JPH0514021A - Support device for dielectric resonator - Google Patents
Support device for dielectric resonatorInfo
- Publication number
- JPH0514021A JPH0514021A JP16283191A JP16283191A JPH0514021A JP H0514021 A JPH0514021 A JP H0514021A JP 16283191 A JP16283191 A JP 16283191A JP 16283191 A JP16283191 A JP 16283191A JP H0514021 A JPH0514021 A JP H0514021A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric resonator
- transmission line
- mounting portion
- high frequency
- support device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
(57)【要約】
【目的】この発明は、低損失な実装を実現したうえで、
結合強度の向上と共に、接合作業の簡略化を図り得るよ
うにすることにある。
【構成】支持台１２に伝送線部１０ａに対して所定の間
隔を有して対向される載置部１２ａ、及び該載置部１２
ａの一端部に上記高周波基板１０に接着剤１３を用いて
接合される接合部１２ｂを形成し、この支持台１２を用
いて誘電体共振器１１を高周波基板１０に実装するよう
に構成した。これによれば、低損失な実装を実現したう
えで、誘電体共振器１１と伝送線部１０ａとの結合強度
の向上を図る得るようにしたものである。
(57) [Summary] [Object] The present invention realizes low-loss mounting and
It is to improve the bonding strength and simplify the joining work. [Structure] A mounting portion 12a facing a transmission line portion 10a on a support base 12 with a predetermined gap, and the mounting portion 12a.
A joining portion 12b joined to the high frequency substrate 10 by using the adhesive 13 is formed at one end of a, and the dielectric resonator 11 is mounted on the high frequency substrate 10 using the support 12. According to this, it is possible to realize the mounting with low loss and to improve the coupling strength between the dielectric resonator 11 and the transmission line portion 10a.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えばマイクロ波帯
の発振器及びろ波器等を構成する誘電体共振器を実装す
るのに用いられる誘電体共振器の支持台装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support device for a dielectric resonator used for mounting a dielectric resonator which constitutes, for example, a microwave band oscillator and a filter.
【０００２】[0002]
【従来の技術】一般に、誘電体共振器の支持台装置は、
図４に示すように誘電体共振器１が支持台２に取付けら
れ、この支持台２は、例えば石英等の高周波的に損失の
少ない材料で形成され、発振器等が構成される高周波基
板３の伝送線路３ａの近傍の所定の位置に接着剤４を用
いて接合される。この際、誘電体共振器１と伝送線路３
ａの結合の度合は、主に誘電体共振器１と伝送線路３ａ
の配置間隔に応じて決定される。2. Description of the Related Art Generally, a support device for a dielectric resonator is
As shown in FIG. 4, a dielectric resonator 1 is attached to a support base 2, and the support base 2 is formed of a material such as quartz having a small loss in high frequency, and a high frequency substrate 3 of an oscillator or the like is formed. It is bonded to a predetermined position near the transmission line 3a with an adhesive 4. At this time, the dielectric resonator 1 and the transmission line 3
The degree of coupling of a mainly depends on the dielectric resonator 1 and the transmission line 3a.
It is decided according to the arrangement interval of.
【０００３】ところが、上記誘電体共振器の支持台装置
では、誘電体共振器１を伝送線路３ａに対して一定の間
隔を有して並設して実装する構成上、結合の度合に制約
があり、例えば発振器を構成した場合には、安定度の劣
化を招き、ろ波器を構成した場合には、帯域特性の劣化
を招くという問題を有していた。また、これによると、
支持台２を誘電体共振器１と伝送線路３ａの結合の度合
等の関係上、誘電体共振器１に比べて小さくなるため
に、支持台２を高周波基板に接合する際、誘電体共振器
１が邪魔となり、その接合作業が非常に面倒であるとい
う問題を有していた。However, in the above-described dielectric resonator support device, the degree of coupling is restricted because the dielectric resonators 1 are mounted side by side with respect to the transmission line 3a with a certain space therebetween. However, there is a problem in that, for example, when an oscillator is configured, stability is deteriorated, and when a filter is configured, band characteristics are deteriorated. Also according to this,
Since the support base 2 is smaller than the dielectric resonator 1 in terms of the degree of coupling between the dielectric resonator 1 and the transmission line 3a, when the support base 2 is bonded to the high frequency substrate, the dielectric resonator is used. There was a problem that 1 was an obstacle and the joining work was very troublesome.
