JPH051636B2 - - Google Patents
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- JPH051636B2 JPH051636B2 JP58153125A JP15312583A JPH051636B2 JP H051636 B2 JPH051636 B2 JP H051636B2 JP 58153125 A JP58153125 A JP 58153125A JP 15312583 A JP15312583 A JP 15312583A JP H051636 B2 JPH051636 B2 JP H051636B2
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- Prior art keywords
- copolymer
- film
- piezoelectric
- vinylidene fluoride
- temperature
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Description
【発明の詳細な説明】
本発明は、高周波領域の周波数に於ても高いも
圧電性能を有しかつ、優れた素子製作性能を兼ね
備えた高分子圧電体の製造方法に関し、特に、高
性能の超音波トランスジユーサー用の高分子圧電
体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a polymer piezoelectric material that has high piezoelectric performance even in a high frequency range and has excellent device fabrication performance. The present invention relates to a method of manufacturing a polymer piezoelectric material for an ultrasonic transducer.
高い圧電性能を有する高分子圧電物質として
は、例えば、特公昭50−40720号においてポリフ
ツ化ビニリデンが、また特公昭50−29159号、特
開昭56−111281号、特開昭58−60585号等の公報
においてフツ化ビニリデン共重合体が報告されて
いる。しかも、これらフツ化ビリデン系樹脂は、
高周波領域の周波数においても高い圧電性能を有
することが特公昭51−23439号公報において報告
されている。これら高分子圧電物質は一般にロー
ル圧延あるいはキヤステング等によりフイルム化
後、フイルム面に垂直方向の電気機械結合係数
Kt(以下、しばしば単に「Kt」と略称する。)を
高めるために熱処理をし、フイルムと垂直方向に
電場を印加して処理することにより圧電体フイル
ムに形成される。これら一連のフツ化ビニリデン
系樹脂のうち、ポリフツ化ビニリデンは、Ktが
約0.2であり、成形性も良好であり、最も有用な
超音波トランスジユーサー用の高分子素子材料と
考えられてきたが、超音波送受波能のより一層の
改善が望まれている。 As a polymeric piezoelectric material having high piezoelectric performance, for example, polyvinylidene fluoride is disclosed in Japanese Patent Publication No. 50-40720, and Japanese Patent Publication No. 50-29159, Japanese Patent Application Laid-open No. 56-111281, Japanese Patent Application Publication No. 58-60585, etc. A vinylidene fluoride copolymer has been reported in the publication. Moreover, these polypyridine fluoride resins are
It is reported in Japanese Patent Publication No. 51-23439 that it has high piezoelectric performance even in the high frequency range. These polymeric piezoelectric materials are generally made into films by roll rolling or casting, and then the electromechanical coupling coefficient in the direction perpendicular to the film surface is
A piezoelectric film is formed by heat treatment to increase Kt (hereinafter often simply referred to as "Kt") and by applying an electric field perpendicular to the film. Among these series of vinylidene fluoride resins, polyvinylidene fluoride has a Kt of approximately 0.2 and good moldability, and has been considered the most useful polymer element material for ultrasonic transducers. , further improvements in ultrasonic transmission and reception capabilities are desired.
他方、前記特許公報記載のフツ化ビニリデン共
重合体、特に、フツ化ビニリデンと三フツ化エチ
レンとの共重合体は、フツ化ビニリデン75モル
%、三フツ化エチレン25モル%付近の組成からな
るロール圧延成形物及びキヤスト膜においてポリ
フツ化ビニリデンを上廻るKtが得られる。しか
しながら、この共重合体の膜状成形物は、超音波
トランスジユーサーの送受波感度を高めるべく凹
面成形する際に、亀裂が発生しやすく、素子の製
造収率が非常に悪い。さらに素子が亀裂の発生を
みることなく出来た場合でも、経時的に亀裂を生
じやすかつたり、亀裂を生じなくても、大きな
Ktを有する程には、超音波送、受波能の向上は
見られなかつた。 On the other hand, the vinylidene fluoride copolymer described in the above patent publication, particularly the copolymer of vinylidene fluoride and ethylene trifluoride, has a composition of around 75 mol% vinylidene fluoride and 25 mol% ethylene trifluoride. Kt higher than polyvinylidene fluoride can be obtained in roll-rolled products and cast films. However, when a film-like molded product of this copolymer is molded into a concave surface in order to increase the wave transmission/reception sensitivity of an ultrasonic transducer, cracks are likely to occur, resulting in a very low device manufacturing yield. Furthermore, even if the device is made without cracking, it may be prone to cracking over time, or even if it does not crack, it may become large.
The improvement in ultrasonic transmission and reception ability was not seen as much as with Kt.
亀裂が発生しやすいのは、フツ化ビニリデン−
三フツ化エチレン共重合体の場合には、ポリフツ
化ビニリデンに比べて、Ktを高めるべく熱処理
することにより結晶化度が極度に高められるため
である。ちなみに、熱処理時間を少なくして素子
の製造収率を悪くしない程度に抑えたときのKt
は、ポリフツ化ビニリデンを若干上廻わる程度に
過ぎず、あえて共重合体化する意味に乏しい。か
くの如く、従来技術においては、素子製作性能と
Ktのバランスのとれたものを得ることができな
かつた。 Vinylidene fluoride is more likely to crack.
