JPH0514101A - Lc resonator - Google Patents
Lc resonatorInfo
- Publication number
- JPH0514101A JPH0514101A JP16051891A JP16051891A JPH0514101A JP H0514101 A JPH0514101 A JP H0514101A JP 16051891 A JP16051891 A JP 16051891A JP 16051891 A JP16051891 A JP 16051891A JP H0514101 A JPH0514101 A JP H0514101A
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- electromagnetic shield
- electromagnetic
- soldered
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000003990 capacitor Substances 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052804 chromium Inorganic materials 0.000 abstract description 3
- 239000011651 chromium Substances 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 238000000605 extraction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フィルタ回路や発振回
路等に使用されるＬＣ共振子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LC resonator used in a filter circuit, an oscillator circuit or the like.
【０００２】[0002]
【従来の技術と課題】一般に、外界からの電磁ノイズの
影響を防止する方法として、ＬＣ共振子を金属製ケース
に収納する方法が知られている。しかしながら、この方
法を採用したＬＣ共振子をそのまま印刷配線板等に半田
付けすると、半田が金属製ケースに付着するおそれがあ
るため、金属製ケースをさらに樹脂にて被覆しなければ
ならなかった。この結果、ＬＣ共振子の大型化を招き、
近年の小型化に逆行するという問題点があった。2. Description of the Related Art Generally, a method of housing an LC resonator in a metal case is known as a method of preventing the influence of electromagnetic noise from the outside. However, if the LC resonator adopting this method is directly soldered to a printed wiring board or the like, the solder may adhere to the metal case. Therefore, the metal case had to be further covered with resin. As a result, the size of the LC resonator is increased,
There is a problem that it goes against the recent miniaturization.
【０００３】そこで、本発明の課題は、小型、かつ、電
磁ノイズの遮蔽効果が大きいＬＣ共振子を提供すること
にある。Therefore, an object of the present invention is to provide an LC resonator which is small in size and has a large electromagnetic noise shielding effect.
【０００４】[0004]
【課題を解決するための手段と作用】以上の課題を解決
するため、本発明に係るＬＣ共振子は、コイル部とコン
デンサ部を積み重ね、少なくとも前記コイル部が配置さ
れた側の表面に絶縁体層を介して半田が付着しない材料
からなる電磁シールド膜を設けたことを特徴とする。Ｌ
Ｃ共振子は表面に設けた電磁シールド膜にて外界の電磁
ノイズが遮蔽され、ＬＣ共振子に内蔵されているコイル
やコンデンサが正常に機能する。しかも、この電磁シー
ルド膜は半田が付着しない材料からなるため、ＬＣ共振
子を印刷配線板等に半田付けする際に半田が電磁シール
ド膜に付着しない。従って、電磁シールド膜がそのまま
外装として使用される。電磁シールド効果を有し、か
つ、半田が付着しない材料としては、ニッケル、クロム
あるいはアルミニウム等がある。In order to solve the above problems, in the LC resonator according to the present invention, a coil portion and a capacitor portion are stacked, and an insulator is provided on at least the surface on which the coil portion is arranged. An electromagnetic shield film made of a material to which solder does not adhere is provided through the layer. L
An electromagnetic shield film provided on the surface of the C resonator shields external electromagnetic noise, and the coil and capacitor built in the LC resonator function normally. Moreover, since the electromagnetic shield film is made of a material to which solder does not adhere, the solder does not adhere to the electromagnetic shield film when the LC resonator is soldered to a printed wiring board or the like. Therefore, the electromagnetic shield film is used as it is as an exterior. As a material having an electromagnetic shield effect and to which solder does not adhere, nickel, chromium, aluminum, or the like is used.
【０００５】[0005]
【実施例】以下、本発明に係るＬＣ共振子の一実施例を
添付図面を参照して説明する。本実施例では、ＬＣ共振
子１個の場合について説明するが、量産時は複数個のＬ
Ｃ共振子を備えたマザー基板の形態で製造されることに
なる。図１はＬＣ共振子の垂直断面図であり、図２は図
１に示したＬＣ共振子の内部の平面図である。誘電体基
板１の表裏面には容量電極２，３が設けられている。容
量電極２の一方の端部は誘電体基板１の左端面に延在し
ており、容量電極３の一方の端部は誘電体基板１の右端
面に延在している。この誘電体基板１はアルミナ又はガ
ラスからなる基板５にポリイミド樹脂系接着剤等を用い
て貼り合わされている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an LC resonator according to the present invention will be described below with reference to the accompanying drawings. In this embodiment, the case of one LC resonator will be described, but a plurality of L resonators are used in mass production.
It will be manufactured in the form of a mother substrate with a C resonator. FIG. 1 is a vertical sectional view of the LC resonator, and FIG. 2 is a plan view of the inside of the LC resonator shown in FIG. Capacitance electrodes 2 and 3 are provided on the front and back surfaces of the dielectric substrate 1. One end of the capacitance electrode 2 extends to the left end face of the dielectric substrate 1, and one end of the capacitance electrode 3 extends to the right end face of the dielectric substrate 1. This dielectric substrate 1 is attached to a substrate 5 made of alumina or glass by using a polyimide resin adhesive or the like.
