JPH0515741Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a connection connector, and in particular, a connection connector for connecting an emulator that performs the functions of a microcomputer to an IC socket that is originally used to insert a microcomputer. Regarding.

[Conventional technology]

Conventionally, this type of connection connector simply connects the signal from the emulator to the corresponding electrode of the IC socket, or, in the case of high-speed microcomputer emulators, the signal from the emulator is paired with a ground wire. The ground wires of each signal are grouped together in a connector and connected to the ground electrode of the IC socket.

[Problem that the invention attempts to solve]

The above-mentioned conventional connection connectors have the disadvantage that they cannot be used in high-speed microcomputer emulators due to induced noise between signal lines. In addition, although the latter has no problem with induced noise, the position of the ground electrode is not fixed as in conventional dual-in-line packages due to the increase in the number of pins in the IC packages of microcomputers, so it is difficult to use the same package. Even if the ground electrode position is different, it is necessary to create a connector with different grounding procedures for each case.
As described above, preparing connection connectors and interface cables in the same package in which only the position of the ground electrode is changed has the disadvantage that it is not only expensive but also complicated to manage.

[Means for solving problems]

The connection connector of the present invention has a plurality of first electrodes provided on the side surface for connecting an IC socket for inserting a microcomputer, and a plurality of second electrodes provided on the top surface connected to each of the first electrodes. a main body comprising an electrode and a grounding electrode connected to a grounding wire provided on the top surface, and an exchange fixed to the top surface of the main body connecting one of the second electrodes and the grounding electrode. and a cable having one end fixed to the main body, connected to the second electrode, and the other end connected to an emulator that performs the function of the microcomputer.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

Fig. 1 is an exploded perspective view of one embodiment of the present invention;
The figure is a sectional view of the embodiment of FIG. 1.

As shown in Figures 1 and 2, there is a space for inserting a single chip microcomputer into the side.
A plurality of first electrodes 2 are provided to which the IC sockets are connected, and a second electrode is provided on the top surface and connected to each of the electrodes 2.
A main body part 1 has a plurality of additional electrodes 3 protruding therefrom as electrodes, and a ground electrode 4 protruding from the center of the upper surface at the same height as the additional electrodes 3;
A connection wiring section 5 has a grounding plate 9 fixed to a support plate 8 fixed with a set screw 7, one end is fixed to the main body section 1, a signal line is connected to the additional electrode 3, and the other end is connected to the microcomputer function. and a cable 6 connected to an emulator acting on behalf of the computer.

All of the ground wires paired with the signal wire from the cable 6 are connected to the ground electrode 4 .

FIG. 3 is a plan view of the ground plate of FIG. 2.

As shown in FIG. 3, the grounding plate 9 is a conductive metal plate made of copper or the like, and is provided with a plurality of holes 10 larger than the additional electrodes 3 at positions corresponding to the additional electrodes 3. However, the additional electrode 3 corresponding to the ground electrode of the IC socket to which the microcomputer is connected
In the region _10a of the ground plate 9 facing the ground plate 9, no loophole is provided, as shown by the broken line in FIG.

Therefore, as shown in FIG. 2, by stacking the connection wiring section 5 on the top surface of the main body section 1 with the grounding plate 9 facing downward and fixing it with a set screw 7, it can be paired with the signal line of the cable 6. The long ground wire is ground electrode 4 → ground plate 9
→Additional electrode 3→Electrode 2 is connected to the ground electrode of the IC socket. Also, the signal line is the additional electrode 3→
The path of electrode 2 is connected to each signal electrode of the IC socket.

If the microcomputer inserted into the IC socket changes and the position of the ground electrode changes, this can be handled by replacing the hole position of the ground plate 9 with a connection wiring section 5 that matches the microcomputer.

FIG. 4 is a sectional view of a second embodiment of the present invention.

As shown in FIG. 4, in the second embodiment, the connection wiring section _5a consists of a support plate _8a and two ground plates 9, which are electrically conductive metal plates connected to each other with the support plate _8a in between. The connecting wiring portion _{5 a corresponding} to the additional electrode 3 _a is provided with a through hole, respectively. Further, when the connection wiring part _5a is fixed on the main body part _1a , the additional electrode _3a passes through each through hole of the connection wiring part _5a and is elongated so that its tip protrudes. .

With this configuration, the additional electrode _3a to be grounded
The electrode of the IC socket that should be grounded can be grounded by connecting it to the grounding plate _9a on the upper part of the connection wiring part _5a with solder 11.

If the target microcomputer changes, the position of the solder connection of the additional electrode _3a may be changed.

The second embodiment has the advantage that one type of connection wiring section can support multiple types of microcomputers.

[Effect of idea]

As explained above, the present invention provides an additional electrode and a ground electrode on the top surface, and connects any additional electrode to the ground electrode via the connection wiring section, thereby reducing the need for a single cable for interfacing with the emulator. By simply preparing, the package can support multiple types of microcomputers with different ground electrode positions. Further, since the upper surface is covered with the ground plate of the connection wiring section, the shielding is strengthened.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of the first embodiment of the present invention;
Figure 2 is a sectional view of the embodiment shown in Figure 1, and Figure 3 is a cross-sectional view of the embodiment shown in Figure 1.
FIG. 4 is a plan view of the ground plate shown in FIG. 4, and FIG. 4 is a sectional view of the second embodiment of the present invention. 1, 1a... Main body, 2... Electrode, 3, 3a...
...Additional electrode, 4...Grounding electrode, 5, 5a...Connection wiring section, 6...Gable, 7...Set screw, 8,
8a... Support plate, 9, 9a... Ground plate, 10...
Loophole, 11...Solder.

Claims (1)

[Scope of utility model registration request] A connection connector comprising: a main body having a plurality of first electrodes for connecting an IC socket for inserting a microcomputer provided on a side surface, a plurality of second electrodes connected to each of the first electrodes provided on a top surface, and a grounding electrode connected to a ground wire provided on the top surface; a replaceable connection wiring portion fixed to the top surface of the main body connecting any of the second electrodes to the grounding electrode; and a cable having one end fixed to the main body and connected to the second electrode and the other end connected to an emulator that performs the functions of the microcomputer.