed, and a second dielectric substrate on which the coupling transmission line is formed and which is provided on the back surface of the first dielectric substrate. The directional coupler according to claim 1, further comprising a dielectric substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15701791A JPH0514018A (en) | 1991-06-27 | 1991-06-27 | Directional coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15701791A JPH0514018A (en) | 1991-06-27 | 1991-06-27 | Directional coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0514018A true JPH0514018A (en) | 1993-01-22 |
Family
ID=15640364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15701791A Pending JPH0514018A (en) | 1991-06-27 | 1991-06-27 | Directional coupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514018A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017008B2 (en) * | 1981-04-23 | 1985-04-30 | 昭和アルミニウム株式会社 | Aluminum refining method |
| JPS6313502A (en) * | 1986-07-04 | 1988-01-20 | Yuniden Kk | Microwave directional coupler |
| JPS6318163U (en) * | 1986-07-19 | 1988-02-06 | ||
| JPH0244408B2 (en) * | 1984-09-03 | 1990-10-03 | Nippon Denki Kk | EKOOKYANSERAGATASOHOKOZOFUKUKI |
-
1991
- 1991-06-27 JP JP15701791A patent/JPH0514018A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017008B2 (en) * | 1981-04-23 | 1985-04-30 | 昭和アルミニウム株式会社 | Aluminum refining method |
| JPH0244408B2 (en) * | 1984-09-03 | 1990-10-03 | Nippon Denki Kk | EKOOKYANSERAGATASOHOKOZOFUKUKI |
| JPS6313502A (en) * | 1986-07-04 | 1988-01-20 | Yuniden Kk | Microwave directional coupler |
| JPS6318163U (en) * | 1986-07-19 | 1988-02-06 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
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