JPH05178384A - Bag for protecting electronic device - Google Patents
Bag for protecting electronic deviceInfo
- Publication number
- JPH05178384A JPH05178384A JP3159851A JP15985191A JPH05178384A JP H05178384 A JPH05178384 A JP H05178384A JP 3159851 A JP3159851 A JP 3159851A JP 15985191 A JP15985191 A JP 15985191A JP H05178384 A JPH05178384 A JP H05178384A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- bag
- electronic device
- silicon
- protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000565 sealant Substances 0.000 claims abstract description 19
- 239000002216 antistatic agent Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 72
- 238000004806 packaging method and process Methods 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000007789 gas Substances 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 abstract description 7
- 230000002411 adverse Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 12
- 230000035699 permeability Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229940123973 Oxygen scavenger Drugs 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Bag Frames (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ、ＭＯＳ型ＩＣそ
の他の電子部品やこれらの電子部品を実装した電子機器
を、静電気から保護するだけでなく、空気、酸素、有害
ガスなどによる酸化、腐食などからも保護するための電
子機器の保護用包袋に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention not only protects ICs, MOS type ICs and other electronic components and electronic devices on which these electronic components are mounted from static electricity, but also oxidizes them by air, oxygen, harmful gas, etc. The present invention relates to a protective packaging bag for electronic devices that is also protected from corrosion and the like.
【０００２】[0002]
【従来の技術】従来より、この種の包袋として図７ない
し図１０に示すような種々の製品が知られている。図７
に示す包袋１０は、ポリエステルからなる絶縁層１３を
ベースフィルムとして、外面２２側に、金属の導電層１
２と、ポリエステル、ポリオレフィンなどの樹脂の保護
層１１とを積層し、内面２３側に、帯電防止剤入りのシ
ーラント層１４を積層してなるものである（特公昭６０
−１８２９４）。図８に示すものは、図７における導電
層１２と絶縁層１３の積層順序を逆にしたものである。
図９に示すものは、シーラント層１４だけからなり、図
１０に示すものは、絶縁層１３とシーラント層１４から
なる簡易型の包袋１０である。2. Description of the Related Art Conventionally, various products as shown in FIGS. 7 to 10 have been known as this type of packaging bag. Figure 7
In the packaging bag 10 shown in FIG. 1, the insulating layer 13 made of polyester is used as a base film, and the metal conductive layer 1 is provided on the outer surface 22 side.
2 and a protective layer 11 made of a resin such as polyester or polyolefin are laminated, and a sealant layer 14 containing an antistatic agent is laminated on the inner surface 23 side (Japanese Patent Publication No. Sho 60).
-18294). In FIG. 8, the order of stacking the conductive layer 12 and the insulating layer 13 in FIG. 7 is reversed.
What is shown in FIG. 9 is only the sealant layer 14, and what is shown in FIG. 10 is a simple type packaging bag 10 that is made of the insulating layer 13 and the sealant layer 14.
【０００３】上記のうち、図７に示すものが、静電気か
らの保護では、現在最も特性の優れたもので、包袋１０
と電子機器２０との間における摩擦静電気は、シーラン
ト層１４によって防止され、また、包袋１０と外部物体
との間において、人体からの直接放電や電界の自然放電
などは、導電層１２によって防止される。さらに、構成
材料に、透明または半透明のものを使用することによ
り、内部の電子機器２０が確認できるものが多い。Of the above, the one shown in FIG. 7 has the best characteristics at present in terms of protection from static electricity.
The friction static electricity between the electronic device 20 and the electronic device 20 is prevented by the sealant layer 14, and the direct discharge from the human body and the natural discharge of the electric field between the packaging bag 10 and the external object are prevented by the conductive layer 12. To be done. Furthermore, by using transparent or translucent materials as the constituent materials, there are many things in which the internal electronic device 20 can be confirmed.