【０００４】[0004]
【発明が解決しようとする課題】以上述べたように、従
来の誘電体共振器の支持台装置では、結合の度合に制約
を受けると共に、その接合作業が非常に面倒であるとい
う問題を有していた。As described above, the conventional support device for a dielectric resonator has a problem that the degree of coupling is restricted and the joining work is very troublesome. Was there.
【０００５】この発明は上記の事情に鑑みてなされたも
ので、低損失な実装を実現したうえで、結合強度の向上
を図り得、且つ接合作業の簡略化を図り得るようにした
誘電体共振器の支持台装置を提供することを目的とす
る。The present invention has been made in view of the above circumstances, and realizes a dielectric resonance in which mounting with low loss can be realized, coupling strength can be improved, and bonding work can be simplified. An object of the present invention is to provide a support base device for a container.
【０００６】[0006]
【課題を解決するための手段】この発明は、高周波基板
上の伝送線路に電磁界的に結合される誘電体共振器を前
記高周波基板上に支持してなる誘電体共振器の支持台装
置において、前記伝送線路に間隙を有して対向され前記
誘電体共振器が載置される載置部、及びこの載置部の一
端部に設けられ前記高周波基板に接合される接合部を有
した支持台を備えて構成した。SUMMARY OF THE INVENTION The present invention provides a support device for a dielectric resonator in which a dielectric resonator electromagnetically coupled to a transmission line on a high frequency substrate is supported on the high frequency substrate. A support having a mounting portion facing the transmission line with a gap and on which the dielectric resonator is mounted, and a joint portion provided at one end of the mounting portion and bonded to the high-frequency substrate Configured with a stand.
【０００７】また、前記支持台を前記伝送線路に間隙を
有して対向され前記誘電体共振器が載置される載置部、
及びこの載置部の前記伝送線路を挟む両端部に設けられ
前記高周波基板に接合される接合部で構成した。Further, a mounting portion on which the dielectric resonator is mounted, the supporting base being opposed to the transmission line with a gap,
And a joint portion which is provided at both ends of the mounting portion sandwiching the transmission line and is joined to the high frequency substrate.
【０００８】[0008]
【作用】上記構成によれば、誘電体共振器は支持台の載
置部により伝送線路に対向配置されることにより、誘電
体基板と伝送線路の結合強度の向上が図れ、しかも高周
波基板への高精度な取付けが容易に実現される。According to the above structure, since the dielectric resonator is arranged to face the transmission line by the mounting portion of the support base, the coupling strength between the dielectric substrate and the transmission line can be improved, and moreover, it can be applied to the high frequency substrate. Highly accurate mounting can be easily realized.
【０００９】[0009]
【実施例】以下、この発明の実施例について、図面を参
照して詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１０】図１はこの発明の一実施例に係る誘電体共
振器の支持台装置を示すもので、高周波基板１０には伝
送線路１０ａが形成される。そして、伝送線路１０ａ近
傍の高周波基板１０には、誘電体共振器１１の搭載され
る支持台１２が配置される。支持台１２は、例えば伝送
線路１０ａに対して所定の間隔を有して対向される載置
部１２ａ，及び該載置部１２ａの一端に上記高周波基板
１０に接着剤１３を用いて結合される結合部１２ｂを有
した略逆Ｌ字状に形成される。FIG. 1 shows a support device for a dielectric resonator according to an embodiment of the present invention, in which a transmission line 10a is formed on a high frequency substrate 10. The support 12 on which the dielectric resonator 11 is mounted is arranged on the high frequency substrate 10 near the transmission line 10a. The support base 12 is, for example, a mounting portion 12a opposed to the transmission line 10a with a predetermined gap, and one end of the mounting portion 12a is bonded to the high frequency substrate 10 with an adhesive 13. It is formed in a substantially inverted L shape having a coupling portion 12b.
