JPH0514532Y2 - - Google Patents
Info
- Publication number
- JPH0514532Y2 JPH0514532Y2 JP1987110399U JP11039987U JPH0514532Y2 JP H0514532 Y2 JPH0514532 Y2 JP H0514532Y2 JP 1987110399 U JP1987110399 U JP 1987110399U JP 11039987 U JP11039987 U JP 11039987U JP H0514532 Y2 JPH0514532 Y2 JP H0514532Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- conductive pattern
- outer lens
- voltage protection
- reverse voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、車両用灯具、フアツクスの光源など
として使用する灯具、特に多数のLEDを用いた
灯具に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lamp used as a vehicle lamp or a light source for a fax machine, and particularly to a lamp using a large number of LEDs.
従来は、例えば第6図に示すように所定の導電
パターンが形成された基板21に多数のLED(ラ
ンプ形状タイプのもの)22、電流制限用抵抗2
3、逆電圧保護ダイオード24をそれぞれ装着す
るとともに、ワイヤーハーネス25を半田付けに
よつて接続し、これをハウジング26内に収納し
た後、所定のレンズカツトを施したアウターレン
ズ27をハウジング26の前面に取付けた構造と
している。
Conventionally, as shown in FIG. 6, for example, a substrate 21 on which a predetermined conductive pattern is formed is provided with a large number of LEDs (lamp-shaped type) 22 and a current limiting resistor 2.
3. After attaching the reverse voltage protection diodes 24 and connecting the wire harness 25 by soldering and storing them in the housing 26, attach the outer lens 27 with a predetermined lens cut to the front of the housing 26. It has an attached structure.
しかし、このような構造では、基板21に
LED22などを装着し、これをハウジング26
内に収納しているため、基板21の収納スペース
が必要となつて灯具の薄型化が難しい。また、基
板21はハウジング26と比較して加工する形状
に自由度が少ないため、車体フレームなどに有効
に放熱できない。更に、各LED22にアウター
レンズ27のレンズカツトを対応させて所要の配
光特性を得るため、LED22とアウターレンズ
27との合わせ寸法精度を要するが、基板21の
介在によつて位置合わせに手間がかかるといつた
問題点がある。
However, in such a structure, the substrate 21
Attach the LED 22 etc. and connect it to the housing 26.
Since the board 21 is housed inside, a storage space for the board 21 is required, making it difficult to make the lamp thinner. Further, since the substrate 21 has less freedom in processing its shape than the housing 26, it cannot effectively radiate heat to the vehicle body frame or the like. Furthermore, in order to match the lens cut of the outer lens 27 to each LED 22 to obtain the required light distribution characteristics, the alignment of the LEDs 22 and the outer lens 27 requires precision in dimensions, but the intervention of the substrate 21 takes time and effort to align. There are some problems.
本考案は、ハウジングの後部内面に所定数の反
射枠を一体に成形するとともに所定形状の導電パ
ターンを電流制限用抵抗の代用となる抵抗分を含
むように形成して所要数のLEDチツプ、逆電圧
保護ダイオードなどを装着し、ハウジングの前面
にアウターレンズを取付けたことを特徴とするも
のである。
In this invention, a predetermined number of reflective frames are integrally molded on the rear inner surface of the housing, and a conductive pattern of a predetermined shape is formed to include a resistance that can be used as a substitute for a current limiting resistor. It is characterized by being equipped with voltage protection diodes, etc., and an outer lens attached to the front of the housing.
以下、本考案を図示の実施例に基づいて詳細に
説明する。
Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
第1図〜第5図は本考案の一実施例を示すもの
で、ハウジング1の後部内面に所定形状の導電パ
ターン2を電流制限用抵抗の代用となる抵抗分を
含むように多数形成してそのチツプマウント部に
LEDチツプ3をダイボンデイングし、その電極
部と他のパターン2との間を金線4によりワイヤ
ボンデイングしている。また、前記導電パターン
2には逆電圧保護ダイオード(図示省略)をも装
着している。ハウジング1はポリカーボネートや
ABS樹脂などによる成形品とし、後部内面のチ
ツプ装着個所の間に反射枠1Aを一体に成形し、
背面(後部外面)には取付部1Bを一体に成形す
るとともに、ワイヤーハーネス(リード線)5を
接続している。また、ハウジング1の前面には、
所定のレンズカツトを施したアウターレンズ6を
取付けている。 Figures 1 to 5 show an embodiment of the present invention, in which a large number of conductive patterns 2 of a predetermined shape are formed on the inner surface of the rear part of a housing 1 so as to contain a resistance that can serve as a substitute for a current limiting resistor. At the tip mount part
The LED chip 3 is die-bonded, and the electrode part and the other pattern 2 are wire-bonded using a gold wire 4. Further, the conductive pattern 2 is also equipped with a reverse voltage protection diode (not shown). Housing 1 is made of polycarbonate or
It is a molded product made of ABS resin, etc., and a reflective frame 1A is integrally molded between the tip attachment points on the rear inner surface.