【０００４】[0004]
【発明が解決しようとする課題】しかるに、従来の電気
的特性の面からだけで保護しても、電子機器２０の保護
が充分とはいえない。包袋１０を浸透したり、中に封じ
込められたりしている空気、酸素、有害ガスなどによっ
て電子機器２０に錆が発生したり、腐食したり、特性が
劣化したり、不良品となったりすることがあるからであ
る。この対策として考えられることは、１つは、包袋１
０の内部を脱気して中の空気や有害ガスを取り除くこと
であり、他の１つは、脱酸素剤を封入することである。However, it cannot be said that the electronic device 20 is sufficiently protected even if it is protected only from the viewpoint of the conventional electrical characteristics. The electronic device 20 may be rusted, corroded, deteriorated in characteristics, or become a defective product due to air, oxygen, harmful gas, or the like that permeates the packaging bag 10 or is contained therein. Because there are things. One possible solution to this problem is the wrapping bag 1.
The inside of 0 is deaerated to remove the air and harmful gas inside, and the other one is to enclose the oxygen scavenger.
【０００５】包袋１０の内部を脱気するには、従来品で
は、透湿度が精々５．０ｇ／ｍ2２４ｈｒｓであり、そ
れ以上の透湿度や酸素透過度を上げるには、塩化ビニリ
デン樹脂などの防湿度の高い樹脂などを使用する必要が
あった。ところが、塩化ビニリデンを表面にコーティン
グすると、絶縁層が形成されて帯電防止ができなくな
り、また、内部に積層することもできるが、塩化ビニリ
デンは、熱に弱く、温度が上がると、防湿性能が低下す
る。また、電子機器製品とその部品は、塩素系のガスを
発生する物質を避けなければならない。これは、もし加
熱、燃焼などにより塩素系のガスが発生した場合、これ
らの製品を不良品にするばかりか、また人体に対しても
有害であるからである。このように、塩素ガスの発生
は、重大な公害の問題が生じる。脱酸素剤を封入する方
法は、前述のように、もともと従来品の透湿度が精々
５．０ｇ／ｍ2２４ｈｒｓであってこの方法も実効が上
がらない。For degassing the inside of the packaging bag 10, the conventional product has a water vapor transmission rate of at most 5.0 g / m 2 24 hrs. To increase the water vapor transmission rate and oxygen permeability beyond that, a vinylidene chloride resin is used. It was necessary to use a resin with high humidity resistance such as. However, when vinylidene chloride is coated on the surface, an insulating layer is formed and it becomes impossible to prevent static electricity, and it can be laminated inside, but vinylidene chloride is weak against heat and its moisture resistance decreases when the temperature rises. To do. Also, electronic equipment products and their parts must avoid substances that generate chlorine-based gas. This is because if a chlorine-based gas is generated due to heating or burning, these products will not only be defective, but also harmful to the human body. Thus, the generation of chlorine gas poses a serious pollution problem. As described above, the method of enclosing the oxygen scavenger originally has a moisture permeability of 5.0 g / m 2 24 hrs in the conventional product, and this method is not effective.
【０００６】本発明は、簡単な構成により、電気的特性
の面の保護のみならず、空気、酸素、有害ガスなどによ
る悪影響も防止できる隔膜としても高い特性（ハイバリ
アー性）を有するものを得ることを目的とするものであ
る。According to the present invention, it is possible to obtain a diaphragm having a high characteristic (high barrier property) not only for protection of electric characteristics but also for preventing a bad influence due to air, oxygen, harmful gas, etc. with a simple structure. The purpose is that.
【０００７】[0007]
【課題を解決するための手段】本発明は、ベースフィル
ムの絶縁層１３と、帯電防止剤入りのシーラント層１４
と、シリコン系の無機物層１５とを具備してなることを
特徴とする電子機器の保護用包袋である。なお、シリコ
ン系の無機物層１５が導電性を有しない場合には、導電
層１２を付加する。According to the present invention, an insulating layer 13 of a base film and a sealant layer 14 containing an antistatic agent are provided.
And a silicon-based inorganic layer 15 for protecting an electronic device. When the silicon-based inorganic layer 15 does not have conductivity, the conductive layer 12 is added.