This is because, in the case of ethylene trifluoride copolymers, the degree of crystallinity is extremely increased by heat treatment to increase Kt, compared to polyvinylidene fluoride. By the way, Kt when the heat treatment time is reduced to a level that does not deteriorate the device manufacturing yield.
is only slightly superior to polyvinylidene fluoride, and there is no point in purposefully converting it into a copolymer. As shown above, in the conventional technology, element manufacturing performance and
I couldn't get a balanced version of Kt.
本発明の主要な目的は、上述した従来技術の問
題点に鑑み、たとえば超音波トランスジユーサ用
素子製造の収率を高めるべく、二次加工特性ない
し耐変形性に優れ、且つ比較的高いKtを維持し
て超音波送受波能の高いフツ化ビニリデン共重合
体圧電膜の製造方法を提供することにある。 In view of the above-mentioned problems of the prior art, the main object of the present invention is to provide a material with excellent secondary processing characteristics or deformation resistance and a relatively high Kt, for example, in order to increase the yield of manufacturing ultrasonic transducer elements. An object of the present invention is to provide a method for producing a vinylidene fluoride copolymer piezoelectric film that maintains high ultrasonic wave transmission and reception capabilities.
本発明者らは、上述の目的で、特に、フツ化ビ
ニリデン−三フツ化エチレン共重合体の特性につ
いて鋭意研究した結果、Kt向上のための熱処理
による屈曲時の亀裂発生等の耐変形性の低下は、
必ずしもフツ化ビニリデン−三フツ化エチレン共
重合体フイルムの固有の特性ではなく、重合体分
子鎖のフイルム中における配列状態が不適当であ
つたことによるのであり、同共重合体の分子量を
増大し、且つ適当な成膜方法を採用して重合体分
子鎖をフイルム面に平行に配列させれば、熱処理
後において充分に高いKtを維持し、且つ実用上
充分な二次加工性が得られることを見出した。 For the above-mentioned purpose, the present inventors have conducted extensive research on the properties of vinylidene fluoride-ethylene trifluoride copolymers, and have found that the resistance to deformation, such as cracking during bending, due to heat treatment to improve Kt. The decline is
This is not necessarily due to the inherent properties of the vinylidene fluoride-ethylene trifluoride copolymer film, but is due to the inappropriate arrangement of the polymer molecular chains in the film, and it is believed that increasing the molecular weight of the copolymer may result in an inappropriate alignment of the polymer molecular chains within the film. , and if an appropriate film formation method is adopted to arrange the polymer molecular chains parallel to the film surface, a sufficiently high Kt can be maintained after heat treatment, and practically sufficient secondary processability can be obtained. I found out.
このような知見に照らして、従来のフツ化ビニ
リデン−三フツ化エチレン共重合体圧電膜の製造
技術を見ると、特開昭56−111281号公報において
は、具体例として、押出、プレスロール圧延等の
熱加工により成膜されているが、これら成膜方法
は、本質的に重合体分子鎖のフイルム面と平行な
方向への配列方法としては、好ましい方法ではな
い。一方、重合体溶液からのキヤステイングは、
潜在的に良好な重合体分子鎖の配列を与えるもの
であるが、実際に良好な配列が得られるために
は、重合体がかなりの高分子量のものである必要
がある。この点は、本発明者等がフツ化ビニリデ
ン重合体のキヤステイングに際して、見出した知
見であり、特願昭57−214249号の明細書において
明らかにしたものであるが、本発明におけるフツ
化ビニリデン−三フツ化エチレン共重合体につい
ても認められた。これに対し、この共重合体のキ
ヤステイングによる成膜を採用する従来技術にお
いては、上述したような分子量のもつ意味が全く
認識されず、また充分な分子量を有する上記共重
合体が用いられているとも考えられない。たとえ
ば、特公昭50−29159号公報の具体例によつて用
いられる共重合体のインヒーレントビスコシテイ
は1.0dl/g程度である。また特開昭58−60585号
公報において示す具体例においては、高濃度の溶
液が用いられており、この共重合体の溶解度を考
慮すると、比較的分子量の小さな重合体に関する
ものと考えられる。本発明は、上記一連の知見に
基づき、高分子量のフツ化ビニリデン−三フツ化
エチレン共重合体を用い、キヤステイング法によ
る重合体分子鎖の配列効果を最大限に利用して、
分子鎖配列の良好な、したがつて、良好なKtと
熱処理後も良好な二次加工性を有するフツ化ビニ
リデン−三フツ化エチレン共重合体圧電膜を製造
せんとするものである。すなわち本発明のフツ化
ビニリデン共重合体圧電膜の製造方法は、温度30
℃における濃度0.4g/dlのジメチルホルムアミ
ド溶液として測定したインヒーレントビスコシテ
イが3.0dl/g以上であり、フツ化ビニリデン40
〜90モル%および三フツ化エチレン10〜60モル%
からなる共重合体をキヤステイングし、得られた
共重合体膜を、結晶転移温度を5℃下廻る温度と
融点との間の温度で熱処理し、熱処理と同時に又
は熱処理後に、共重合体膜にほぼ垂直な直流電界
を印加して処理することを特徴とするものであ
る。 In light of such knowledge, when looking at the conventional manufacturing technology of vinylidene fluoride-ethylene trifluoride copolymer piezoelectric films, JP-A-56-111281 discloses extrusion, press roll rolling, etc. as specific examples. However, these film-forming methods are not preferable methods for essentially arranging polymer molecular chains in a direction parallel to the film surface. On the other hand, casting from polymer solution is
