JPH0517318B2 - - Google Patents

Info

Publication number
JPH0517318B2
JPH0517318B2 JP60017394A JP1739485A JPH0517318B2 JP H0517318 B2 JPH0517318 B2 JP H0517318B2 JP 60017394 A JP60017394 A JP 60017394A JP 1739485 A JP1739485 A JP 1739485A JP H0517318 B2 JPH0517318 B2 JP H0517318B2
Authority
JP
Japan
Prior art keywords
plating liquid
hole
plating
mask
supply hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60017394A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177390A (ja
Inventor
Kazuo Maetani
Keisuke Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP60017394A priority Critical patent/JPS61177390A/ja
Priority to GB08601963A priority patent/GB2170513B/en
Priority to US06/823,630 priority patent/US4675093A/en
Publication of JPS61177390A publication Critical patent/JPS61177390A/ja
Publication of JPH0517318B2 publication Critical patent/JPH0517318B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60017394A 1985-01-31 1985-01-31 部分メツキ装置 Granted JPS61177390A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60017394A JPS61177390A (ja) 1985-01-31 1985-01-31 部分メツキ装置
GB08601963A GB2170513B (en) 1985-01-31 1986-01-28 Selectively plating apparatus for forming an annular coated area
US06/823,630 US4675093A (en) 1985-01-31 1986-01-29 Selectively plating apparatus for forming an annular coated area

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60017394A JPS61177390A (ja) 1985-01-31 1985-01-31 部分メツキ装置

Publications (2)

Publication Number Publication Date
JPS61177390A JPS61177390A (ja) 1986-08-09
JPH0517318B2 true JPH0517318B2 (2) 1993-03-08

Family

ID=11942782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60017394A Granted JPS61177390A (ja) 1985-01-31 1985-01-31 部分メツキ装置

Country Status (1)

Country Link
JP (1) JPS61177390A (2)

Also Published As

Publication number Publication date
JPS61177390A (ja) 1986-08-09

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