【０００８】[0008]
【作用】シリコン系の無機物層を形成することによっ
て、ハイバリアー性を有するので、電気的な面からの保
護のみならず、酸素や湿度から電気機器を保護し、しか
も透明度を損なわず、かつ無公害で安定性の高い包袋を
得ることができる。[Function] By forming a silicon-based inorganic material layer, it has a high barrier property, so it not only protects it from the electrical side, but also protects electrical equipment from oxygen and humidity, and does not impair transparency. It is possible to obtain a packaging bag that is polluted and highly stable.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面に基づき説明す
る。第１実施例を示す図１において、ポリエステルなど
のベースフィルムとしての絶縁層１３と、帯電防止剤入
りのポリオレフィンのシーラント層１４と、金属を蒸着
した導電層１２と、ポリエステル、ポリオレフィンなど
の樹脂からなる保護層１１とは、従来の図７に示すもの
と変わるところはない。本発明の特徴とするのは、前記
導電層１２と絶縁層１３の間にＳｉＯｘからなるシリコ
ン系の無機物層１５を蒸着、コーティングなどにより形
成したことである。このシリコン系の無機物層１５を、
導電層１２と絶縁層１３の間に形成したのは、外面２２
または内面２３に露出しないことが望ましいためであ
る。その意味では、このシリコン系の無機物層１５は、
図２に示すように、保護層１１と導電層１２の間でもよ
いし、また、図３に示すように、絶縁層１３とシーラン
ト層１４の間でもよい。Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1 showing the first embodiment, an insulating layer 13 as a base film such as polyester, a polyolefin sealant layer 14 containing an antistatic agent, a metal-deposited conductive layer 12, and a resin such as polyester or polyolefin are used. The protective layer 11 formed is no different from that shown in FIG. A feature of the present invention is that a silicon-based inorganic layer 15 made of SiOx is formed between the conductive layer 12 and the insulating layer 13 by vapor deposition, coating, or the like. This silicon-based inorganic layer 15 is
The outer surface 22 is formed between the conductive layer 12 and the insulating layer 13.
Alternatively, it is desirable that it is not exposed to the inner surface 23. In that sense, the silicon-based inorganic layer 15 is
It may be between the protective layer 11 and the conductive layer 12 as shown in FIG. 2, or may be between the insulating layer 13 and the sealant layer 14 as shown in FIG.
【００１０】前記保護層１１が帯電防止剤入りである場
合には、導電層１２を省略することができる。この場合
には、シリコン系の無機物層１５は、図４に示すよう
に、保護層１１と絶縁層１３の間に形成することがで
き、また、図５に示すように、絶縁層１３とシーラント
層１４の間に形成することもできる。When the protective layer 11 contains an antistatic agent, the conductive layer 12 can be omitted. In this case, the silicon-based inorganic layer 15 can be formed between the protective layer 11 and the insulating layer 13 as shown in FIG. 4, and the insulating layer 13 and the sealant as shown in FIG. It can also be formed between layers 14.
【００１１】前記シリコン系の無機物層１５は、含有す
る不純物の量を変えることによって電気抵抗率を変える
ことができる。したがって、図６に示すように、保護層
１１と導電層１２を省いて外面２２側にシリコン系の無
機物層１５を形成することによって、このシリコン系の
無機物層１５は、ハイバリアー性としてのみならず、帯
電防止層としても機能する。The electrical resistivity of the silicon-based inorganic layer 15 can be changed by changing the amount of impurities contained therein. Therefore, as shown in FIG. 6, by omitting the protective layer 11 and the conductive layer 12 and forming the silicon-based inorganic material layer 15 on the outer surface 22 side, the silicon-based inorganic material layer 15 has only a high barrier property. Instead, it also functions as an antistatic layer.
【００１２】[0012]
【発明の効果】本発明は、ベースフィルムの絶縁層１３
と、帯電防止剤入りのシーラント層１４と、シリコン系
の無機物層１５とを形成したので、ハイバリアー性を有
することとなり、ＩＣ、ＭＯＳ型ＩＣなどの電子部品や
これらの電子部品を実装した電子機器を、静電気から保
護するだけでなく、空気、酸素、有害ガスなどによる酸
化、腐食などからも保護し、しかも透明度を損なわず、
かつ無公害で安定性の高い包袋を得ることができる。According to the present invention, the insulating layer 13 of the base film is used.
Since the sealant layer 14 containing the antistatic agent and the silicon-based inorganic layer 15 are formed, it has a high barrier property, and electronic components such as ICs and MOS type ICs and electronic components mounted with these electronic components are provided. It not only protects equipment from static electricity, but also protects it from oxidation, corrosion, etc. by air, oxygen, harmful gases, etc., and does not impair transparency.