Although potentially providing good alignment of the polymer molecular chains, in order to actually obtain good alignment the polymer needs to be of fairly high molecular weight. This point was discovered by the present inventors when casting vinylidene fluoride polymers, and was clarified in the specification of Japanese Patent Application No. 57-214249. - It was also observed for trifluoroethylene copolymer. On the other hand, in the conventional technology that employs film formation by casting this copolymer, the above-mentioned meaning of molecular weight is not recognized at all, and the above-mentioned copolymer having a sufficient molecular weight is not used. I can't imagine there being any. For example, the inherent viscocity of the copolymer used in the specific example of Japanese Patent Publication No. 50-29159 is about 1.0 dl/g. Further, in the specific example shown in JP-A-58-60585, a highly concentrated solution is used, and considering the solubility of this copolymer, it is considered that the copolymer is related to a relatively small molecular weight polymer. The present invention is based on the above series of findings, uses a high molecular weight vinylidene fluoride-ethylene trifluoride copolymer, and maximizes the arrangement effect of polymer molecular chains by the casting method.
The object of the present invention is to produce a vinylidene fluoride-ethylene trifluoride copolymer piezoelectric film having a good molecular chain arrangement, and thus a good Kt and good secondary processability even after heat treatment. That is, the method for producing the vinylidene fluoride copolymer piezoelectric film of the present invention is carried out at a temperature of 30
The inherent viscocity measured as a dimethylformamide solution with a concentration of 0.4 g/dl at °C is 3.0 dl/g or more, and vinylidene fluoride 40
~90 mol% and trifluoroethylene 10-60 mol%
The resulting copolymer film is heat-treated at a temperature between 5°C below the crystal transition temperature and the melting point, and simultaneously or after the heat treatment, The process is characterized by applying a direct current electric field substantially perpendicular to the .
以下、本発明を更に詳細に説明する。 The present invention will be explained in more detail below.
本発明において原料として用いるフツ化ビニリ
デン共重合体は、必項成分として、フツ化ビニリ
デンを40〜90モル%、好ましくは65〜85モル%、
三フツ化エチレンを10〜60モル%、好ましくは15
〜30モル%の割合で含む。原料共重合体は、上記
二成分からなる二元共重合体であることが望まし
いが、この他に少量のフツ化ビニル、四フツ化エ
チレン、六フツ化プロピレン、三フツ化塩化エチ
レン等のフツ素含有単量体の1種または2種以上
を構成単位として加えてもよい。上記いずれの場
合においても、フツ化ビニリデン及び三フツ化エ
チレンが上記範囲外になると、得られる圧電膜の
Ktが小さくなり、超音波送受波能が小さくなつ
たり、柔軟性を失なう為に、上記した必須の二成
分を上記組成範囲内とする必要がある。 The vinylidene fluoride copolymer used as a raw material in the present invention contains vinylidene fluoride in an essential component of 40 to 90 mol%, preferably 65 to 85 mol%,
10 to 60 mol% of ethylene trifluoride, preferably 15
Contains at a rate of ~30 mol%. The raw material copolymer is preferably a binary copolymer consisting of the above two components, but in addition, small amounts of vinyl fluoride, ethylene tetrafluoride, propylene hexafluoride, ethylene trifluoride chloride, etc. One or more types of element-containing monomers may be added as structural units. In any of the above cases, if vinylidene fluoride and ethylene trifluoride are outside the above range, the resulting piezoelectric film will deteriorate.
Since Kt becomes small, the ultrasonic wave transmission/reception ability becomes small, and flexibility is lost, it is necessary to keep the above-mentioned two essential components within the above-mentioned composition range.
本発明においては、上記したフツ化ビニリデン
−三フツ化エチレン共重合体のうち、温度30℃に
おける濃度0.4g/dlのジメチルホルムアミド溶
液として測定したインヒーレントビスコシテイ
(本明細書において、単に「インヒーレントビス
コシテイ」というときは、この定義によるもので
ある)が、3.0dl/g以上のものが用いられる。
インヒーレントビスコシテイの上限は特にない
が、この値が大きくなるにつれて、キヤステイン
グ時の溶液濃度を薄くすることが必要となり、厚
物フイルムを製造する際の障害となるので、通常
10.0dl/g以下が多用される。 In the present invention, among the vinylidene fluoride-ethylene trifluoride copolymers mentioned above, the inherent viscocity (herein simply referred to as "inherent viscocity") measured as a dimethylformamide solution with a concentration of 0.4 g/dl at a temperature of 30 ° C. When referring to "healent viscocity", it is based on this definition) that is 3.0 dl/g or more.