【００１１】上記構成において、この支持台１２は、そ
の載置部１２ａを伝送線路１０ａに対向した状態で、接
合部１２ｂが高周波基板１０の伝送線路１０ａ近傍に接
着される。これにより、誘電体共振器１１は伝送線路１
０ａを流れる高周波電流により励起される磁力線を介し
て伝送線路１０ａと結合される。この結合強度は誘電体
共振器１１と鎖交する磁力線の数によって定まり、誘電
体共振器１１を伝送線路１０ａに近付ければ近付けるほ
ど結合強度が向上される。In the above structure, the joint 12b of the support 12 is adhered to the vicinity of the transmission line 10a of the high frequency substrate 10 with the mounting portion 12a facing the transmission line 10a. As a result, the dielectric resonator 11 becomes the transmission line 1
It is coupled to the transmission line 10a via a magnetic field line excited by a high-frequency current flowing through 0a. This coupling strength is determined by the number of magnetic lines of force interlinking with the dielectric resonator 11, and the closer the dielectric resonator 11 is to the transmission line 10a, the more the coupling strength is improved.
【００１２】このように、上記誘電体共振器の支持台装
置は支持台１２に伝送線路１０ａに対して所定の間隔を
有して対向される載置部１２ａ、及び該載置部１２ａの
一端部に上記高周波基板１０に接着剤１３を用いて接合
される接合部１２ｂを形成し、この支持台１２を用いて
誘電体共振器１１を高周波基板１０に実装するように構
成した。これによれば、低損失な実装を実現したうえ
で、誘電体共振器１１と伝送線路１０ａとの結合強度の
向上を図ることが可能となることにより、発振器を構成
した場合の安定度の向上を図り得、ろ波器を構成した場
合の帯域特性の向上を図ることが可能となる。また、こ
れによれば、支持台１２を誘電体共振器１１に比べて大
形に形成することが可能となることより接合作業の簡略
化が容易に実現される。As described above, in the support device for the dielectric resonator, the mounting portion 12a facing the transmission base 10a on the supporting base 12 with a predetermined space, and one end of the mounting portion 12a. A joining portion 12b joined to the high frequency substrate 10 by using an adhesive 13 is formed in the portion, and the dielectric resonator 11 is configured to be mounted on the high frequency substrate 10 using the support 12. According to this, it is possible to improve the coupling strength between the dielectric resonator 11 and the transmission line 10a while realizing low-loss mounting, and thus improve the stability when an oscillator is configured. Therefore, it is possible to improve the band characteristic when the filter is configured. Further, according to this, since it is possible to form the support base 12 to be larger than the dielectric resonator 11, it is possible to easily realize the simplification of the bonding work.
【００１３】また、この発明は上記実施例に限ることな
く、例えば図２及び図３に示すように構成することも可
能である。但し、図２及び図３において、前記図１と同
一部分については、同一符号を付して、その詳細な説明
について省略する。The present invention is not limited to the above embodiment, but may be constructed as shown in FIGS. 2 and 3, for example. However, in FIGS. 2 and 3, the same parts as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
【００１４】すなわち、図２は支持台２０を伝送線路１
０ａに間隙を有して対向され誘電体共振器１１が載置さ
れる載置部２０ａ、及びこの載置部２０ａの伝送線路１
０ａを狭む両端部に設けられ高周波基板１０に接合され
る接合部２０ｂを有した略コ字状に形成したものであ
る。That is, in FIG. 2, the support 20 is attached to the transmission line 1.
0a, a mounting portion 20a on which the dielectric resonator 11 is mounted, and a transmission line 1 of the mounting portion 20a.
0a is formed in a substantially U-shape having joints 20b provided at both ends that are narrowed and joined to the high-frequency substrate 10.