In addition, it is possible to obtain a packaging bag which is pollution-free and has high stability.
【００１３】ちなみに、図１に示した本発明品と図７に
示した従来品との物性の比較値は、つぎのとおりであっ
た。 項 目 単 位 測 定 法 本発明品 従来品 表面抵抗値(外面) Ω ＪＩＳ−Ｋ−６９１１ １０8 １０8 表面抵抗値(内面) Ω ＪＩＳ−Ｋ−６９１１ １０12 １０12 厚 さ μｍ ＪＩＳ−Ｃ−２３１８ ８５ ９０ 光線透過率 ％ ＪＩＳ−Ｋ−６７１４ ４３ ４０ 透湿度 ｇ／ｍ2２４ｈｒｓ ＪＩＳ−Ｚ−０２０８ ０．８ ５．０ 酸素透過度 ｃｃ／ｍ2２４ｈｒｓ ＪＩＳ−Ｚ−７１２６Ｂ ０．７ ４．８ ヒートシール強度 Ｋｇ／１５ｍｍ ３．２ ３．０ なお、ヒートシール強度とは、ヒートシール部２１にお
ける幅１５ｍｍの剥離強度である。以上の物性を比較し
て、本発明品（図１）と従来品（図７）とで、特に著し
く異なるのは、透湿度が約６倍、酸素透過度が約７倍も
の向上をしている点である。その他の特性には両者は、
ほとんど違いが見当らない。したがって、空気、酸素、
有害ガスなどによる酸化、腐食などからも保護し、しか
も透明度を損なわず、かつ無公害で安定性の高い包袋を
得ることができることが実証された。By the way, the comparison values of the physical properties of the product of the present invention shown in FIG. 1 and the conventional product shown in FIG. 7 are as follows. Item Unit measurement method Invention product Conventional product Surface resistance value (outer surface) Ω JIS-K-6911 10 8 10 8 Surface resistance value (inner surface) Ω JIS-K-6911 10 12 10 12 Thickness μm JIS-C -2318 85 90 light transmittance% JIS-K-6714 43 40 moisture permeability g / m 2 24hrs JIS-Z -0208 0.8 5.0 oxygen permeability cc / m 2 24hrs JIS-Z -7126B 0.7 4 .8 Heat seal strength Kg / 15 mm 3.2 3.0 The heat seal strength is the peel strength of the heat seal portion 21 having a width of 15 mm. Comparing the above physical properties, the product of the present invention (FIG. 1) and the conventional product (FIG. 7) are remarkably different from each other in that the water vapor permeability is improved by about 6 times and the oxygen permeability is improved by about 7 times. That is the point. The other characteristics are
Almost no difference is found. Therefore, air, oxygen,
It was demonstrated that it is possible to obtain a packaging bag that protects against oxidation and corrosion due to harmful gases, does not impair transparency, is pollution-free, and has high stability.
【図１】本発明による電子機器の保護用包袋の第１実施
例の断面図である。FIG. 1 is a sectional view of a first embodiment of a protective packaging for electronic equipment according to the present invention.
【図２】本発明による電子機器の保護用包袋の第２実施
例の断面図である。FIG. 2 is a cross-sectional view of a second embodiment of a protective packaging for electronic equipment according to the present invention.
【図３】本発明による電子機器の保護用包袋の第３実施
例の断面図である。FIG. 3 is a sectional view of a third embodiment of the protective packaging for electronic equipment according to the present invention.
【図４】本発明による電子機器の保護用包袋の第４実施
例の断面図である。FIG. 4 is a cross-sectional view of a fourth embodiment of a protective packaging bag for electronic equipment according to the present invention.
【図５】本発明による電子機器の保護用包袋の第５実施
例の断面図である。FIG. 5 is a sectional view of a fifth embodiment of a protective packaging bag for electronic equipment according to the present invention.
【図６】本発明による電子機器の保護用包袋の第６実施
例の断面図である。FIG. 6 is a cross-sectional view of a sixth embodiment of a protective packaging for electronic equipment according to the present invention.