There is no particular upper limit for inherent viscocity, but as this value increases, it becomes necessary to reduce the concentration of the solution during casting, which becomes an obstacle when producing thick films, so it is usually
10.0 dl/g or less is often used.
上記したような、共重合体を溶液化し、キヤス
テイングによつて成膜する。溶液成形のために用
いられる溶媒は、室温若しくは加熱下に於て、該
共重合体を溶解し得るものであれば良い。例えば
ジメチルアセトアミド、ジメチルホルムアミド、
ジメチルスルフオキサイド等の有極性有機溶媒が
好適に用いられる。溶液中の樹脂濃度は、該共重
合体の重合度によつても異なるが、実用的には、
0.3〜15重量%、特に、0.5〜10重量%程度が採用
される。成膜は上記の様な所定濃度の均一な溶液
を公知の方法に従つてキヤステイングすることに
より行なわれる。例えば、ガラス板、アルミニウ
ム等の合成板、或いは、上記溶液中の溶媒に溶解
しにくい高分子フイルム等の基材上等に流延もし
くは、塗布により湿潤膜を成形した後、溶媒を蒸
発させ、必要に応じて基材より剥離することによ
り、共重合体膜が得られる。この共重合体膜は、
適宜延伸されてもよく、通常、数μ〜500μ程度
の厚さの範囲が用いられる。次いで、以上の方法
により得られた共重合体フイルムを、その結晶転
移温度より5℃下廻る温度と融点の間で熱処理す
る。ここで、融点とは、昇温速度4℃/分で昇温
したときのDSC(デイフアレンシヤル、スキヤニ
ング、カロリーメータ)曲線において最大の吸熱
ピークを与える温度であり、結晶転移温度とは、
最大吸熱ピークよりも低温側に現われるピークま
たはシヨルダーであり、複数あるときは融点に近
いピークまたはシヨルダーを与える温度として定
義される。この熱処理は、フイルムの結晶化度を
高めてKtを向上するためになされる。処理時間
は、好適には結晶化度がほぼ飽和になる程度迄の
適当な時間であるが、通常は約10分〜2時間程度
が採用される。 A copolymer as described above is made into a solution and formed into a film by casting. The solvent used for solution molding may be any solvent that can dissolve the copolymer at room temperature or under heating. For example, dimethylacetamide, dimethylformamide,
Polar organic solvents such as dimethyl sulfoxide are preferably used. The resin concentration in the solution varies depending on the degree of polymerization of the copolymer, but in practical terms,
A content of about 0.3 to 15% by weight, particularly about 0.5 to 10% by weight is adopted. Film formation is carried out by casting a uniform solution of a predetermined concentration as described above according to a known method. For example, after forming a wet film by casting or coating on a substrate such as a glass plate, a synthetic plate such as aluminum, or a polymer film that is difficult to dissolve in the solvent in the solution, the solvent is evaporated, A copolymer film can be obtained by peeling it from the base material if necessary. This copolymer membrane is
It may be stretched as appropriate, and the thickness range is usually from several microns to about 500 microns. The copolymer film obtained by the above method is then heat treated at a temperature between 5° C. below its crystal transition temperature and its melting point. Here, the melting point is the temperature that gives the maximum endothermic peak in the DSC (differential scanning, calorimeter) curve when the temperature is raised at a heating rate of 4°C/min, and the crystal transition temperature is
A peak or shoulder that appears on the lower temperature side than the maximum endothermic peak, and when there are multiple peaks or shoulders, it is defined as the temperature that gives a peak or shoulder close to the melting point. This heat treatment is performed to increase the crystallinity of the film and improve the Kt. The treatment time is preferably an appropriate time until the degree of crystallinity is almost saturated, but usually about 10 minutes to 2 hours is employed.
この熱処理後、或いは熱処理と共に、電場印加
される。電場印加諸条件は、ポリフツ化ビニリデ
ン圧電膜に用いられるものと本質的に同じであ
る。電界強度は、絶縁破壊を生じない限度で高い
程望ましく、電界印加時間も長い程望ましいが、
生産効率上から、通常は300〜1000KV/cm、約
10分/2時間の範囲が多用される。また、緊張熱
処理(すなわち、熱処理に際しての収縮を抑える
程度に周辺を固定した条件下での熱処理)が、好
ましく用いられる。 After or together with this heat treatment, an electric field is applied. The electric field application conditions are essentially the same as those used for polyvinylidene fluoride piezoelectric films. The electric field strength is preferably as high as possible without causing dielectric breakdown, and the electric field application time is also preferably long.
For production efficiency, normally 300-1000KV/cm, approx.
The 10 minute/2 hour range is often used. Further, tension heat treatment (that is, heat treatment under conditions in which the periphery is fixed to such an extent as to suppress shrinkage during heat treatment) is preferably used.