【０００６】さらに、この基板５の表面中央部、左縁部
及び右縁部にそれぞれ渦巻き状のコイル用導体８、引出
し電極９ａ及び引出し電極９ｂがスパッタ法やフォトレ
ジスト法等の手段にて形成される。コイル用導体８の一
方の端部は引出し電極９ａに電気的に接続している。コ
イル用導体８及び引出し電極９ａ，９ｂを形成した後、
ポリイミド樹脂等の絶縁膜１２がコイル用導体８の一部
を被覆するべく局所的に基板５の表面に設けられる。こ
の絶縁膜１２の表面にコイル用導体８の他方の端部と引
出し電極９ｂを電気的に接続する接続導体１５が配設さ
れている。Further, a spiral coil conductor 8, a lead electrode 9a and a lead electrode 9b are formed on the central portion, the left edge portion and the right edge portion of the surface of the substrate 5, respectively, by means such as a sputtering method or a photoresist method. To be done. One end of the coil conductor 8 is electrically connected to the extraction electrode 9a. After forming the coil conductor 8 and the extraction electrodes 9a and 9b,
An insulating film 12 such as a polyimide resin is locally provided on the surface of the substrate 5 so as to cover a part of the coil conductor 8. A connection conductor 15 is provided on the surface of the insulating film 12 to electrically connect the other end of the coil conductor 8 and the extraction electrode 9b.
【０００７】さらに、コイル用導体８や容量電極３等は
ポリイミド樹脂等の絶縁体層１６，１７にて被覆され、
絶縁体層１６，１７の表面にスパッタ法等の手段にて半
田が付着しない材料からなる電磁シールド膜１８，１９
が形成されている。半田が付着しない材料としては、ニ
ッケル、クロムあるいはアルミニウム等が採用される。
なお、量産時は、この後マザー基板を製品毎に切り離す
ことになる。誘電体基板１と基板５からなる積層体の左
右両端部及び中央部の手前側並びに奥側に外部電極２
０，２１及びグランド電極２２，２３がスパッタ等の手
段にて設けられている。Further, the coil conductor 8, the capacitor electrode 3, etc. are covered with insulating layers 16 and 17 made of polyimide resin,
Electromagnetic shield films 18 and 19 made of a material to which solder does not adhere to the surfaces of the insulator layers 16 and 17 by means such as sputtering.
Are formed. Nickel, chromium, aluminum, or the like is used as the material to which the solder does not adhere.
During mass production, the mother board is then separated into individual products. External electrodes 2 are provided on the front and back sides of the left and right end portions and the central portion of the laminated body including the dielectric substrate 1 and the substrate 5.
0, 21 and ground electrodes 22, 23 are provided by means such as sputtering.
【０００８】外部電極２０は容量電極２及び引出し電極
９ａに電気的に接続しており、外部電極２１は容量電極
３及び引出し電極９ｂに電気的に接続している。グラン
ド電極２２，２３は電磁シールド膜１８，１９の両者に
電気的に接続している。図３はこうして得られたＬＣ共
振子の電気等価回路図である。ここに、Ｃは容量電極２
と３の間に発生するキャパシタンスであり、Ｌはコイル
用導体８に発生するインダクタンスである。このＬＣ共
振子を印刷配線板等に半田付けしても、半田が電磁シー
ルド膜１８，１９に付着しないので、電磁シールド膜１
８，１９をそのまま外装として使用できる。従って、さ
らに樹脂にて電磁シールド膜１８，１９を被覆する必要
がなく、小型のＬＣ共振子が得られる。また、グランド
電極２２，２３は印刷配線板等のグランドパターンに半
田付けされるので、グランド電極２２，２３に電気的に
接続された電磁シールド膜１８，１９は接地された状態
となり、外界の電磁ノイズを完全に遮蔽する。この結
果、ＬＣ共振子の電気特性が外界からの電磁ノイズに左
右されない安定したものになる。The external electrode 20 is electrically connected to the capacitance electrode 2 and the extraction electrode 9a, and the external electrode 21 is electrically connected to the capacitance electrode 3 and the extraction electrode 9b. The ground electrodes 22 and 23 are electrically connected to both the electromagnetic shield films 18 and 19. FIG. 3 is an electrical equivalent circuit diagram of the LC resonator thus obtained. Where C is the capacitive electrode 2
And 3 is a capacitance generated between L and L, and L is an inductance generated in the coil conductor 8. Even if the LC resonator is soldered to a printed wiring board or the like, the solder does not adhere to the electromagnetic shield films 18 and 19.
8 and 19 can be used as they are as an exterior. Therefore, it is not necessary to cover the electromagnetic shield films 18 and 19 with resin, and a small LC resonator can be obtained. Further, since the ground electrodes 22 and 23 are soldered to the ground pattern of the printed wiring board or the like, the electromagnetic shield films 18 and 19 electrically connected to the ground electrodes 22 and 23 are in a grounded state, and the electromagnetic waves in the external world are not detected. Completely shield noise. As a result, the electric characteristics of the LC resonator become stable without being influenced by electromagnetic noise from the outside.