【００１５】また、図３は図２における載置部２０ａに
段上の透孔２０ｃを形成し、この透孔２０ｃに誘電体共
振器を収容することにより、誘電体共振器１１の底面を
直接的に伝送線路１０ａに対向配置するように構成した
ものである。よって、この発明は上記実施例に限ること
なく、その他、この発明の要旨を逸脱しない範囲で種々
の変形を実施し得ることは勿論である。Further, in FIG. 3, a stepped through hole 20c is formed in the mounting portion 20a in FIG. 2, and a dielectric resonator is accommodated in this through hole 20c, so that the bottom surface of the dielectric resonator 11 is directly attached. The transmission line 10a is arranged to face the transmission line 10a. Therefore, the present invention is not limited to the above-described embodiments, and it is needless to say that various modifications can be made without departing from the scope of the present invention.
【００１６】[0016]
【発明の効果】以上詳述したように、この発明によれ
ば、低損失な実装を実現したうえで、結合強度の向上を
図り得、且つ接合作業の簡略化を図り得るようにした誘
電体共振器の支持台装置を提供することができる。As described above in detail, according to the present invention, it is possible to realize mounting with low loss, improve the bonding strength, and simplify the bonding work. A support device for a resonator can be provided.
【図１】この発明の一実施例に係る誘電体共振器の支持
台装置を示した図。FIG. 1 is a diagram showing a support device for a dielectric resonator according to an embodiment of the present invention.
【図２】この発明の他の実施例を示した図。FIG. 2 is a diagram showing another embodiment of the present invention.
【図３】この発明の他の実施例を示した図。FIG. 3 is a diagram showing another embodiment of the present invention.
【図４】従来の誘電体共振器の支持台装置を示した図。FIG. 4 is a view showing a conventional support device for a dielectric resonator.
１０…高周波基板、１０ａ…伝送線部、１１…誘電体共
振器、１２、２０…支持台、１２ａ，２０ａ…載置部、
１２ｂ、２０ｂ…接合部、２０ａ…透孔、１３…接着
剤。DESCRIPTION OF SYMBOLS 10 ... High frequency board, 10a ... Transmission line part, 11 ... Dielectric resonator, 12, 20 ... Support stand, 12a, 20a ... Mounting part,
12b, 20b ... Joined portion, 20a ... Through hole, 13 ... Adhesive.
Claims (2)
合される誘電体共振器を前記高周波基板上に支持してな
る誘電体共振器の支持台装置において、 前記伝送線路に間隙を有して対向され前記誘電体共振器
が載置される載置部、及びこの載置部の一端部に設けら
れ前記高周波基板に接合される接合部を有した支持台を
具備したことを特徴とする誘電体共振器の支持台装置。1. A support device for a dielectric resonator, comprising: a dielectric resonator, which is electromagnetically coupled to a transmission line on a high-frequency board, supported on the high-frequency board; And a support table having a mounting portion on which the dielectric resonator is mounted and facing each other, and a bonding portion provided at one end of the mounting portion and bonded to the high frequency substrate. Support device for dielectric resonator.
て対向され前記誘電体共振器が載置される載置部、及び
この載置部の前記伝送線路を挟む両端部に設けられ前記
高周波基板に接合される接合部を有してなることを特徴
とする請求項１記載の誘電体共振器の支持台装置。2. The support base is provided at a mounting portion facing the transmission line with a gap and on which the dielectric resonator is mounted, and at both ends of the mounting portion sandwiching the transmission line. 2. The support device for a dielectric resonator according to claim 1, further comprising a bonding portion bonded to the high frequency substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16283191A JPH0514021A (en) | 1991-07-03 | 1991-07-03 | Support device for dielectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16283191A JPH0514021A (en) | 1991-07-03 | 1991-07-03 | Support device for dielectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0514021A true JPH0514021A (en) | 1993-01-22 |
Family
ID=15762074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16283191A Pending JPH0514021A (en) | 1991-07-03 | 1991-07-03 | Support device for dielectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514021A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8232103B2 (en) | 2006-08-08 | 2012-07-31 | Siemens Healthcare Diagnostics Inc. | Merge stop gate for an automated laboratory sample handling worksystem |
-
1991
- 1991-07-03 JP JP16283191A patent/JPH0514021A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8232103B2 (en) | 2006-08-08 | 2012-07-31 | Siemens Healthcare Diagnostics Inc. | Merge stop gate for an automated laboratory sample handling worksystem |
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