上記のようにして得られた圧電膜は、たとえば
後述する第1図に示す超音波トランスジユーサ素
子におけるように、素子の特性を向上するために
その素子に適した形状に変形ないし、二次加工し
て使用に供される。 The piezoelectric film obtained in the above manner may be deformed into a shape suitable for the device or secondary Processed and used.
上述したように本発明法によれば、充分に大き
な分子量を有するフツ化ビニリデン−三フツ化エ
チレン共重合体を用い、これをキヤステイングに
より成膜後、熱処理ならびに電界処理を行うこと
により、比較的高いKtを有し且つ二次加工特性
に優れるため、一般に変換効率の高い電気機械変
換素子、特に超音波受波能の高い超音波トランス
ジユーサ用素子を高い収率で与え得るフツ化ビニ
リデン共重合体圧電膜が得られる。 As mentioned above, according to the method of the present invention, a vinylidene fluoride-ethylene trifluoride copolymer having a sufficiently large molecular weight is used, and after forming a film by casting, heat treatment and electric field treatment are performed. Vinylidene fluoride has a high Kt and excellent secondary processing characteristics, so it can be used to produce electromechanical transducer elements with high conversion efficiency in general, and ultrasonic transducer elements with high ultrasonic wave receiving ability in high yield. A copolymer piezoelectric membrane is obtained.
以下、本発明の実施例及び比較例を示す。 Examples and comparative examples of the present invention are shown below.
実施例 1
撹拌器付ステンレスオートクレーブ内にメチル
セルロースを懸濁剤とする水溶液を入れ、5℃に
冷却後に、重合開始剤としてn−プロピルパーオ
キシジカーボネート、その他の重合助剤を添加
し、N2置換後よく撹拌した。この後、オートク
レーブを、メタノール−ドライアイス系で外部よ
り冷却し、オートクレーブ内にフツ化ビニリデ
ン、三フツ化エチレンを、それぞれモル比で75
%、25%になるようにボンベより圧入した。次い
で、オートクレーブ内温度を上昇させ、重合を開
始させた後、オートクレーブ外温を約20℃に保つ
て重合を継続させた。重合初期圧は、32Kg/cm2
で、経時的に圧力低下が認められ、最終的に約8
Kg/cm2となつた段階で残圧をパージし、重合を終
了させたところ、白色のパウダーが得られた。よ
く水洗いし、乾燥して白色の共重合体パウダーを
得た。収率は90%以上であり、ほぼ仕込組成の二
元共重合体で得られたことになる。この共重合体
のインヒーレントビスコシテイηinhは5.9dl/g
であつた。このパウダーを、ジメチルホルムアミ
ドを溶媒としてキヤステイングし、30μ程度のキ
ヤストフイルムを得た。この未延伸フイルムを
132℃で空気中で1時間乾燥した後に、その両面
にアルミニウム蒸着によつてそれぞれ電極を形成
し、85℃で、電界強度650KV/cmの直流電圧を
30分間印加し、電圧印加のまま室温迄冷却し、分
極処理を施した。このフイルムの圧電定数d31を
東洋精機製レオログラフを用い10Hzで測定した結
果d31+d32=25pC/Nであつた。なお、ここで用
いている試料は未延伸の高分子フイルムを分極処
理しているので、d31=d32である。また、圧電定
数d31、d32は、次のように定義されるものであ
る。即ち、圧電性を示す高分子の場合は、一般に
延伸方向にx軸、それに直角なフイルム延伸方向
にy軸、フイルム面に垂直にz軸をとり、x,
y,z軸を決定し、x軸方向に応力を印加したと
きのz軸方向の分極を示す圧電定数をd31、y軸
方向及びz軸方向に応力を印加したときのz軸方
向の分極を示す圧電定数を、それぞれd32、d33と
する。電気機械結合係数Kt(z−z軸方向)は、
圧電体フイルムの自由共振点付近の電気アドミツ
タンスと位相角の周波数依存性を解析することに
よつて求めた結果、Kt=0.275であつた。この圧
電体フイルムの180度折り曲げ試験の結果、往復
50回以上の折り曲げをしても切断が生ぜず、又25
℃、50%湿度下、試長4cm、巾1cm、引張速度1
cm/分でのテンシロンによる伸度測定を行つたと
ころ165%の伸びを示した。Example 1 An aqueous solution containing methylcellulose as a suspending agent was placed in a stainless steel autoclave equipped with a stirrer, and after cooling to 5°C, n-propyl peroxydicarbonate as a polymerization initiator and other polymerization aids were added, and N 2 After the substitution, the mixture was thoroughly stirred. After that, the autoclave was cooled from the outside with a methanol-dry ice system, and vinylidene fluoride and ethylene trifluoride were added to the autoclave at a molar ratio of 75
%, and was press-fitted from the cylinder so that it was 25%. Next, the temperature inside the autoclave was raised to initiate polymerization, and then the outside temperature of the autoclave was maintained at about 20° C. to continue polymerization. The initial pressure of polymerization is 32Kg/cm 2
A decrease in pressure was observed over time, and the pressure eventually reached approximately 8
When the residual pressure reached Kg/cm 2 , the residual pressure was purged to terminate the polymerization, and a white powder was obtained. It was thoroughly washed with water and dried to obtain a white copolymer powder. The yield was 90% or more, which means that a binary copolymer having almost the same composition as the initial composition was obtained. The inherent viscocity ηinh of this copolymer is 5.9dl/g
It was hot. This powder was casted using dimethylformamide as a solvent to obtain a cast film of about 30 μm. This unstretched film
After drying in air at 132℃ for 1 hour, electrodes were formed on both sides by aluminum evaporation, and a DC voltage with an electric field strength of 650KV/cm was applied at 85℃.
