JPH05198714A - Electronic device cooling structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To make it possible to sufficiently cool the heat source even under severe conditions associated with higher performance and smaller size of electronic equipment. [Structure] Heat generated from a semiconductor chip 4 which is a heat source is first conducted from a heat conductive silicon rubber 13 to a metal cover 8, and thereafter, a heat pipe excellent in heat conductivity from the metal cover 8. It is propagated to the heat radiation space 7 by 9 and is radiated through the heat radiation fin 10. Therefore,
While the amount of heat generated increases as the performance of the semiconductor chip 4 that is a heat source increases, it is possible to perform sufficient cooling even in an environment in which the space around the semiconductor chip 4 cannot be made large due to miniaturization. Become.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for cooling a heat source of electronic equipment.

[0002]

2. Description of the Related Art In conventional electronic devices such as electronic calculators,
As shown in FIG. 4, the heat radiation fan 52 causes the air inside the housing 53 to flow in the direction of the arrow to cool the semiconductor chip 51 (heat source) that constitutes the microprocessor or the like mounted on the circuit board 50. ing. In addition,
Cooling fins 54 are attached to the upper surface of the semiconductor chip 51 to improve the efficiency of air cooling.

[0003]

By the way, in recent years,
Along with the ever-increasing demand for higher functionality and higher speed of the semiconductor chip 51, which is a heat source, its power consumption (heat generation amount) tends to increase. On the other hand, the space for accommodating the circuit elements tends to be reduced with the demand for miniaturization.

As the performance and size of the semiconductor device have been improved, it is expected that the conventional cooling structure will deteriorate the air flow, resulting in insufficient cooling and the vicinity of the semiconductor chip 51 which is a heat source. The circuit elements of are likely to be adversely affected.

The present invention was devised to solve such a problem, and is to make it possible to sufficiently cool a heat source even under severe conditions associated with higher performance and smaller size of electronic equipment. With the goal.

[0006]

In order to achieve such an object, the present invention has the following constitution.

In the cooling structure for electronic equipment of the present invention, the heat source provided in the electronic equipment is covered with the metal cover, and one end of the drawer member having excellent thermal conductivity is connected to the metal cover.
It is characterized in that the other end of the drawer member is inserted into a heat radiation space provided at an appropriate location inside the electronic device.

[0008]

According to the structure of the present invention, the heat generated from the heat source of the electronic device is propagated to the heat radiating space secured inside the electronic device by the metal cover and the extraction member having excellent thermal conductivity, and in this heat radiating space. A suitable method such as a conventional air cooling method can be used for efficient cooling.

That is, the present invention does not try to cool the heat generated from the heat source at the position where the heat source exists, but the heat generated from the heat source is not changed by using the metal cover and the drawing member. The heat is dissipated by moving it to a heat dissipation space that is easy to cool. For this reason, while the amount of heat generated increases as the performance of the heat source increases, it becomes possible to perform sufficient cooling even in an environment in which the space around the heat source cannot be made large due to the size reduction. Further, since the heat source hardly dissipates heat to the periphery thereof, there is no thermal adverse effect on the elements around the heat source.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings.

1 and 2 show an embodiment of the present invention. In the figure, 1 is an electronic device, 2 is a circuit board, 3 is a housing, 4 is a semiconductor chip as a heat source, 5 is another semiconductor chip that does not generate heat, 6 is a partition plate, 7 is a heat radiation space,
Reference numeral 8 is a metal cover, 9 is a heat pipe as a drawing member, 10 is a radiation fin, and 11 is a radiation fan.

Inside the electronic device 1, in addition to an element housing space in which various semiconductor chips 4, 5 and the like are arranged, a heat dissipation space 7 in which a heat dissipation fan 11 and a heat dissipation fin 10 of a heat pipe 9 are accommodated is provided. Has been. The element housing space and the heat radiation space 7 are separated by a partition plate 6, and a vent hole 12 that communicates the inside and the outside of the housing 3 is provided on one side wall surface of the housing 3 forming the heat radiation space 7.

The semiconductor chip 4, which is a heat source, is covered with a metal cover 8, and a heat conductive silicon rubber 1 is provided between the semiconductor chip 4 and the metal cover 8.
3, the heat generated from the semiconductor chip 4 is efficiently conducted to the metal cover 8.

As the heat pipe 9, for example, one having a structure in which an appropriate liquid is enclosed in an aluminum pipe, such as one having a rapid thermal conduction, is selected. Two heat pipes 9 are used in a state of being parallel to each other in the lateral direction, one end of each heat pipe is adhered to the ceiling surface of the metal cover 8 described above, and the other end of the heat pipe 9 is It penetrates through the partition plate 6 and is inserted into the heat dissipation space 7. A plurality of square plate-shaped heat radiation fins 10 are penetratingly attached to the other ends of the two heat pipes 9 inserted into the heat radiation space 7.

When such an electronic device 1 is driven, the semiconductor chip 4 will generate heat. The heat generated from the semiconductor chip 4 is first of all the heat conductive silicon rubber 1.
3 is conducted to the metal cover 8, and thereafter, is propagated from the metal cover 8 to the heat radiation space 7 by the heat pipe 9 having excellent heat conductivity and is radiated through the heat radiation fins 10. The hot air trapped in the heat radiation space 7 is discharged to the outside of the housing 3 from the ventilation hole 12 by operating the heat radiation fan 11.

The present invention is not limited to the above embodiment, but includes the following. For example, instead of the heat conductive silicone rubber 13 described above, FIGS.
As shown in, a metal screw bolt 13a, a metal coil spring 13b, a metal Z-shaped leaf spring 13c, or the like may be used. However, when the heat conductive silicon rubber 13 is used, it is elastically deformed into a shape according to the outer shape of the semiconductor chip 4 simply by pressing it against the semiconductor chip 4 as a heat source, so that the contact area with the element surface is minimized. It can be taken big. And each of these heat conductive parts (13, 1
Those not using 3a to 13c) are also included in the present invention.

[0017]

As described above, according to the present invention, the heat generated from the heat source is not intended to be cooled at the position where the heat source exists, but the metal cover and the drawing member are used to prevent the heat from the heat source. The heat source is cooled by moving the generated heat to the heat radiation space to radiate the heat. Therefore, according to the present invention, while the heat generation amount increases as the performance of the heat source increases, sufficient cooling is performed even in an environment in which the space around the heat source cannot be made large due to the size reduction. Will be able to.
Further, since heat is hardly radiated to the periphery of the heat source, there is no thermal adverse effect on the elements around the heat source, and the reliability of these peripheral elements can be secured.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing a cooling structure for an electronic device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line (2)-(2) of FIG.

FIG. 3 is a vertical cross-sectional view showing another example of the heat conducting component between the semiconductor chip and the metal cover.

FIG. 4 is a conceptual diagram showing a conventional cooling structure for an electronic device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic equipment 3 Housing 4 Semiconductor chip as a heat source 7 Radiating space 8 Metal cover 9 Heat pipe 10 Radiating fin 11 Radiating fan

Claims (1)

[Claims] 1. A heat source provided in an electronic device is covered with a metal cover, one end of a drawer member having excellent thermal conductivity is connected to the metal cover, and the other end of the draw member is connected to the electronic device. A cooling structure for electronic equipment, characterized in that the cooling structure is inserted into a heat dissipation space provided at an appropriate place inside.