【図７】従来の電子機器保護用包袋の断面図である。FIG. 7 is a cross-sectional view of a conventional electronic device protection packaging bag.
【図８】従来の他の電子機器保護用包袋の断面図であ
る。FIG. 8 is a cross-sectional view of another conventional electronic device protection packaging bag.
【図９】従来の他の電子機器保護用包袋の断面図であ
る。FIG. 9 is a cross-sectional view of another conventional electronic device protection packaging bag.
【図１０】従来の他の電子機器保護用包袋の断面図であ
る。FIG. 10 is a cross-sectional view of another conventional electronic device protection packaging bag.
１０…包袋、１１…保護層、１２…導電層、１３…絶縁
層、１４…シーラント層、１５…シリコン系の無機物
層、２０…電子機器、２１…ヒートシール部、２２…外
面、２３…内面。DESCRIPTION OF SYMBOLS 10 ... Packaging bag, 11 ... Protective layer, 12 ... Conductive layer, 13 ... Insulating layer, 14 ... Sealant layer, 15 ... Silicon inorganic layer, 20 ... Electronic device, 21 ... Heat seal part, 22 ... Outer surface, 23 ... Inside.
Claims (7)
止剤入りのシーラント層１４と、シリコン系の無機物層
１５とを具備してなることを特徴とする電子機器の保護
用包袋。1. A protective envelope for an electronic device, comprising an insulating layer 13 of a base film, a sealant layer 14 containing an antistatic agent, and a silicon-based inorganic layer 15.
無機物層１５、絶縁層１３、シーラント層１４の順序で
積層してなる請求項１記載の電子機器の保護用包袋。2. The protective packaging for an electronic device according to claim 1, wherein the protective layer 11, the conductive layer 12, the silicon-based inorganic layer 15, the insulating layer 13, and the sealant layer 14 are laminated in this order.
５、導電層１２、絶縁層１３、シーラント層１４の順序
で積層してなる請求項１記載の電子機器の保護用包袋。3. A protective layer 11, a silicon-based inorganic layer 1
The protective packaging bag for an electronic device according to claim 1, which is formed by stacking 5, a conductive layer 12, an insulating layer 13, and a sealant layer 14 in this order.
シリコン系の無機物層１５、シーラント層１４の順序で
積層してなる請求項１記載の電子機器の保護用包袋。4. A protective layer 11, a conductive layer 12, an insulating layer 13,
The protective packaging bag for an electronic device according to claim 1, wherein the silicone-based inorganic layer 15 and the sealant layer 14 are laminated in this order.
５、絶縁層１３、シーラント層１４の順序で積層してな
る請求項１記載の電子機器の保護用包袋。5. A protective layer 11 and a silicon-based inorganic layer 1
The protective packaging bag for an electronic device according to claim 1, which is formed by stacking 5, an insulating layer 13, and a sealant layer 14 in this order.
無機物層１５、シーラント層１４の順序で積層してなる
請求項１記載の電子機器の保護用包袋。6. The protective packaging bag for an electronic device according to claim 1, wherein the protective layer 11, the insulating layer 13, the silicon-based inorganic layer 15, and the sealant layer 14 are laminated in this order.
３、シーラント層１４の順序で積層してなる請求項１記
載の電子機器の保護用包袋。7. A silicon-based inorganic layer 15 and an insulating layer 1
3. The protective packaging bag for an electronic device according to claim 1, wherein the sealant layer 14 and the sealant layer 14 are laminated in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159851A JPH05178384A (en) | 1991-06-05 | 1991-06-05 | Bag for protecting electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159851A JPH05178384A (en) | 1991-06-05 | 1991-06-05 | Bag for protecting electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05178384A true JPH05178384A (en) | 1993-07-20 |
Family
ID=15702623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3159851A Pending JPH05178384A (en) | 1991-06-05 | 1991-06-05 | Bag for protecting electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05178384A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11253809B2 (en) | 2014-01-23 | 2022-02-22 | Stasis Lmps Limited | Flexible panel and sealable bag with sorbent |
-
1991
- 1991-06-05 JP JP3159851A patent/JPH05178384A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11253809B2 (en) | 2014-01-23 | 2022-02-22 | Stasis Lmps Limited | Flexible panel and sealable bag with sorbent |
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