The voltage was applied for 30 minutes, and the voltage was cooled to room temperature while the voltage was being applied to perform polarization treatment. The piezoelectric constant d 31 of this film was measured at 10 Hz using a rheograph manufactured by Toyo Seiki Co., Ltd., and the result was d 31 +d 32 =25 pC/N. Note that since the sample used here is an unstretched polymer film that has been subjected to polarization treatment, d 31 =d 32 . Moreover, the piezoelectric constants d 31 and d 32 are defined as follows. That is, in the case of polymers exhibiting piezoelectricity, the x-axis is generally in the stretching direction, the y-axis is in the film stretching direction perpendicular to the stretching direction, and the z-axis is perpendicular to the film surface.
Determine the y and z axes, and calculate the piezoelectric constant that indicates the polarization in the z-axis direction when stress is applied in the x-axis direction as d 31 , and the polarization in the z-axis direction when stress is applied in the y-axis and z-axis directions. Let the piezoelectric constants representing d 32 and d 33 be respectively. The electromechanical coupling coefficient Kt (z-z axis direction) is
The result obtained by analyzing the frequency dependence of the electrical admittance and phase angle near the free resonance point of the piezoelectric film was Kt=0.275. As a result of a 180 degree bending test of this piezoelectric film, the reciprocating
Even if it is bent more than 50 times, it will not break, and the
℃, 50% humidity, sample length 4cm, width 1cm, tensile speed 1
Tensilon elongation measurements in cm/min showed an elongation of 165%.
この圧電体フイルムの超音波送受波能を調べる
ために、縦断面図が第1図の如き超音波トランス
ジユーサー1を用いた。即ち、このトランスジユ
ーサ1は、一端が曲率半径7mmの凹面形状を有す
るベークライト棒2の凹面部に、音響反射板とな
る1/4波長厚み(すなわち60μ)の銅板3および
該圧電体フイルム4を順次、エポキシ系接着剤を
介して圧着してなる。なお、超音波トランスデユ
ーサの両面には、径10mmの電極(図示せず)を有
する。次に第2図の如く、該超音波トランスデユ
ーサ1を、容器中の水5に浸漬したアクリル樹脂
板6に対して配置し、且つマツチング回路7を介
して、パルサーレシーバー8(K13−
AEROTECH社製UTA−3)ならびにオシロス
コープ9に接続し、パルスエコー法により超音波
送受波能を測定した。レシーバーのゲインを
40dBにセツトし、パルスエコーの電圧を読んだ
ところVp.p.(ピーク.トウ.ピーク電圧)で43V
の値が得られた。 In order to examine the ultrasonic wave transmitting and receiving ability of this piezoelectric film, an ultrasonic transducer 1 whose vertical cross-sectional view is shown in FIG. 1 was used. That is, this transducer 1 includes a bakelite rod 2 having a concave shape with a radius of curvature of 7 mm at one end, a copper plate 3 having a quarter wavelength thickness (i.e. 60 μm) serving as an acoustic reflector, and a piezoelectric film 4 on the concave surface of the bakelite rod 2. These are successively bonded together using epoxy adhesive. Note that the ultrasonic transducer has electrodes (not shown) with a diameter of 10 mm on both sides. As shown in FIG.
It was connected to AEROTECH UTA-3) and an oscilloscope 9, and the ultrasonic transmission and reception ability was measured by the pulse echo method. receiver gain
When I set it to 40dB and read the pulse echo voltage, it was 43V at Vp.p. (peak.to.peak voltage).
The value of was obtained.
比較例 1
実施例1に準じた方法で得たフツ化ビニリデン
75モル%、三フツ化エチレン25モル%からなる二
元共重合体(インヒーレントビスコシイテイηinh
=1.29dl/g)の溶液からの厚さ約30μmのキヤ
ストフイルムについて、実施例1と全く同一条件
で熱処理、分極処理を施した。得られたフイルム
のd31+d32定数は20pC/Nであり、Ktは0.217で
あつた。この圧電体フイルムは、180度折り曲げ
試験の結果、往復1回の折り曲げで、切断し、
又、テンシロンによる室温に於ける伸度はゼロで
あり、非常に脆弱な圧電体フイルムであつた。こ
の圧電体フイルムを用いて、実施例1と同様に超
音波トランスデユーサを製作し、出力電圧(Vp.
p.)を測定したところ、28Vであつた。なお、超
音波トランスデユーサ製作にあたつて、圧電体と
銅板の接着は、実施例1と同じ条件で製作した
が、圧電体が脆弱のために製作過程で、しばしば
亀裂が発生し多大の損失が生じた。Comparative Example 1 Vinylidene fluoride obtained by a method according to Example 1
A binary copolymer consisting of 75 mol% and 25 mol% of ethylene trifluoride (inherent viscosity ηinh).