A mounting portion 1B is integrally formed on the back surface (rear outer surface), and a wire harness (lead wire) 5 is connected thereto. Also, on the front of housing 1,
An outer lens 6 with a predetermined lens cut is attached.
なお、前記導電パターン2の抵抗分は、パター
ン用導電材の材質やパターン幅、パターン距離に
よつて制御する。 Note that the resistance of the conductive pattern 2 is controlled by the material of the conductive material for the pattern, the pattern width, and the pattern distance.
このようにハウジング1の後部内面に反射枠1
Aと導電パターン2を形成してLEDチツプ3、
逆電圧保護ダイオードなどを実装すると、薄型に
なるとともに、LEDチツプ3の発光の一部が反
射枠1Aで反射して前方に放射されるようにな
り、発光が有効に利用される。また、部品の発熱
はハウジング1を介して車体フレームなどに速や
かに放熱される。 In this way, the reflective frame 1 is attached to the rear inner surface of the housing 1.
A and a conductive pattern 2 are formed to form an LED chip 3,
If a reverse voltage protection diode or the like is installed, the device will be thinner, and a portion of the light emitted from the LED chip 3 will be reflected by the reflective frame 1A and radiated forward, making effective use of the light emitted. Furthermore, heat generated by the components is quickly radiated to the vehicle body frame and the like through the housing 1.
以上のように本考案によれば、ハウジング自体
に導電パターンを形成して所要数のLEDチツプ、
逆電圧保護ダイオードなどを実装し、ハウジング
の前面にアウターレンズを取付けたので、ハウジ
ングの内部スペースの縮少によつて薄型化が図れ
るとともに、基板や個別素子としての抵抗の省略
によつて軽量化及び工数の削減が図れる。また、
部品のハウジングへの取付けによりその発熱を有
効に放熱することができ、それに伴つて発光効率
の向上が期待できる。しかも、ハウジング後部内
面に反射枠を形成したので、通常の白色系樹脂の
使用によつても発光を有効に利用できる。更に、
ハウジングの材質選択に裕度が生じ、素材量の軽
減と相俟つてコストの低減が可能となるといつた
利点がある。
As described above, according to the present invention, by forming a conductive pattern on the housing itself, a required number of LED chips can be installed.
By mounting a reverse voltage protection diode, etc. and attaching an outer lens to the front of the housing, the internal space of the housing is reduced, making it thinner, and the weight is also reduced by omitting the board and resistors as individual elements. And the number of man-hours can be reduced. Also,
By attaching the component to the housing, the heat generated can be effectively dissipated, and an improvement in luminous efficiency can be expected accordingly. Moreover, since a reflective frame is formed on the inner surface of the rear part of the housing, the light emitted can be effectively utilized even when using ordinary white resin. Furthermore,
There is an advantage in that there is more latitude in selecting the material for the housing, which allows for a reduction in the amount of material and costs.
第1図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第2図及び第3図は同実施
例の正面図及び側面図、第4図は同実施例におけ
るLEDチツプの実装状態を示す正面図、第5図
は第4図の−線断面図、第6図は従来例を示
す一部破断状態の平面図である。
1……ハウジング、1A……反射枠、2……導
電パターン、3……LEDチツプ、4……金線、
5……ワイヤーハーネス、6……アウターレン
ズ。
Fig. 1 is a partially broken plan view showing an embodiment of the lamp according to the present invention, Figs. 2 and 3 are front and side views of the embodiment, and Fig. 4 is an LED in the embodiment. FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially cutaway plan view showing a conventional example. 1... Housing, 1A... Reflective frame, 2... Conductive pattern, 3... LED chip, 4... Gold wire,
5... Wire harness, 6... Outer lens.
Claims (1)
に成形するとともに、所定形状の導電パターンを
電流制限用抵抗の代用となる抵抗分を含むように
形成して所要数のLEDチツプ、逆電圧保護ダイ
オードなどを装着し、ハウジングの前面にアウタ
ーレンズを取付けたことを特徴とする灯具。 A predetermined number of reflective frames are integrally molded on the rear inner surface of the housing, and a conductive pattern of a predetermined shape is formed to include a resistor that can be used as a substitute for a current limiting resistor, and the required number of LED chips and reverse voltage protection diodes are formed. A light fixture characterized by having an outer lens attached to the front of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110399U JPH0514532Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110399U JPH0514532Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413755U JPS6413755U (en) | 1989-01-24 |
| JPH0514532Y2 true JPH0514532Y2 (en) | 1993-04-19 |
Family
ID=31347521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110399U Expired - Lifetime JPH0514532Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514532Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3990132B2 (en) * | 2001-10-04 | 2007-10-10 | 株式会社小糸製作所 | Vehicle lamp |
| EP2678605B1 (en) * | 2011-02-25 | 2020-05-06 | Lumitex Inc. | Flat optical lighting assembly with integrated electrical circuitry |
-
1987
- 1987-07-17 JP JP1987110399U patent/JPH0514532Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6413755U (en) | 1989-01-24 |
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