【０００９】なお、本発明に係るＬＣ共振子は、前記実
施例に限定するものではなく、その要旨の範囲内で種々
に変形することができる。前記実施例において、仕様に
よっては、コイル用導体８形成側の面にのみ電磁シール
ド膜１８を設けるようにし、容量電極３形成側の面には
電磁シールド膜を設けないものであってもよい。容量電
極３形成側は、容量電極３自体がある程度外界の電磁ノ
イズを遮蔽する効果をもっているからである。The LC resonator according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist thereof. In the above embodiment, depending on the specifications, the electromagnetic shield film 18 may be provided only on the surface on which the coil conductor 8 is formed, and the electromagnetic shield film may not be provided on the surface on which the capacitance electrode 3 is formed. This is because the capacity electrode 3 itself has an effect of shielding the external electromagnetic noise to some extent on the side where the capacity electrode 3 is formed.
【００１０】また、前記実施例のＬＣ共振子は等価電気
回路図では並列共振回路を構成するものであるが、直列
共振回路を構成するものでもよい。さらに、コンデンサ
部は誘電体層と容量電極層を交互に積層した積層コンデ
ンサであってもよいし、コイル部は磁性体層とコイル用
導体を交互に積層すると共に各コイル用導体をスルーホ
ール等を介して電気的にシリーズに接続して構成した積
層コイルであってもよい。Further, although the LC resonator of the above embodiment constitutes a parallel resonance circuit in the equivalent electric circuit diagram, it may also constitute a series resonance circuit. Further, the capacitor part may be a multilayer capacitor in which dielectric layers and capacitance electrode layers are alternately laminated, and the coil part is formed by alternately laminating magnetic layers and coil conductors and through-holes each coil conductor. It may be a laminated coil configured to be electrically connected to the series via the.
【００１１】[0011]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、半田が付着しない材料からなる電磁シールド膜
を表面に設けたので、電磁シールド膜をそのまま外装と
して使用できる。この結果、小型で、かつ、電磁ノイズ
の遮蔽効果が大きいＬＣ共振子が得られる。As is apparent from the above description, according to the present invention, since the electromagnetic shield film made of the material to which the solder does not adhere is provided on the surface, the electromagnetic shield film can be used as it is as an exterior. As a result, it is possible to obtain an LC resonator which is small in size and has a large electromagnetic noise shielding effect.
【図１】本発明に係るＬＣ共振子の一実施例を示す垂直
断面図。FIG. 1 is a vertical sectional view showing an embodiment of an LC resonator according to the present invention.
【図２】図１に示したＬＣ共振子の内部を示す平面図。FIG. 2 is a plan view showing the inside of the LC resonator shown in FIG.
【図３】図１に示したＬＣ共振子の等価電気回路図。3 is an equivalent electric circuit diagram of the LC resonator shown in FIG.
１…誘電体基板 ２，３…容量電極 ８…コイル用導体 １６，１７…絶縁体層 １８，１９…電磁シールド膜 1 ... Dielectric substrate 2, 3 ... Capacitance electrode 8 ... Coil conductor 16, 17 ... Insulator layer 18, 19 ... Electromagnetic shield film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 牧田 隆志 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Makita 2-26-10 Tenjin Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd.
Claims (1)
なくとも前記コイル部が配置された側の表面に絶縁体層
を介して半田が付着しない材料からなる電磁シールド膜
を設けたことを特徴とするＬＣ共振子。Claim: What is claimed is: 1. A coil portion and a capacitor portion are stacked, and an electromagnetic shield film made of a material to which solder does not adhere is provided on at least a surface on a side where the coil portion is arranged through an insulating layer. An LC resonator characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051891A JPH0514101A (en) | 1991-07-01 | 1991-07-01 | Lc resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051891A JPH0514101A (en) | 1991-07-01 | 1991-07-01 | Lc resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0514101A true JPH0514101A (en) | 1993-01-22 |
Family
ID=15716694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16051891A Pending JPH0514101A (en) | 1991-07-01 | 1991-07-01 | Lc resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6478920B1 (en) | 1993-04-30 | 2002-11-12 | Murata Manufacturing Co., Ltd. | Chip-type circuit component and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58145114A (en) * | 1982-01-25 | 1983-08-29 | ティーディーケイ株式会社 | Lc composite part |
| JPH01258497A (en) * | 1988-04-08 | 1989-10-16 | Mitsubishi Electric Corp | Electronic equipment |
-
1991
- 1991-07-01 JP JP16051891A patent/JPH0514101A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58145114A (en) * | 1982-01-25 | 1983-08-29 | ティーディーケイ株式会社 | Lc composite part |
| JPH01258497A (en) * | 1988-04-08 | 1989-10-16 | Mitsubishi Electric Corp | Electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6478920B1 (en) | 1993-04-30 | 2002-11-12 | Murata Manufacturing Co., Ltd. | Chip-type circuit component and method of manufacturing the same |
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