A cast film with a thickness of about 30 μm prepared from a solution of 1.29 dl/g) was subjected to heat treatment and polarization treatment under exactly the same conditions as in Example 1. The obtained film had a d 31 +d 32 constant of 20 pC/N and a Kt of 0.217. As a result of a 180 degree bending test, this piezoelectric film could be cut by bending it back and forth once.
Furthermore, the elongation of Tensilon at room temperature was zero, making it a very fragile piezoelectric film. Using this piezoelectric film, an ultrasonic transducer was manufactured in the same manner as in Example 1, and the output voltage (Vp.
p.) was measured and found to be 28V. In manufacturing the ultrasonic transducer, the piezoelectric body and the copper plate were bonded together under the same conditions as in Example 1, but due to the piezoelectric body being fragile, cracks often occurred during the manufacturing process, resulting in a large amount of damage. A loss has occurred.
比較例 2
実施例1に準じた方法で得たフツ化ビニリデン
75モル%、三フツ化エチレン25モル%からなる二
元共重合体(インヒーレントビスコシテイηinh=
1.82dl/g)の粉末を、融点をはるかに超える
270℃でメルトインデクサーにかけたが樹脂は容
易に降下しなかつた。これは、熱溶融成形が明ら
かに不適な程度に高分子量であることを示す。Comparative Example 2 Vinylidene fluoride obtained by a method similar to Example 1
Binary copolymer consisting of 75 mol% and trifluoroethylene 25 mol% (inherent viscocity ηinh=
1.82 dl/g) far above the melting point.
Although it was applied to a melt indexer at 270°C, the resin did not fall easily. This indicates a high molecular weight that is clearly unsuitable for hot melt molding.
次に、上記共重合体を溶解し、その溶液から実
施例と同様にして得た厚さ約30μmのキヤストフ
イルムについて、実施例1と全く同一条件で熱処
理、分極処理を施した。得られたフイルムのd31
+d32定数は21pC/Nであり、Ktは0.229を示し
た。この圧電体フイルムについて試料数3(n=
3)で、180度折り曲げ試験を行つた結果、往復
1回の折り曲げで2枚が切断し、往復2回の折り
曲げで残りの1枚も切断した。又、テンシロンに
よる室温に於ける伸度も殆どゼロであつた。この
圧電体フイルムを用いて、実施例1と同様に超音
波トランスデユーサを製作し、出力電圧(Vp.p.)
を測定したところ、30Vであつた。なお、超音波
トランスデユーサ製作にあたつて、圧電体と銅板
の接着は、実施例1と同じ条件で製作したが、圧
電体の強度不足のために製作過程での亀裂の発生
は避けられなかつた。 Next, the above copolymer was dissolved, and a cast film with a thickness of about 30 μm obtained from the solution in the same manner as in Example 1 was subjected to heat treatment and polarization treatment under exactly the same conditions as in Example 1. d 31 of the obtained film
The +d 32 constant was 21 pC/N and the Kt was 0.229. The number of samples for this piezoelectric film was 3 (n=
In 3), a 180 degree bending test was performed, and as a result, two sheets were cut after one round trip, and the remaining sheet was also cut after two round trips. Furthermore, the elongation due to Tensilon at room temperature was almost zero. Using this piezoelectric film, an ultrasonic transducer was manufactured in the same manner as in Example 1, and the output voltage (Vp.p.
When I measured it, it was 30V. In manufacturing the ultrasonic transducer, the piezoelectric body and the copper plate were bonded under the same conditions as in Example 1, but cracks could not be generated during the manufacturing process due to the lack of strength of the piezoelectric body. Nakatsuta.
以上の例からもわかるように、本発明法により
得られる圧電膜は、前記実施例に示す測定法によ
る伸度が20%以上、好ましい条件によれば30%以
上、更には40%以上とすることも可能であり、超
音波トランスデユーサ用素子をはじめ、電気−機
械変換素子としての変換性能を高めるための、二
次加工性ないしは耐変形性に優れる。また実施例
においてKt=0.275が得られているように、Kt
は、一般に0.22以上、好ましい条件では0.23以
上、更には0.24以上とすることも可能となる。ま
た、この圧電体膜は、伸びの圧電性、焦電性をは
じめとして、ポリフツ化ビニリデン圧電体に通有
の諸性能を有し、更に機械的特性にも優れること
を特徴とするものである。 As can be seen from the above examples, the piezoelectric film obtained by the method of the present invention has an elongation of 20% or more by the measurement method shown in the above example, 30% or more under preferable conditions, and even 40% or more. It also has excellent secondary processability or deformation resistance to improve conversion performance as an electro-mechanical conversion element, including an element for an ultrasonic transducer. In addition, as Kt=0.275 was obtained in the example, Kt
is generally 0.22 or more, and under preferable conditions it can be 0.23 or more, and even 0.24 or more. In addition, this piezoelectric film has various performances common to polyvinylidene fluoride piezoelectric materials, including elongation piezoelectricity and pyroelectricity, and is also characterized by excellent mechanical properties. .
第1図は、本発明法による圧電膜を用いる超音
波トランスデユーサの縦断面図であり、第2図は
この超音波トランスジユーサの超音波送受波能を
調べるための装置系のブロツク線図である。
1…超音波トランスジユーサ、2…ベークライ
ト棒、3…銅板、4…圧電体膜、6…アクリル樹
脂板、7…マツチング回路、8…パルサーレシー
バー、9…オシロスコープ。
Fig. 1 is a longitudinal cross-sectional view of an ultrasonic transducer using a piezoelectric film according to the method of the present invention, and Fig. 2 is a block diagram of a device system for investigating the ultrasonic wave transmission and reception ability of this ultrasonic transducer. It is a diagram. DESCRIPTION OF SYMBOLS 1... Ultrasonic transducer, 2... Bakelite rod, 3... Copper plate, 4... Piezoelectric film, 6... Acrylic resin board, 7... Matching circuit, 8... Pulsar receiver, 9... Oscilloscope.
Claims (1)
ホルムアミド溶液として測定したインヒーレント
ビスコシテイが3.0dl/g以上であり、フツ化ビ
ニリデン40〜90モル%および三フツ化エチレン10
〜60モル%からなる共重合体をキヤステイング
し、得られた共重合体膜を、結晶転移温度を5℃
下廻る温度と融点との間の温度で熱処理し、熱処
理と同時に又は熱処理後に、共重合体膜にほぼ垂
直な直流電界を印加して処理すること特徴とする
フツ化ビニリデン共重合体圧電膜の製造方法。1 Inherent viscocity measured as a dimethylformamide solution with a concentration of 0.4 g/dl at a temperature of 30°C is 3.0 dl/g or more, and vinylidene fluoride 40 to 90 mol% and ethylene trifluoride 10
A copolymer consisting of ~60 mol% is casted, and the resulting copolymer film is heated to a crystal transition temperature of 5°C.
A piezoelectric film made of a vinylidene fluoride copolymer, which is heat-treated at a temperature between the temperature below and the melting point, and is treated by applying a DC electric field substantially perpendicular to the copolymer film simultaneously with or after the heat treatment. Production method.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153125A JPS6047034A (en) | 1983-08-24 | 1983-08-24 | Production of piezoelectric vinylidene fluoride copolymer film |
| DE3429884A DE3429884C2 (en) | 1983-08-16 | 1984-08-14 | A piezoelectric polymer film made of a vinylidene fluoride copolymer in the polarized state and use thereof as an electro-mechanical coupling element for ultrasonic measuring transducers |
| GB8420728A GB2145106B (en) | 1983-08-16 | 1984-08-15 | Polymer piezoelectric film and process for producing the same |
| US06/640,835 US4784915A (en) | 1983-08-16 | 1984-08-15 | Polymer piezoelectric film |
| FR8412863A FR2550904B1 (en) | 1983-08-16 | 1984-08-16 | PIEZOELECTRIC POLYMER FILM AND METHOD FOR THE PRODUCTION THEREOF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153125A JPS6047034A (en) | 1983-08-24 | 1983-08-24 | Production of piezoelectric vinylidene fluoride copolymer film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6047034A JPS6047034A (en) | 1985-03-14 |
| JPH051636B2 true JPH051636B2 (en) | 1993-01-08 |
Family
ID=15555522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58153125A Granted JPS6047034A (en) | 1983-08-16 | 1983-08-24 | Production of piezoelectric vinylidene fluoride copolymer film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047034A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04311711A (en) * | 1991-04-11 | 1992-11-04 | Central Glass Co Ltd | Ferromagnetic copolymer and production of thin film therefrom |
| US20110021917A1 (en) * | 2008-07-22 | 2011-01-27 | Konica Minolta Medical & Graphic, Inc. | Organic piezoelectric material film, method for production of the same, method for production of ultrasonic oscillator using the same, and ultrasonic medical imaging instrument |
| JP2010064284A (en) * | 2008-09-08 | 2010-03-25 | Tokyo Univ Of Science | Ferroelectric cast film and its manufacturing method |
| JP5714235B2 (en) * | 2010-03-11 | 2015-05-07 | 株式会社クレハ | Additive-free and non-stretched piezoelectric body and PV sensor containing PVDF |
| JP2019067908A (en) * | 2017-09-29 | 2019-04-25 | 株式会社クレハ | Piezoelectric film and method of manufacturing film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5326995A (en) * | 1976-08-25 | 1978-03-13 | Daikin Ind Ltd | Highhmolecular piezooelectric material |
| JPS56111281A (en) * | 1980-02-07 | 1981-09-02 | Toray Ind Inc | High molecular piezoelectric body and manufacture thereof |
-
1983
- 1983-08-24 JP JP58153125A patent/JPS6047034A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6047034A (en) | 1985-03-14 |
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